专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20080221775A1 MULTI-CYLINDER ENGINE 失效
标题翻译：多缸发动机
公开(公告)号：US20080221775A1
公开(公告)日：2008-09-11
申请号：US11854568
申请日：2007-09-13
申请人： Takeshi KAWASAKI , Yutaka TERUUMI , Koji FUJIMURA , Hiroshi INOUE , Tetsushi KARASAWA , Seiji IZUHARA
发明人： Takeshi KAWASAKI , Yutaka TERUUMI , Koji FUJIMURA , Hiroshi INOUE , Tetsushi KARASAWA , Seiji IZUHARA
IPC分类号： F02D41/00
CPC分类号： F02D41/32 , F02D41/008 , F02M35/10085 , F02M35/10216 , F02M35/112 , F02M69/044 , F02P5/1512 , Y02T10/46
摘要： The present invention concerns a multi-cylinder engine comprising a throttle body (5) in which a throttle intake-air passage (6) is provided. A throttle valve (7) is arranged in this throttle intake-air passage (6). Attached to the throttle body (5) is an injector (8), a leading end portion (9) of which is arranged opposite to an interior area of the throttle intake-air passage (6) downstream of the throttle valve (7) and is opened to provided a liquid-fuel injection hole (10). An intake-air pressure sensor (15) is attached to the throttle body (5) together with the injector (8) and an intake-air pressure introduction passage (18) has an inlet (18a) provided by opening an inner peripheral surface of the throttle intake-air passage (6) upstream of the injector (8).
摘要翻译：本发明涉及一种包括节气门体（5）的多气缸发动机，其中设有节气门进气通道（6）。节流阀（7）布置在该节气门进气通道（6）中。连接到节气门体（5）的喷射器（8），其前端部（9）与节流阀（7）下游的节气门进气通道（6）的内部区域相对设置，打开以设置液体燃料喷射孔（10）。进气压力传感器（15）与喷射器（8）一起安装在节气门体（5）上，进气压力引入通道（18）具有通过打开内周面位于喷油器（8）上游的节气门进气通道（6）。

32. 发明申请

US20080218554A1 LIQUID EJECTION APPARATUS AND LIQUID EJECTION SURFACE MAINTENANCE METHOD 审中-公开
标题翻译：液体喷射装置和液体喷射表面维护方法
公开(公告)号：US20080218554A1
公开(公告)日：2008-09-11
申请号：US12043693
申请日：2008-03-06
申请人： Hiroshi INOUE
发明人： Hiroshi INOUE
IPC分类号： B41J2/165 , B41J29/38
CPC分类号： B41J2/17596 , B41J2/16526 , B41J2/16535 , B41J2/16585 , B41J2/175 , B41J2/2114 , B41J29/38 , B41J29/393
摘要： A liquid ejection apparatus includes: a liquid ejection head which includes a nozzle ejecting liquid, a pressure chamber connected to the nozzle and arranged in a liquid ejection surface of the liquid ejection head, and a pressure application device applying pressure to the liquid inside the pressure chamber; an internal pressure adjustment device which adjusts an internal pressure of the liquid ejection head; and a pressure control device which controls the internal pressure adjustment device and the pressure application device so as to spread the liquid over the liquid ejection surface of the liquid ejection head. The internal pressure adjustment device adjusts the internal pressure of the liquid ejection head to a positive pressure so as to still hold the liquid on the nozzle while protruding the liquid from the liquid ejection surface. The pressure application device then applies the pressure to the liquid inside the pressure chamber for a pressure application duration so as not to cause the liquid to be ejected from the nozzle but to flow out the liquid from the nozzle onto the liquid ejection surface, while the internal pressure adjustment device is adjusting the internal pressure to the positive pressure. The pressure application device then stops applying the pressure to the liquid inside the pressure chamber after the pressure application duration, while the internal pressure adjustment device is adjusting the internal pressure to the positive pressure.
摘要翻译：液体喷射装置包括：液体喷射头，其包括喷嘴喷射液体，连接到喷嘴并且布置在液体喷射头的液体喷射表面中的压力室，以及在压力下向液体施加压力的压力施加装置房间内部压力调节装置，其调节所述液体喷射头的内部压力; 以及压力控制装置，其控制内部压力调节装置和压力施加装置，以便将液体扩散到液体喷射头的液体喷射表面上。内部压力调节装置将液体喷射头的内部压力调节到正压力，以便在从液体喷射表面突出液体的同时将液体保持在喷嘴上。压力施加装置然后将压力施加到压力室内的液体的压力施加持续时间，以便不使液体从喷嘴喷射，而是将液体从喷嘴流出到液体喷射表面上，同时内部压力调节装置正在将内部压力调节到正压力。然后，压力施加装置在压力施加持续时间之后停止对压力室内的液体施加压力，同时内部压力调节装置将内部压力调节为正压力。

