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31. 发明申请

US20060249500A1 Method of manufacturing composite material 审中-公开
标题翻译：制造复合材料的方法
公开(公告)号：US20060249500A1
公开(公告)日：2006-11-09
申请号：US11412334
申请日：2006-04-26
申请人： Hidehiro Kudo , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
发明人： Hidehiro Kudo , Kyoichi Kinoshita , Katsufumi Tanaka , Eiji Kono
IPC分类号： C22C1/05 , B22D18/02 , B22D19/14 , B22D27/09
CPC分类号： C22C1/1094 , B22D19/14 , B22F2998/10 , C22C1/1036 , C22C2001/1073 , B22F3/14
摘要： A method of manufacturing metal matrix composite with ceramic particles as a disperse phase includes the steps of holding the single metal matrix composite or the plurality of layered metal matrix composites between a pair of pressing dies, pressing the metal matrix composite by the pressing dies, and heating the metal matrix composite.
摘要翻译：制造具有陶瓷颗粒作为分散相的金属基复合材料的方法包括将单金属基复合材料或多层金属基复合材料保持在一对压模之间的步骤，通过压模挤压金属基复合材料，以及加热金属基复合材料。

32. 发明授权

US07097914B2 Composite structural material, and method of producing the same 失效
标题翻译：复合结构材料及其制造方法
公开(公告)号：US07097914B2
公开(公告)日：2006-08-29
申请号：US10472273
申请日：2002-08-28
申请人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Takashi Yoshida , Eiji Kono , Hidehiro Kudo , Manabu Miyoshi
发明人： Katsufumi Tanaka , Tomohei Sugiyama , Kyoichi Kinoshita , Takashi Yoshida , Eiji Kono , Hidehiro Kudo , Manabu Miyoshi
IPC分类号： B32B3/24 , B32B15/06 , H01L23/36
CPC分类号： H01L23/3736 , B23K20/04 , B23K20/22 , B23K2101/38 , B23K2103/10 , B23K2103/12 , B23K2103/16 , B23K2103/18 , B23K2103/20 , B23K2103/22 , H01L23/3733 , H01L2924/0002 , Y10T29/49908 , Y10T156/10 , Y10T428/12451 , Y10T428/12486 , Y10T428/12562 , Y10T428/12757 , Y10T428/12917 , Y10T428/24917 , Y10T428/249956 , H01L2924/00
摘要： A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10−6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.
摘要翻译：板状复合材料具有第一构件和第二构件。第一构件是由金属板形成的多孔金属。金属板的线膨胀系数小于或等于8×10 -6 /摄氏度。第一个成分抑制复合材料的热膨胀。第二构件的导热系数大于或等于200W /（m×K）。第二构件保持复合材料的导热系数。这种结构提供了可靠的导热系数和高强度。该结构适用于其上安装诸如半导体的电子元件的冷却基板。

33. 发明授权

US06529380B1 Structure of power module radiation 失效
标题翻译：电源模块辐射的结构
公开(公告)号：US06529380B1
公开(公告)日：2003-03-04
申请号：US09699934
申请日：2000-10-30
申请人： Eiji Kono
发明人： Eiji Kono
IPC分类号： H01L2160
CPC分类号： H01L24/32 , C04B2237/407 , H01L23/3735 , H01L2224/32225 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01068 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/3512 , H01L2924/00
摘要： In a power module provided with a semiconductor integrated circuit containing a power element such as a power transistor, etc., a radiation plate for transmitting heat from a semiconductor chip which forms the semiconductor integrated circuit to a heat sink is made of ceramics. A conductive unit is obtained by saturating the upper portion of the ceramics with Cu (copper), Mg (magnesium), and Al (aluminum). A silicon chip 11 is attached to the conductive unit 13a with solder. The lower portion of the ceramics is attached to the heat sink 14 directly or through radiation grease 15. Thus, a resultant power module has a radiation structure with the number of units and the number of steps in an assembly process successfully decreased.
摘要翻译：在设置有包含诸如功率晶体管等功率元件的半导体集成电路的功率模块中，用于将形成半导体集成电路的半导体芯片的热量传递到散热器的辐射板由陶瓷制成。通过用Cu（铜），Mg（镁）和Al（铝）使陶瓷的上部饱和来获得导电单元。硅芯片11用焊料附接到导电单元13a。陶瓷的下部直接或通过辐射润滑脂15附接到散热器14.因此，所得功率模块具有具有多个单元的辐射结构，并且组装过程中的台阶数成功地减小。

