专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明申请

US20130081267A1 Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board 有权
标题翻译：用于制造用于印刷电路板的Z定向部件的挤出工艺
公开(公告)号：US20130081267A1
公开(公告)日：2013-04-04
申请号：US13250812
申请日：2011-09-30
申请人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
发明人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
IPC分类号： H05K3/10
CPC分类号： H05K3/108 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K1/184 , H05K3/4046 , H05K2201/09645 , Y10T29/49105 , Y10T29/49117 , Y10T29/49124 , Y10T29/49139 , Y10T29/49155 , Y10T29/49158 , Y10T29/49204
摘要： A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.
摘要翻译：根据一个示例实施例的用于制造用于插入到印刷电路板的安装孔中的Z定向部件的方法包括根据Z指向部件的形状挤出基底材料。然后将导电材料选择性地施加到挤出的基底材料上，并且由挤出的基底材料形成Z指向的部件。

32. 发明申请

US20130059746A1 GENE EXPRESSION PROFILING OF CYTOGENETIC ABNORMALITIES 审中-公开
标题翻译：基因表达细胞因子异常分析
公开(公告)号：US20130059746A1
公开(公告)日：2013-03-07
申请号：US13524589
申请日：2012-06-15
申请人： John D. Shaughnessy, JR. , Yiming Shou , Qing Zhang , Bart Barlogie
发明人： John D. Shaughnessy, JR. , Yiming Shou , Qing Zhang , Bart Barlogie
IPC分类号： C40B30/04 , C12Q1/68
CPC分类号： G01N33/57426 , C12Q1/6886 , C12Q2600/158
摘要： Provided herein are methods of predicting cytogenetic abnormalities associated with a cancer in a subject, for example, multiple myeloma. A cytogenetic abnormalities model of a set of reference values obtained from an average of gene expression profile values based on copy number-sensitive genes that correlate to cytogenetic abnormalities associated with the cancer is utilized as a predictive tool. The cytogenetic abnormalities model, as a virtual model (i.e. a “virtual karyotype”), may be tangibly stored with program instructions to implement the model in a computer system. In particular embodiments, the methods and systems provided by the invention operate without FISH (fluorescent in situ hybridization).
摘要翻译：本文提供了预测与受试者例如多发性骨髓瘤中的癌症相关的细胞遗传学异常的方法。从基于与癌症相关的细胞遗传学异常相关的拷贝数敏感基因的基因表达谱平均值获得的一组参考值的细胞遗传学异常模型被用作预测工具。作为虚拟模型（即，虚拟核型）的细胞遗传学异常模型可以用程序指令有形地存储以在计算机系统中实现该模型。在具体实施方案中，本发明提供的方法和系统在没有FISH（荧光原位杂交）的情况下操作。

33. 发明授权

US08389396B2 Method for manufacture of integrated circuit package system with protected conductive layers for pads 有权
标题翻译：用于制造具有用于焊盘的保护导电层的集成电路封装系统的方法
公开(公告)号：US08389396B2
公开(公告)日：2013-03-05
申请号：US13233402
申请日：2011-09-15
申请人： Yaojian Lin , Haijing Cao , Qing Zhang
发明人： Yaojian Lin , Haijing Cao , Qing Zhang
IPC分类号： H01L21/44
CPC分类号： H01L23/3114 , H01L23/5223 , H01L23/5227 , H01L23/5228 , H01L23/525 , H01L24/11 , H01L24/12 , H01L24/17 , H01L24/48 , H01L24/73 , H01L2224/05001 , H01L2224/05016 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05186 , H01L2224/05548 , H01L2224/05611 , H01L2224/05666 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/05686 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/48463 , H01L2924/00014 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01047 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04953 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/04941 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacture of an integrated circuit package system includes: providing an integrated circuit die having a contact pad; forming a protection cover over the contact pad; forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover; developing a conductive layer over the passivation layer; forming a pad opening in the protection cover for exposing the contact pad having the conductive layer partially removed; and an interconnect directly on the contact pad and only adjacent to the protection cover and the passivation layer.
摘要翻译：一种用于制造集成电路封装系统的方法，包括：提供具有接触焊盘的集成电路管芯; 在接触垫上形成保护盖; 形成钝化层，所述钝化层在所述保护盖上方具有第一开口，所述第一开口露出所述保护盖; 在钝化层上形成导电层; 在保护盖中形成焊盘开口，用于暴露具有部分去除的导电层的接触焊盘; 以及直接在接触焊盘上并且仅与保护盖和钝化层相邻的互连。