33. 发明申请

US20150332937A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACKED MODULE STRUCTURE AND METHOD OF MANUFACTURING SAME 审中-公开
标题翻译：半导体器件，半导体堆叠模块结构，堆叠模块结构及其制造方法
公开(公告)号：US20150332937A1
公开(公告)日：2015-11-19
申请号：US14807193
申请日：2015-07-23
申请人： Hiroshi INOUE , Akio KATSUMATA , Shigenori SAWACHI , Osamu YAMAGATA
发明人： Hiroshi INOUE , Akio KATSUMATA , Shigenori SAWACHI , Osamu YAMAGATA
IPC分类号： H01L21/48 , H01L23/00 , H01L21/82
CPC分类号： H01L21/486 , H01L21/4853 , H01L21/4857 , H01L21/82 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2224/83 , H01L2224/82 , H01L2924/00012 , H01L2924/00
摘要： A method of manufacturing a semiconductor device having an insulating substrate, a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards, a first insulating material layer (A) which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto, a first metal thin film wire layer provided on the first insulating material layer (A) and a portion of which is exposed to an external surface, a first insulating material layer (B) provided on the first metal thin film wire layer, a second insulating material layer provided on a main surface of the insulating substrate where the semiconductor element is not mounted, a second metal thin film wire layer provided inside the second insulating material layer.
摘要翻译：一种制造具有绝缘基板的半导体器件的方法，半导体元件，其通过粘合剂安装在绝缘基板的一个主表面上，半导体元件的元件电路表面朝上，第一绝缘材料层（A），其密封半导体元件的元件电路表面和周围的绝缘基板，设置在第一绝缘材料层（A）上并且其一部分暴露于外表面的第一金属薄膜线层，第一绝缘材料层（B），设置在绝缘基板的未安装半导体元件的主表面上的第二绝缘材料层，设置在第二绝缘材料层内部的第二金属薄膜线层。

34. 发明申请

US20150243632A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACKED MODULE STRUCTURE AND METHOD OF MANUFACTURING SAME 有权
标题翻译：半导体器件，半导体堆叠模块结构，堆叠模块结构及其制造方法
公开(公告)号：US20150243632A1
公开(公告)日：2015-08-27
申请号：US14190885
申请日：2014-02-26
申请人： Hiroshi INOUE , Akio KATSUMATA , Shigenori SAWACHI , Osamu YAMAGATA
发明人： Hiroshi INOUE , Akio KATSUMATA , Shigenori SAWACHI , Osamu YAMAGATA
IPC分类号： H01L25/065 , H01L25/00 , H01L21/82 , H01L23/538 , H01L23/13
CPC分类号： H01L21/486 , H01L21/4853 , H01L21/4857 , H01L21/82 , H01L23/13 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2224/83 , H01L2224/82 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor device, having an insulating substrate; a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards; a first insulating material layer which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto; a first metal thin film wire layer which is provided on the first insulating material layer (A) and a portion of which is exposed to an external surface; a first insulating material layer (B) which is provided on the first metal thin film wire layer; a second insulating material layer which is provided on a main surface of the insulating substrate where the semiconductor element is not mounted; and a second metal thin film wire layer which is provided inside the second insulating material layer.
摘要翻译：一种半导体器件，具有绝缘基板; 半导体元件，其通过粘合剂安装在绝缘基板的一个主表面上，半导体元件的元件电路表面朝上; 第一绝缘材料层，其密封半导体元件的元件电路表面和周边的绝缘基板; 第一金属薄膜线层，其设置在第一绝缘材料层（A）上并且其一部分暴露于外表面; 设置在第一金属薄膜线层上的第一绝缘材料层（B）; 第二绝缘材料层，设置在绝缘基板的未安装半导体元件的主表面上; 以及设置在第二绝缘材料层内部的第二金属薄膜线层。

