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31. 发明申请

US20060192278A1 Interface module for connecting LSI packages, and LSI-incorporating apparatus 失效
标题翻译：用于连接LSI封装的接口模块和LSI引入装置
公开(公告)号：US20060192278A1
公开(公告)日：2006-08-31
申请号：US11233175
申请日：2005-09-23
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/02
CPC分类号： G02B6/43 , H01L2924/0002 , H01L2924/00
摘要： An interface module for connecting LSI packages includes a connecting member which is to be mounted on an LSI package including an LSI chip and which includes lines to be electrically connected to the LSI package, an optoelectronic transducer which is mounted on the connecting member, which is connected to the lines of the connecting member, and which converts optical signal to electric signal or converts electric signal to optical signal, an optical waveguide which includes an optical input end and an optical output end, one of which is optically connected to the optoelectronic transducer, and a reinforcing film which is adhered to the optical waveguide, covering at least one side of the optical waveguide, and which is secured at one end to the connecting member.
摘要翻译：用于连接LSI封装的接口模块包括一个连接构件，该连接构件将被安装在包括LSI芯片的LSI封装上并且包括与LSI封装电连接的线，安装在连接构件上的光电换能器连接到连接构件的线路，并且将光信号转换为电信号或将电信号转换为光信号;光波导，其包括光输入端和光输出端，其中一个光学连接到光电换能器以及附着在光波导上的增强膜，其覆盖光波导的至少一侧，并且一端固定在连接部件上。

32. 发明申请

US20060050493A1 LSI package with interface module, transmission line package, and ribbon optical transmission line 审中-公开
标题翻译： LSI封装带有接口模块，传输线封装和带状光传输线
公开(公告)号：US20060050493A1
公开(公告)日：2006-03-09
申请号：US11205142
申请日：2005-08-17
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Chiaki Takubo
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Chiaki Takubo
IPC分类号： H05K7/10
CPC分类号： H05K1/181 , G02B6/2552 , G02B6/4201 , G02B6/4269 , G02B6/428 , G02B6/43 , H01L2924/0002 , H05K1/0239 , H05K3/301 , H05K2201/10325 , H05K2201/10522 , H05K2201/10734 , Y02P70/611 , H01L2924/00
摘要： According to an aspect of the present invention, there is provided an LSI package with an interface module including: an interposer, on which a signal processing LSI is mounted, having a mounting board connecting electrical terminal; and an interface module having a transmission line to wire a high-speed signal to the exterior and a socket connecting electrical terminal corresponding to a mounting board connecting socket, in which the interposer and the interface module have at least either loop electrodes or plate electrodes, respectively, and the interposer and the interface module are electrically connected by inductive coupling, electrostatic coupling, or combined coupling of these two couplings by at least either the loop electrodes or the plate electrodes.
摘要翻译：根据本发明的一个方面，提供了一种具有接口模块的LSI封装，包括：安装有信号处理LSI的插入器，具有连接电端子的安装板; 以及接口模块，其具有将高速信号连接到外部的传输线和连接与安装板连接插座对应的电端子的插座，其中插入器和接口模块至少具有环形电极或板电极，并且插入器和接口模块通过电感耦合，静电耦合或这两个耦合器通过至少环形电极或平板电极的组合耦合而电连接。

33. 发明申请

US20060039658A1 Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system 有权
标题翻译：光电转换头，具有接口模块的LSI封装，光电转换头的制造方法以及光互连系统
公开(公告)号：US20060039658A1
公开(公告)日：2006-02-23
申请号：US11204168
申请日：2005-08-16
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/12 , G02B6/36
CPC分类号： G02B6/25 , G02B6/255 , G02B6/4202 , G02B6/4292 , G02B6/43
摘要： In an optoelectronic conversion header, a ferrule holds an optical waveguide in a predetermined position so that an end face of the optical waveguide protrudes from an mounting surface of the ferrule. An electric wire is provided on the mounting surface of the ferrule, a optical semiconductor device is mounted on the mounting surface of the ferrule and electrically connected to the electric wire. From the end face of the optical waveguide, an optical signal is transferred in a transfer direction and the mounting surface of the ferrule is so arranged as to be deviated two degrees or more from a plane vertical to the transfer direction.
摘要翻译：在光电转换头部中，套圈将光波导保持在预定位置，使得光波导的端面从套圈的安装面突出。在套圈的安装面上设置有电线，在套圈的安装面上安装光电半导体装置，与电线电连接。从光波导的端面，沿传送方向传送光信号，并且套圈的安装表面被布置成从垂直于传送方向的平面偏离两度或更多。