34. 发明申请

US20130052338A1 Screening Process for Manufacturing a Z-directed Component for a Printed Circuit Board 有权
标题翻译：用于制造用于印刷电路板的Z定向部件的筛选过程
公开(公告)号：US20130052338A1
公开(公告)日：2013-02-28
申请号：US13222418
申请日：2011-08-31
申请人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
发明人： Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
IPC分类号： B05D5/12
CPC分类号： H05K1/184 , B28B7/16 , C04B35/622 , H05K1/0231 , H05K1/0233 , H05K1/0248 , H05K1/0251 , H05K3/4046 , H05K3/4667 , H05K2201/09645
摘要： A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.
摘要翻译：根据一个示例实施例的用于制造用于插入到印刷电路板的安装孔中的z定向部件的方法包括将衬底材料添加到限定z定向部件的层的形状的模具中。模具中的基材材料的顶表面被平整。对模具中的基底材料进行处理，并且形成z定向部件的层。将导电材料施加到所形成的层的至少一个表面。形成z定向分量，其包括包括所形成的层的一组成分层。

35. 发明授权

US08326608B2 Transcoding method, apparatus, device and system 有权
标题翻译：转码方法，装置，装置和系统
公开(公告)号：US08326608B2
公开(公告)日：2012-12-04
申请号：US13359339
申请日：2012-01-26
申请人： Chen Hu , Lei Miao , Zexin Liu , Longyin Chen , Herve Marcel Taddei , Qing Zhang
发明人： Chen Hu , Lei Miao , Zexin Liu , Longyin Chen , Herve Marcel Taddei , Qing Zhang
IPC分类号： G10L21/00
CPC分类号： G10L19/173 , G10L19/24
摘要： A method, a device, and a system for transcoding between two embedded codecs are disclosed. The method includes: delaying a first encoded stream in input streams for integer number of frames, where the first encoded stream includes a stream of at least one extension layer in the input streams obtained after input signals are encoded by using a first codec; and using the first codec to decode other encoded streams in the input streams to obtain the first decoded signal; and performing delay aligning and adjusting to obtain an adjusted signal so as to reduce the transcoding complexity and enhance quality of the transcoded signals.
摘要翻译：公开了一种用于在两个嵌入式编解码器之间进行代码转换的方法，设备和系统。该方法包括：在整数帧的输入流中延迟第一编码流，其中第一编码流包括在通过使用第一编解码器对输入信号进行编码之后获得的输入流中的至少一个扩展层的流; 以及使用所述第一编解码器来解码所述输入流中的其他编码流以获得所述第一解码信号; 并执行延迟对准和调整以获得经调整的信号，以便降低代码转换复杂度并提高转码信号的质量。