35. 发明申请

US20120248235A1 STRIP-SHAPED BODY CUTTING POSITION ADJUSTMENT METHOD AND SYSTEM FOR CUTTING APPARATUS 有权
标题翻译：带状切割位置调整方法及切割装置系统
公开(公告)号：US20120248235A1
公开(公告)日：2012-10-04
申请号：US13433682
申请日：2012-03-29
申请人： Hiroshi INOUE
发明人： Hiroshi INOUE
IPC分类号： B65H35/04
CPC分类号： B41F13/60 , B26D5/34 , B26D7/2614 , B26D7/2628 , B41F33/0081 , B41P2213/90 , B65H23/1882 , B65H35/08 , B65H2511/512 , B65H2801/21 , Y10T83/54 , Y10T83/541 , Y10T83/543
摘要： A printing press control device and a cut-off register control device forcibly move a compensator roller by a set moving amount each time a set time elapses during a period from the start of speed acceleration to the end of speed acceleration.
摘要翻译：印刷机控制装置和截止寄存器控制装置在从速度加速开始到速度加速结束的时段期间，每当设定时间过去时，强制地将补偿辊移动设定移动量。

36. 发明申请

US20120236071A1 CLEANING APPARATUS AND LIQUID EJECTION APPARATUS AND CLEANING METHOD 审中-公开
标题翻译：清洁装置和液体喷射装置和清洁方法
公开(公告)号：US20120236071A1
公开(公告)日：2012-09-20
申请号：US13484659
申请日：2012-05-31
申请人： Hiroshi INOUE
发明人： Hiroshi INOUE
IPC分类号： B41J2/165
CPC分类号： B41J2/16552 , B41J2/16585 , B41J2202/21
摘要： The cleaning apparatus cleans a nozzle surface of a liquid ejection head. The cleaning apparatus includes: a cleaning liquid supply device which supplies cleaning liquid to the nozzle surface while being not in contact with the nozzle surface; a liquid layer formation control device which causes the cleaning liquid supply device to supply a prescribed amount of the cleaning liquid to form a layer of the cleaning liquid that fills in a space between the cleaning liquid supply device and the nozzle surface; and a movement control device which controls a movement device so as to move the cleaning liquid supply device and the liquid ejection head relatively to each other at a relative speed in which a meniscus is not broken down, the meniscus being of the layer of the cleaning liquid in a portion of the layer of the cleaning liquid that makes contact with the nozzle surface.
摘要翻译：清洁装置清洗液体喷射头的喷嘴表面。清洁装置包括：清洗液供给装置，其在不与喷嘴表面接触的同时向喷嘴表面供给清洗液; 液面形成控制装置，其使清洗液供给装置供给规定量的清洗液，形成填充在清洗液供给装置与喷嘴面之间的空间的清洗液层; 以及移动控制装置，其控制移动装置，以使所述清洁液供给装置和所述液体喷射头相对于彼此以弯液面不分解的相对速度移动，所述弯液面为所述清洁层在与喷嘴表面接触的清洁液体层的一部分中的液体。

