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    • 33. 发明授权
    • Shift register
    • 移位寄存器
    • US07145545B2
    • 2006-12-05
    • US10760576
    • 2004-01-20
    • Patrick A. ZebedeeHarry Garth Walton
    • Patrick A. ZebedeeHarry Garth Walton
    • G09G3/36
    • G11C19/28
    • A shift register is provided, for example, for use in scan and data line drivers for an active matrix liquid crystal display. The shift register comprises X stages, where X is an integer greater than 3. A clock signal generator supplies Y-phase clock signals, where Y is greater than 2. Each of the stages comprises a flip-flop and logic circuit and receives a set enable signal from the immediately preceding stage output. Each stage is set by the leading edge of one of the clock phases in the pressure of the set enable signal and is reset by the trailing edge of the clock phase. In order to provide bi-directional operation, each intermediate stage also receives set enable signals from the immediately succeeding stage output. The clock signal generator supplies clock pulses in a first order for shift register operation in the forward direction and in the reverse order for shift register operation in the reverse direction.
    • 提供移位寄存器,例如用于有源矩阵液晶显示器的扫描和数据线驱动器。 移位寄存器包括X级,其中X是大于3的整数。时钟信号发生器提供Y相大于2的Y相时钟信号。每个级包括触发器和逻辑电路并接收一组 使能来自前一级输出的信号。 每个级由设置使能信号的压力中的一个时钟相位的前沿设置,并由时钟相位的后沿复位。 为了提供双向操作,每个中间级还从紧接着的后级输出接收设定使能信号。 时钟信号发生器以正向方向提供用于移位寄存器操作的时钟脉冲,并且以相反的顺序向相反方向提供移位寄存器操作。
    • 38. 发明授权
    • Integrated MEMS packaging
    • 集成MEMS封装
    • US07217588B2
    • 2007-05-15
    • US11178148
    • 2005-07-08
    • John W. HartzellHarry Garth WaltonMichael James Brownlow
    • John W. HartzellHarry Garth WaltonMichael James Brownlow
    • H01L21/00
    • B81C1/0023H01L27/1214
    • An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.
    • 提供集成MEMS封装和相关封装方法。 该方法包括:形成电连接到第一基板的电路; 将MEMS器件集成在电连接到第一衬底的第一衬底区域上; 提供覆盖所述第一基板的第二基板; 以及沿所述第一区域边界在所述第一和第二基板之间形成壁。 在一个方面,使用薄膜工艺形成电路; 并且其中将MEMS器件集成在第一衬底区域上包括使用薄膜工艺形成MEMS,同时形成电子器件。 或者,MEMS器件以独立的工艺形成,附接到第一衬底,并且使用薄膜工艺将电互连形成到第一衬底。