36. 发明授权

US08310058B2 Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures 有权
标题翻译：用于通过硅通孔形成无源电路元件到背面互连结构的半导体器件和方法
公开(公告)号：US08310058B2
公开(公告)日：2012-11-13
申请号：US12704366
申请日：2010-02-11
申请人： Yaojian Lin , Haijing Cao , Qing Zhang , Kang Chen , Jianmin Fang
发明人： Yaojian Lin , Haijing Cao , Qing Zhang , Kang Chen , Jianmin Fang
IPC分类号： H01L23/48
CPC分类号： H01L25/16 , H01L21/76898 , H01L23/3114 , H01L23/481 , H01L24/11 , H01L24/12 , H01L25/0652 , H01L2224/05571 , H01L2224/05573 , H01L2224/13022 , H01L2224/13025 , H01L2224/16 , H01L2224/2518 , H01L2924/00014 , H01L2924/01019 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/12044 , H01L2924/14 , H01L2924/19015 , H01L2924/19041 , H01L2924/19104 , H01L2924/19105 , H01L2224/05599
摘要： A semiconductor wafer contains a substrate having a plurality of active devices formed thereon. An analog circuit is formed on the substrate. The analog circuit can be an inductor, metal-insulator-metal capacitor, or resistor. The inductor is made with copper. A through substrate via (TSV) is formed in the substrate. A conductive material is deposited in the TSV in electrical contact with the analog circuit. An under bump metallization layer is formed on a backside of the substrate in electrical contact with the TSV. A solder material is deposited on the UBM layer. The solder material is reflowed to form a solder bump. A wire bond is formed on a top surface of the substrate. A redistribution layer is formed between the TSV and UBM. The analog circuit electrically connects through the TSV to the solder bump on the back side of the substrate.
摘要翻译：半导体晶片包含其上形成有多个有源器件的衬底。在基板上形成模拟电路。模拟电路可以是电感，金属 - 绝缘体 - 金属电容或电阻。电感由铜制成。在衬底中形成贯穿衬底通孔（TSV）。导电材料沉积在与模拟电路电接触的TSV中。在与TSV电接触的衬底的背面上形成凸起下金属化层。焊料材料沉积在UBM层上。焊料材料被回流以形成焊料凸块。在基板的顶表面上形成引线接合。在TSV和UBM之间形成再分配层。模拟电路通过TSV电连接到衬底背面的焊料凸块。

37. 发明申请

US20120259574A1 DESIGNED-BASED YIELD MANAGEMENT SYSTEM 审中-公开
标题翻译：基于设计的管理系统
公开(公告)号：US20120259574A1
公开(公告)日：2012-10-11
申请号：US13080474
申请日：2011-04-05
申请人： Chenmin Hu , Bo Su , Ping Zhang , Yuan Xu , Qing Zhang
发明人： Chenmin Hu , Bo Su , Ping Zhang , Yuan Xu , Qing Zhang
IPC分类号： G06F19/00
CPC分类号： H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： An integrated-circuit yield improvement system includes a global signature analysis/grouping module configured to receive an integrated circuit (IC) design and identify areas in the IC design that include potential defect signatures based on the defect signatures stored in the defect signature library. The global signature analysis/grouping module can produce a global signature map indicating these areas and their associated potential defect signatures in the IC design. A local signature analysis/grouping module can identify and group local defect signatures in the IC design with the process monitoring and yield data as input, to output grouped local signatures. An intelligent learning engine can analyze the global signature map and the grouped local signatures and update some of the defect signatures in the defect signature library. A feedback loop is formed to update and renew the contents of the defect signature library for each new IC design while process and yield are improved.
摘要翻译：集成电路产量改进系统包括全局签名分析/分组模块，其被配置为接收集成电路（IC）设计，并基于存储在缺陷签名库中的缺陷签名来识别IC设计中包括潜在缺陷签名的区域。全局签名分析/分组模块可以产生一个全局签名图，指示这些区域及其相关的潜在缺陷签名在IC设计中。本地签名分析/分组模块可以通过流程监控和收益数据作为输入来识别和分组IC设计中的本地缺陷签名，以输出分组的本地签名。智能学习引擎可以分析全局签名图和分组的本地签名，并更新缺陷签名库中的一些缺陷签名。形成反馈循环，以更新和更新每个新IC设计的缺陷签名库的内容，同时改进处理和产量。