34. 发明申请

US20050230795A1 LSI package provided with interface module, and transmission line header employed in the package 失效
标题翻译： LSI封装提供接口模块，并在封装中采用传输线头
公开(公告)号：US20050230795A1
公开(公告)日：2005-10-20
申请号：US11081617
申请日：2005-03-17
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/40 , G02B6/42 , H01L21/60 , H01L23/02 , H01L25/04 , H01L25/18
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4249 , G02B6/4251 , G02B6/4269 , G02B6/428 , G02B6/4284 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29386 , H01L2224/83102 , H01L2224/83851 , H01L2224/92125 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/3011 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/01022 , H01L2924/0665
摘要： An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.
摘要翻译： LSI封装包括一个传输线头，包括一个标题基座，一个由标题基座保持的传输线，以及一个安装在标题基座上的接口IC芯片，一个具有多个板连接接头的插入基片，与印刷线路板的连接; 安装在所述插入器基板上的LSI芯片; 以及插座，其具有引线端子并安装在所述插入器基板上，被配置为容纳所述传输线集管，使得所述接口IC芯片通过所述引线端子电连接到所述LSI芯片。

35. 发明申请

US20050169596A1 Holder of optical transmission lines and multi-core optical wave-guide 有权
标题翻译：光传输线和多芯光波导的支架
公开(公告)号：US20050169596A1
公开(公告)日：2005-08-04
申请号：US11014833
申请日：2004-12-20
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/43 , G02B6/36 , G02B6/42 , G02B6/00
CPC分类号： G02B6/4249 , G02B6/3644
摘要： A holder of optical transmission lines encompasses an insulating base body defined by a mounting face to mount an optical device chip, an opposing face opposing to the mounting face and side faces which connect between the mounting face and the opposing face, one of side faces is assigned as an interconnection face, and provided with through-holes penetrating between the mounting face and the opposing face so as to hold optical transmission lines, the through-holes define openings on the mounting face; electric interconnections extending from respective vicinities of the opening on the mounting face on to the interconnection face; and heat conduction passages assigned alternately with the electric interconnections, extending from the mounting face on to the interconnection face, each of the heat conduction passages is longer than the electric interconnections on the interconnection face.
摘要翻译：光传输线的保持器包括由安装面限定的绝缘基体，以安装光学器件芯片，与安装面相对的相对面和连接在安装面和相对面之间的侧面，一个侧面是被配置为互连面，并且在安装面和相对面之间设置有贯穿孔的通孔，以保持光传输线，通孔在安装面上限定开口; 电互连从安装面上的开口的各附近延伸到互连面; 以及从安装面延伸到互连面的电互连交替配置的热传导通路，每个导热通道比互连面上的电互连长。

36. 发明申请

US20050141824A1 Optical semiconductor module and method of manufacturing the same 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US20050141824A1
公开(公告)日：2005-06-30
申请号：US11012273
申请日：2004-12-16
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/43 , G02B6/38 , G02B6/42 , G02B6/36
CPC分类号： G02B6/4212 , G02B6/3867 , G02B6/4239 , G02B6/4249
摘要： In an optical semiconductor module, a transparent resin spacer is interposed between an optical guide and a semiconductor device. As a result, the optical semiconductor module is formed of the minimum required members so as to suppress the influence given by the reflected light. Also, the optical semiconductor module can be manufactured without employing the manufacturing step of a high cost.
摘要翻译：在光学半导体模块中，透明树脂隔板插入在光导和半导体器件之间。结果，光半导体模块由最小要求的部件形成，以便抑制由反射光产生的影响。此外，可以在不采用高成本的制造步骤的情况下制造光学半导体模块。