34. 发明授权

US5949201A Horizontal linearity correcting circuit 失效
标题翻译：水平线性校正电路
公开(公告)号：US5949201A
公开(公告)日：1999-09-07
申请号：US865705
申请日：1997-05-30
申请人： Hitoshi Suzuki , Eiji Kono
发明人： Hitoshi Suzuki , Eiji Kono
IPC分类号： H04N3/23 , H04N3/233 , H04N3/27 , G09G1/04 , H01J29/74
CPC分类号： H04N3/233 , H04N3/27
摘要： A series circuit of first and second damper diodes (4a, 4b) and a series circuit of first and second resonance capacitors (5a, 5b) are connected in parallel between a collector and an emitter of a horizontal transistor (3). A series circuit of a horizontal deflecting winding (6), a capacitor (7) for an S-character correction, a capacitor (8) for blocking a direct current and a winding (9) for pin distortion modulation is connected in parallel between the collector and the emitter of the transistor (3). Further, connecting intermediate points of the damper diodes (4a, 4b), the resonance capacitors (5a, 5b) and the capacitors (7, 8) are connected to one another. A series circuit of a second capacitor (13) for the S-character correction and a switching device (14) formed of e.g., a MOS-FET element is connected in parallel to the capacitor (7) for the S-character correction. The switching device (14) is connected with a driving circuit (16) for supplying an arbitrary control pulse signal thereto from a saw tooth wave generating circuit (15a) and a comparing circuit (15b). According to the above-mentioned arrangement, the linearity and intermediate pin distortion do not become worse even when a deflecting width is changed.
摘要翻译：第一和第二阻尼二极管（4a，4b）的串联电路和第一和第二谐振电容器（5a，5b）的串联电路并联连接在水平晶体管（3）的集电极和发射极之间。水平偏转绕组（6），用于S字符校正的电容器（7），用于阻断直流电流的电容器（8）和用于引脚失真调制的绕组（9）的串联电路并联连接在集电极和晶体管（3）的发射极。此外，连接阻尼二极管（4a，4b），谐振电容器（5a，5b）和电容器（7,8）的中间点彼此连接。用于S字符校正的第二电容器（13）的串联电路和由例如MOS-FET元件形成的开关器件（14）并联连接到用于S字符校正的电容器（7）。开关装置（14）与用于从锯齿波发生电路（15a）和比较电路（15b）提供任意的控制脉冲信号的驱动电路（16）连接。根据上述结构，即使改变偏转宽度，线性和中间引脚的变形也不会变差。

35. 发明授权

US08391011B2 Cooling device 失效
标题翻译：冷却装置
公开(公告)号：US08391011B2
公开(公告)日：2013-03-05
申请号：US13070088
申请日：2011-03-23
申请人： Shogo Mori , Eiji Kono
发明人： Shogo Mori , Eiji Kono
IPC分类号： H05K7/20 , F28F13/00
CPC分类号： H01L23/473 , H01L21/4882 , H01L23/3735 , H01L2924/0002 , Y10T29/4913 , Y10T29/4935 , Y10T29/49366 , Y10T428/1291 , Y10T428/12924 , Y10T428/12979 , Y10T428/24909 , Y10T428/24917 , H01L2924/00
摘要： A cooling device includes a heat sink having a top plate, a bottom plate spaced from the top plate and fins between the top and bottom plates, a first metal member laminated to the side of the top plate that is opposite from the fins, and a first insulator laminated to the first metal member. The top plate, the bottom plate and the first metal member are each made of a clad metal that is composed of a base metal and a brazing metal, so that the fins are brazed to the top and bottom plates, the first metal member is brazed to the top plate, and the first insulator is brazed to the first metal member.
摘要翻译：冷却装置包括具有顶板，与顶板间隔开的底板和顶板和底板之间的翅片的散热器，层叠在与顶板相对的顶板侧的第一金属件，以及第一绝缘体层压到第一金属构件上。顶板，底板和第一金属构件均由由基底金属和钎焊金属构成的复合金属制成，使得翅片钎焊到顶板和底板，第一金属构件被钎焊并且第一绝缘体钎焊到第一金属构件。