37. 发明申请

US20110262316A1 METHOD AND MOLECULAR DIAGNOSTIC DEVICE FOR DETECTION, ANALYSIS AND IDENTIFICATION OF GENOMIC DNA 审中-公开
标题翻译：用于检测，分析和鉴定基因组DNA的方法和分子诊断装置
公开(公告)号：US20110262316A1
公开(公告)日：2011-10-27
申请号：US13073318
申请日：2011-03-28
申请人： Hiroshi INOUE , Ivor T. Knight , Gregory A. Dale , Rita R. Colwell
发明人： Hiroshi INOUE , Ivor T. Knight , Gregory A. Dale , Rita R. Colwell
IPC分类号： B01D21/00
CPC分类号： B01L3/0268 , B01L3/502715 , B01L3/50273 , B01L3/502761 , B01L3/502784 , B01L7/525 , B01L7/54 , B01L2200/027 , B01L2200/0631 , B01L2200/0663 , B01L2200/0673 , B01L2200/10 , B01L2300/0864 , B01L2300/1833 , B01L2300/1838 , B01L2400/0406 , B01L2400/0415 , B01L2400/0442 , B01L2400/0487 , C12Q2565/629 , G01N21/0303 , G01N35/0098 , G01N2035/00158
摘要： At least one exemplary embodiment of the invention is directed to a molecular diagnostic device that comprises a cartridge configured to eject samples comprising genomic material into a microfluidic chip that comprises an amplification area, a detection area, and a matrix analysis area.
摘要翻译：本发明的至少一个示例性实施例涉及一种分子诊断装置，其包括被配置为将包含基因组材料的样品排出到包括放大区域，检测区域和矩阵分析区域的微流体芯片中的盒。

38. 发明申请

US20110081262A1 MOTOR-DIRECTLY CONNECTED COMPRESSOR UNIT 审中-公开
标题翻译：电机直连压缩机单元
公开(公告)号：US20110081262A1
公开(公告)日：2011-04-07
申请号：US12889041
申请日：2010-09-23
申请人： Hiroshi INOUE , Toru SATO , Yohei SHIRATORI
发明人： Hiroshi INOUE , Toru SATO , Yohei SHIRATORI
IPC分类号： F01C21/06 , F01C1/02
CPC分类号： F04C18/0215 , F04C23/00 , F04C29/04
摘要： To provide a motor-directly connected compressor unit which is equipped with a cooling means for suppressing the heating of the compressor and is easy to transfer without upsizing the compressor unit in size or weight, the compressor unit is configured such that a sirocco fan 30 is arranged between a scroll compressor 20 and a drive motor 60 located under the sirocco fan 30; an output shaft 62 of the drive motor 60, a drive shaft 33 of the sirocco fan 30 and a rotation shaft 28 of the scroll compressor 20 are linearly connected in the same straight line; a housing 32 of the sirocco fan 30 is fixed on a mount 50 which is supported on legs 54 via anti-vibration rubber pads 52; a cooling jacket is arranged to cover a top of a housing 21 of the scroll compressor 20; and an air outlet 31 arranged in the housing 32 of the sirocco fan 30 is in communication with a cooling jacket 40 via a duct 44 so as to feed air a from the sirocco fan 30 to the cooling jacket 40, thereby cooling the scroll compressor.
摘要翻译：为了提供一种电动机直接连接的压缩机单元，其配备有用于抑制压缩机的加热的冷却装置，并且在尺寸或重量不增加压缩机单元的情况下容易传送，压缩机单元被配置为使得西洛克风扇30为布置在涡旋压缩机20和位于西洛克风扇30下方的驱动马达60之间; 驱动马达60的输出轴62，西洛克风扇30的驱动轴33和涡旋压缩机20的旋转轴28以相同的直线线性连接; 西洛克风扇30的壳体32固定在安装件50上，该安装件通过防振橡胶垫52支撑在腿部54上; 冷却套被布置成覆盖涡旋压缩机20的壳体21的顶部; 并且设置在西洛克风扇30的壳体32中的出气口31经由管道44与冷却套40连通，从而将空气a从西洛克风扇30供给到冷却套40，由此冷却涡旋压缩机。