37. 发明授权

US07667982B2 LSI package with interface module and interface module 失效
标题翻译： LSI封装带接口模块和接口模块
公开(公告)号：US07667982B2
公开(公告)日：2010-02-23
申请号：US12187853
申请日：2008-08-07
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/222 , G02B6/4284 , H05K2201/09063 , H05K2201/10356 , H05K2203/167
摘要： An LSI package includes an interface module having first and second surfaces and including a wiring board having a first through hole, a driver selectively provided on the second surface, a transmission line connected to the driver, and a first terminal formed on the second surface and connected to the driver, an interposer having a third surface facing the second surface and a fourth surface, and including a signal processor and a second terminal provided on the third surface, a third terminal provided on the fourth surface and a second through hole, the third surface facing the second surface except a region where the driver portion is provided. The interposer is arranged so that the first through hole matches with the second through hole, and a movable guide pin is inserted into the first and second through holes to position the interface module and the interposer.
摘要翻译： LSI封装包括具有第一表面和第二表面的接口模块，并且包括具有第一通孔的布线板，选择性地设置在第二表面上的驱动器，连接到驱动器的传输线，以及形成在第二表面上的第一端子，连接到驱动器的插入器，具有面向第二表面的第三表面和第四表面的插入器，并且包括设置在第三表面上的信号处理器和第二端子，设置在第四表面上的第三端子和第二通孔，第三表面面对除了设置有驱动器部分的区域之外的第二表面。插入器布置成使得第一通孔与第二通孔匹配，并且可移动引导销插入到第一和第二通孔中以定位接口模块和插入器。

38. 发明授权

US07411282B2 LSI package provided with interface module, and transmission line header employed in the package 失效
标题翻译： LSI封装提供接口模块，并在封装中采用传输线头
公开(公告)号：US07411282B2
公开(公告)日：2008-08-12
申请号：US11081617
申请日：2005-03-17
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/02
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4249 , G02B6/4251 , G02B6/4269 , G02B6/428 , G02B6/4284 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29386 , H01L2224/83102 , H01L2224/83851 , H01L2224/92125 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/3011 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/01022 , H01L2924/0665
摘要： An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.
摘要翻译： LSI封装包括一个传输线头，包括一个标题基座，一个由标题基座保持的传输线，以及一个安装在标题基座上的接口IC芯片，一个具有多个板连接接头的插入基片，与印刷线路板的连接; 安装在所述插入器基板上的LSI芯片; 以及插座，其具有引线端子并安装在所述插入器基板上，被配置为容纳所述传输线集管，使得所述接口IC芯片通过所述引线端子电连接到所述LSI芯片。

39. 发明授权

US07255493B2 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US07255493B2
公开(公告)日：2007-08-14
申请号：US11442276
申请日：2006-05-30
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/36
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

40. 发明申请

US20060291783A1 Member holding optical transmission line and optical module 失效
标题翻译：会员持有光传输线和光模块
公开(公告)号：US20060291783A1
公开(公告)日：2006-12-28
申请号：US11472367
申请日：2006-06-22
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/36
CPC分类号： G02B6/4212 , G02B6/4249
摘要： In an optical module, a member has a hole and a mounting surface in which the hole is open and electric wiring is formed. A recess is formed in the mounting surface. The electric wiring is formed in the recess and is continuously extended to an outside the recess. The electric wiring is provided with a connecting portion on a bottom surface of the recess. An optical transmission line is inserted into the hole and its optical input or optical output end is faced to the optical semiconductor device so as to be optically coupled to the optical transmission line. The semiconductor device is mounted on the mounting surface and electrically connected to the connecting portion. The gap between the optical semiconductor device and the opening end face of the optical transmission line is filled with an adhesive.
摘要翻译：在光学模块中，构件具有孔和安装表面，孔中打开孔并形成电布线。在安装面上形成凹部。电气配线形成在凹部中，并且连续地延伸到凹部的外侧。电气配线在凹部的底面设置有连接部。光传输线插入孔中，其光输入或光输出端面对光半导体器件，以光耦合到光传输线。半导体器件安装在安装表面上并电连接到连接部分。光学半导体器件与光传输线的开口端面之间的间隙填充有粘合剂。

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