36. 发明授权

US07923833B2 Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：US07923833B2
公开(公告)日：2011-04-12
申请号：US12086715
申请日：2006-12-11
申请人： Yuichi Furukawa , Shinobu Yamauchi , Nobuhiro Wakabayashi , Shintaro Nakagawa , Keiji Toh , Eiji Kono , Kota Otoshi , Katsufumi Tanaka
发明人： Yuichi Furukawa , Shinobu Yamauchi , Nobuhiro Wakabayashi , Shintaro Nakagawa , Keiji Toh , Eiji Kono , Kota Otoshi , Katsufumi Tanaka
IPC分类号： H01L23/06
CPC分类号： H01L23/3735 , H01L23/367 , H01L23/473 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.
摘要翻译：半导体模块10包括陶瓷基板，其具有安装有半导体元件12的前表面和在前表面的相对侧上的后表面，与前表面接合的前金属板15，后金属板16接合后部金属板16包括面向散热片13的接合面16b。接合面16b包括接合区域和非接合区域。非接合区域包括在后金属板16的厚度方向上延伸的凹部18.后金属板16的接合面积在接合面16b的总面积的65％〜85％的范围内后金属板16.结果，可以在发生由于热应力引起的变形和开裂的同时实现优异的散热性能。

37. 发明授权

US07923242B2 Microorganism detection apparatus and microorganism detection cassette 有权
标题翻译：微生物检测装置和微生物检测盒
公开(公告)号：US07923242B2
公开(公告)日：2011-04-12
申请号：US11346564
申请日：2006-02-03
申请人： Eiji Kono , Hironobu Sekine , Yasuhiko Yokoi , Akihumi Iwama
发明人： Eiji Kono , Hironobu Sekine , Yasuhiko Yokoi , Akihumi Iwama
IPC分类号： C12M1/34 , C12M3/00
CPC分类号： C12Q1/04 , G01N21/0317 , G01N21/75 , G01N21/78 , G01N2021/7783
摘要： The objective of the present invention is to provide a simple microorganism detection apparatus that reduces detection time and that provides improved detection sensitivity, especially for gram-negative bacteria. The microorganism detection apparatus of the present invention includes: a detection target introduction portion, into which a sample and reagents are to be introduced; a detector, for detecting the color tone of the reagent introduced into the detection target introduction portion; a sample holder, for holding the sample to be introduced into the detection target introduction portion; a culture solution holder, for holding a culture solution used for microorganism culturing; and reagent holders, for holding the reagents to be introduced into the detection target introduction portion, wherein the presence/absence of microorganisms in the sample is determined based on the detected color tone.
摘要翻译：本发明的目的是提供一种简单的微生物检测装置，其减少检测时间并且提供改善的检测灵敏度，特别是革兰氏阴性细菌。本发明的微生物检测装置包括：检测对象物导入部，将样品和试剂引入其中的检测对象物导入部; 检测器，用于检测引入到检测目标导入部分中的试剂的色调; 样品保持器，用于保持待引入检测对象物导入部的样品; 用于保持用于微生物培养的培养液的培养液保持器; 和试剂保持器，用于保持要引入到检测对象物导入部分中的试剂，其中基于检测到的色调确定样品中存在/不存在微生物。