39. 发明申请

US20100245466A1 HEAD CLEANING METHOD AND HEAD CLEANING APPARATUS 有权
标题翻译：头部清洁方法和头部清洁装置
公开(公告)号：US20100245466A1
公开(公告)日：2010-09-30
申请号：US12750345
申请日：2010-03-30
申请人： Hiroshi INOUE
发明人： Hiroshi INOUE
IPC分类号： B41J2/165
CPC分类号： B41J2/16535 , B41J2/16585 , B41J2202/21
摘要： A head cleaning method of wiping and cleaning a nozzle surface of a head with a band-shaped liquid absorbing body by, while pressing and abutting a pressing member on which the liquid absorbing body that travels is wrapped against the nozzle surface of the head, sliding the pressing member over the nozzle surface of the head, includes: a first cleaning step of wiping and cleaning the nozzle surface of the head with a non-wet region of the liquid absorbing body; a wet region forming step of forming a wet region on the liquid absorbing body; and a second cleaning step of wiping and cleaning the nozzle surface of the head with the wet region of the liquid absorbing body.
摘要翻译：一种用带状液体吸收体擦拭和清洁头部的喷嘴表面的头部清洁方法，其中，当压入和抵接行进的液体吸收体被包裹在头部的喷嘴表面上的挤压部件滑动时，所述按压部件在所述头部的喷嘴表面上方包括：第一清洁步骤，用所述液体吸收体的非湿润区域擦拭和清洁所述头部的喷嘴表面; 在液体吸收体上形成湿区域的湿区域形成步骤; 以及第二清洗步骤，其与液体吸收体的湿区域一起擦拭和清洁头部的喷嘴表面。

40. 发明申请

US20090237435A1 DROPLET EJECTION HEAD CONTROL DEVICE AND CONTROL METHOD, AND PROGRAM STORAGE MEDIUM 失效
标题翻译： DROPLET喷射头控制装置和控制方法以及程序存储介质
公开(公告)号：US20090237435A1
公开(公告)日：2009-09-24
申请号：US12397963
申请日：2009-03-04
申请人： Hiroshi INOUE
发明人： Hiroshi INOUE
IPC分类号： B41J29/38
CPC分类号： B41J2/175 , B41J2/125 , B41J2/16579
摘要： A droplet ejection head control device includes a pressure alteration section, a detector and a controller. The droplet ejection head is provided with plural nozzles and is supplied with a liquid. The pressure alteration section alters a pressure inside the droplet ejection head. The detector detects a position of a boundary of liquid which is exuded onto a nozzle face from at least one nozzle of the droplet ejection head in accordance with the pressurization at the inside of the droplet ejection head. After the pressurization of the interior of the droplet ejection head commences, the controller controls the pressure alteration section on the basis of detection results from the detector such that the pressurization is stopped just (immediately) before respective boundaries of the liquid exuded onto the nozzle face from neighboring nozzles come into contact.
摘要翻译：液滴喷射头控制装置包括压力改变部分，检测器和控制器。液滴喷射头设置有多个喷嘴并且被供应液体。压力改变部分改变液滴喷射头内部的压力。检测器根据液滴喷射头内部的加压，从液滴喷射头的至少一个喷嘴检测出喷射到喷嘴面上的液体边界的位置。在液滴喷射头的内部加压开始之后，控制器基于来自检测器的检测结果来控制压力变化部分，使得在渗出到喷嘴面上的液体的各个边界之前（立即）停止加压从相邻的喷嘴接触。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式