38. 发明授权

US08209342B2 Systems and associated computer program products that disguise partitioned data structures using transformations having targeted distributions 有权
标题翻译：使用具有目标分布的转换来伪装分区数据结构的系统和相关的计算机程序产品
公开(公告)号：US08209342B2
公开(公告)日：2012-06-26
申请号：US12262706
申请日：2008-10-31
申请人： Divesh Srivastava , Nikolaos Koudas , Ting Yu , Qing Zhang
发明人： Divesh Srivastava , Nikolaos Koudas , Ting Yu , Qing Zhang
IPC分类号： G06F17/30
CPC分类号： G06F17/30536 , G06F21/6254
摘要： A data structure that includes at least one partition containing non-confidential quasi-identifier microdata and at least one other partition containing confidential microdata is formed. The partitioned confidential microdata is disguised by transforming the confidential microdata to conform to a target distribution. The disguised confidential microdata and the quasi-identifier microdata are combined to generate a disguised data structure. The disguised data structure is used to carry out statistical analysis and to respond to a statistical query is directed to the use of confidential microdata. In this manner, the privacy of the confidential microdata is preserved.
摘要翻译：形成包括至少一个包含非机密准标识符微数据的分区和至少一个包含机密微数据的分区的数据结构。分割的机密微数据通过转换机密微数据符合目标分配来伪装。伪装的机密微数据和准标识符微数据被组合以产生伪装的数据结构。伪装的数据结构用于进行统计分析，并响应统计查询是针对使用机密微数据。以这种方式，保密机密微数据的隐私被保留。

39. 发明申请

US20120136669A1 TRANSCODING METHOD, APPARATUS, DEVICE AND SYSTEM 有权
标题翻译： TRANSCODING方法，装置，装置和系统
公开(公告)号：US20120136669A1
公开(公告)日：2012-05-31
申请号：US13359339
申请日：2012-01-26
申请人： Chen Hu , Lei Miao , Zexin Liu , Longyin Chen , Herve Marcel Taddei , Qing Zhang
发明人： Chen Hu , Lei Miao , Zexin Liu , Longyin Chen , Herve Marcel Taddei , Qing Zhang
IPC分类号： G10L19/00
CPC分类号： G10L19/173 , G10L19/24
摘要： A method, a device, and a system for transcoding between two embedded codecs are disclosed. The method includes: delaying a first encoded stream in input streams for integer number of frames, where the first encoded stream includes a stream of at least one extension layer in the input streams obtained after input signals are encoded by using a first codec; and using the first codec to decode other encoded streams in the input streams to obtain the first decoded signal; and performing delay aligning and adjusting to obtain an adjusted signal so as to reduce the transcoding complexity and enhance quality of the transcoded signals.
摘要翻译：公开了一种用于在两个嵌入式编解码器之间进行代码转换的方法，设备和系统。该方法包括：在整数帧的输入流中延迟第一编码流，其中第一编码流包括在通过使用第一编解码器对输入信号进行编码之后获得的输入流中的至少一个扩展层的流; 以及使用所述第一编解码器来解码所述输入流中的其他编码流以获得所述第一解码信号; 并执行延迟对准和调整以获得经调整的信号，以便降低代码转换复杂度并提高转码信号的质量。

40. 发明授权

US08134484B2 Encoding and decoding method and device 有权
标题翻译：编码和解码方法及装置
公开(公告)号：US08134484B2
公开(公告)日：2012-03-13
申请号：US13086774
申请日：2011-04-14
申请人： Chen Hu , Lei Miao , Zexin Liu , Longyin Chen , Qing Zhang , Herve Marcel Taddei
发明人： Chen Hu , Lei Miao , Zexin Liu , Longyin Chen , Qing Zhang , Herve Marcel Taddei
IPC分类号： H03M7/34
CPC分类号： G10L19/24 , G10L19/032
摘要： A device relating to information processing technologies and including an encoding and decoding method configured to solve the poor decoding quality problem. The method includes: encoding each sample of an input signal to generate an encoded signal of a core layer; comparing residuals of all or a part of the samples of the input signal with encoding thresholds, where the residuals are generated by core layer encoding, and performing encoding according to comparison results to generate an encoded signal of an enhancement layer; and writing the encoded signal of the core layer and the encoded signal of the enhancement layer into a bitstream to generate an encoded signal of the input signal.
摘要翻译：一种与信息处理技术相关的装置，包括用于解决差的解码质量问题的编码和解码方法。该方法包括：对输入信号的每个样本进行编码以产生核心层的编码信号; 将输入信号的全部或部分样本的残差与编码阈值进行比较，其中通过核心层编码生成残差，并根据比较结果执行编码以产生增强层的编码信号; 以及将核心层的编码信号和增强层的编码信号写入比特流以产生输入信号的编码信号。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式