38. 发明申请

US20080087400A1 METHOD OF PRODUCING BASE PLATE FOR CIRCUIT BOARD, BASE PLATE FOR CIRCUIT BOARD, AND CIRCUIT BOARD USING THE BASE PLATE 审中-公开
标题翻译：电路板基板，电路板基板和使用基板的电路板生产方法
公开(公告)号：US20080087400A1
公开(公告)日：2008-04-17
申请号：US11949455
申请日：2007-12-03
申请人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
发明人： Katsufumi Tanaka , Kyoichi Kinoshita , Tomohei Sugiyama , Eiji Kono
IPC分类号： B22D23/00
CPC分类号： H05K1/05 , H01L21/4871 , H01L23/3735 , H01L2224/32225 , H05K2201/0209 , H05K2201/0355 , H05K2203/128 , Y10T428/12493 , Y10T428/12576 , Y10T428/24917 , Y10T428/31678
摘要： First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al—Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al—Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.
摘要翻译：首先，将含有Si的Al合金的熔体或含有Si的Al合金的熔体注入填充有SiC粉末的模具中并铸造以形成由Al / SiC复合材料制成的板构件。接着，将由Al-Mg系合金构成的铝箔构件通过热压与板构件的表面接合。结果，Al箔构件的一部分在板构件的表面上进入浇注气孔以填充铸造气孔。此外，在板构件的表面上形成Al-Mg基合金层。因此，制造具有接近平坦表面的基板。

39. 发明授权

US07196417B2 Method of manufacturing a low expansion material and semiconductor device using the low expansion material 失效
标题翻译：使用低膨胀材料制造低膨胀材料的方法和半导体器件
公开(公告)号：US07196417B2
公开(公告)日：2007-03-27
申请号：US10626418
申请日：2003-07-23
申请人： Tomohei Sugiyama , Kyoichi Kinoshita , Takashi Yoshida , Hidehiro Kudo , Eiji Kono
发明人： Tomohei Sugiyama , Kyoichi Kinoshita , Takashi Yoshida , Hidehiro Kudo , Eiji Kono
IPC分类号： H01L23/34
CPC分类号： C04B35/653 , B22D19/14 , C04B35/565 , C04B2235/3826 , C04B2235/402 , C04B2235/404 , C04B2235/422 , C04B2235/428 , C04B2235/5436 , C04B2235/5472 , C04B2235/608 , C04B2235/80 , C04B2235/9607 , C22C1/1036 , C22C2001/1021 , H01L23/3733 , H01L23/3735 , H01L2224/32225
摘要： A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.
摘要翻译：模具填充有未烧结的SiC颗粒，并且将Al或含有Si的Al合金的熔体注入用于高压铸造的模具中。由于SiC颗粒和Si在铸造时沉淀，产生具有低热膨胀系数的低膨胀材料。由SiC颗粒之间的Al渗透空间形成传热路径，因此得到高导热性。

40. 发明申请

US20060246578A1 Microorganism detection apparatus and microorganism detection cassette 有权
标题翻译：微生物检测装置和微生物检测盒
公开(公告)号：US20060246578A1
公开(公告)日：2006-11-02
申请号：US11346564
申请日：2006-02-03
申请人： Eiji Kono , Hironobu Sekine , Yasuhiko Yokoi , Akihumi Iwama
发明人： Eiji Kono , Hironobu Sekine , Yasuhiko Yokoi , Akihumi Iwama
IPC分类号： C12M1/34
CPC分类号： C12Q1/04 , G01N21/0317 , G01N21/75 , G01N21/78 , G01N2021/7783
摘要： The objective of the present invention is to provide a simple microorganism detection apparatus that reduces detection time and that provides improved detection sensitivity, especially for gram-negative bacteria. The microorganism detection apparatus of the present invention includes: a detection target introduction portion, into which a sample and reagents are to be introduced; a detector, for detecting the color tone of the reagent introduced into the detection target introduction portion; a sample holder, for holding the sample to be introduced into the detection target introduction portion; a culture solution holder, for holding a culture solution used for microorganism culturing; and reagent holders, for holding the reagents to be introduced into the detection target introduction portion, wherein the presence/absence of microorganisms in the sample is determined based on the detected color tone.
摘要翻译：本发明的目的是提供一种简单的微生物检测装置，其减少检测时间并且提供改善的检测灵敏度，特别是革兰氏阴性细菌。本发明的微生物检测装置包括：检测对象物导入部，将样品和试剂引入其中的检测对象物导入部; 检测器，用于检测引入到检测目标导入部分中的试剂的色调; 样品保持器，用于保持待引入检测对象物导入部的样品; 用于保持用于微生物培养的培养液的培养液保持器; 和试剂保持器，用于保持待引入到检测对象物导入部分中的试剂，其中基于检测到的色调确定样品中存在/不存在微生物。

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