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31. 发明授权

US06459046B1 Printed circuit board and method for producing the same 有权
公开(公告)号：US06459046B1
公开(公告)日：2002-10-01
申请号：US09919319
申请日：2001-07-31
申请人： Shozo Ochi , Fumio Echigo , Yoji Ueda
发明人： Shozo Ochi , Fumio Echigo , Yoji Ueda
IPC分类号： H05K103
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/386 , H05K3/4614 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4658 , H05K2201/0191 , H05K2201/0195 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49155 , Y10T29/49165 , Y10T428/12028 , Y10T428/12528
摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.

32. 发明授权

US6037037A Magnetic recording medium 失效
标题翻译：磁记录介质
公开(公告)号：US6037037A
公开(公告)日：2000-03-14
申请号：US110794
申请日：1998-07-06
申请人： Kazunori Kubota , Fumio Echigo , Yukihiro Shimasaki , Takumi Haneda , Hirofumi Ito , Tetuo Fuchi , Kiyoshi Kobata
发明人： Kazunori Kubota , Fumio Echigo , Yukihiro Shimasaki , Takumi Haneda , Hirofumi Ito , Tetuo Fuchi , Kiyoshi Kobata
IPC分类号： G11B5/70 , G11B5/702 , G11B5/73 , G11B5/738 , G11B5/68
CPC分类号： G11B5/70 , G11B5/702 , G11B5/7021 , G11B5/7022 , G11B5/738 , Y10S428/90 , Y10T428/24355 , Y10T428/25 , Y10T428/257
摘要： The present invention provides a thin multilayer magnetic recording medium having improved electromagnetic conversion property and durability, comprising coating layers of a lower non-magnetic layer and an upper magnetic layer. The non-magnetic layer of this magnetic recording medium comprises a non-magnetic needle body having an average major axis length of 0.25 to 1.0 .mu.m and an average minor axis length of 0.005 to 0.0151 .mu.m, a first binding resin having a glass transition temperature (Tg.sub.1) of 30 to 50.degree. C., and fatty acid ester. The content of the first binding resin is 15 to 30 wt % with respect to the non-magnetic needle body. The content of the fatty acid ester is 2 to 15 wt % with respect to the first binding resin. The magnetic layer having a dry thickness of 0.5 .mu.m or less comprises ferromagnetic powder and a second binding resin having a glass transition temperature (Tg.sub.2) of 40 to 70.degree. C. Tg.sub.1 is at least 5.degree. C. lower than Tg.sub.2, and the entire thickness comprising the layers and the film is 12 .mu.m or less.
摘要翻译：本发明提供具有改善的电磁转换性能和耐久性的薄多层磁记录介质，其包括下层非磁性层和上层磁性层的涂层。该磁记录介质的非磁性层包括平均长轴长度为0.25〜1.0μm，平均短轴长度为0.005〜0.0151μm的非磁性针体，具有玻璃化转变温度的第一粘合树脂温度（Tg1）为30〜50℃，脂肪酸酯。第一粘合树脂的含量相对于非磁针体为15〜30重量％。相对于第一粘合树脂，脂肪酸酯的含量为2〜15重量％。干燥厚度为0.5μm以下的磁性层包含铁磁粉末和玻璃化转变温度（Tg2）为40〜70℃的第二粘合树脂，Tg1比Tg2低至少5℃，包含层和膜的整个厚度为12μm或更小。

33. 发明授权

US07066344B2 Mask film, its manufacturing method, and manufacturing method of circuit board using the same 失效
公开(公告)号：US07066344B2
公开(公告)日：2006-06-27
申请号：US10338642
申请日：2003-01-09
申请人： Toshiaki Takenaka , Toshikazu Kondo , Kunio Kishimoto , Shinji Nakamura , Fumio Echigo
发明人： Toshiaki Takenaka , Toshikazu Kondo , Kunio Kishimoto , Shinji Nakamura , Fumio Echigo
IPC分类号： H01B13/00
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2203/0191 , H05K2203/0522 , H05K2203/1461 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.

34. 发明授权

US06866892B2 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board 失效
公开(公告)号：US06866892B2
公开(公告)日：2005-03-15
申请号：US10607306
申请日：2003-06-27
申请人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
发明人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
IPC分类号： H05K3/20 , H05K3/38 , H05K3/40 , H05K3/46 , B05D3/12
CPC分类号： H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

35. 发明授权

US06799369B2 Printed circuit board and method for producing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US06799369B2
公开(公告)日：2004-10-05
申请号：US10224031
申请日：2002-08-19
申请人： Shozo Ochi , Fumio Echigo , Yoji Ueda
发明人： Shozo Ochi , Fumio Echigo , Yoji Ueda
IPC分类号： H01K310
CPC分类号： H05K3/4069 , H05K3/20 , H05K3/386 , H05K3/4614 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4658 , H05K2201/0191 , H05K2201/0195 , H05K2201/0355 , H05K2203/0191 , H05K2203/1461 , Y10T29/49155 , Y10T29/49165 , Y10T428/12028 , Y10T428/12528
摘要： A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor. By adjusting the thickness of the resin layers formed on both sides of the resin holder such as a glass cloth, it is possible to ensure high reliability when electrically connecting circuit boards using an electrically conductive paste as the electrical conductor.
摘要翻译：本发明的印刷电路板由电绝缘基材形成，所述电绝缘基材具有沿着所述电绝缘基材的厚度方向形成并且填充有电导体的通孔; 电绝缘基材包括通过用树脂浸渍保持器形成的芯层和形成在芯层两侧的树脂层; 以及在所述电绝缘基材的两面形成为规定图案并通过所述电导体彼此电连接的布线层。布线层嵌入至少一个树脂层中。两侧的树脂层的厚度不同，树脂层的薄层的厚度等于或小于电导体中所含的导电填料的平均粒径。通过调节玻璃布等树脂保持架的两侧形成的树脂层的厚度，可以确保使用导电性糊料作为导电体的电路基板电连接时的高可靠性。

36. 发明授权

US06558780B2 Circuit board and method for manufacturing the same 有权
公开(公告)号：US06558780B2
公开(公告)日：2003-05-06
申请号：US10045344
申请日：2001-10-25
申请人： Takeshi Suzuki , Toshihiro Nishii , Satoru Tomekawa , Fumio Echigo
发明人： Takeshi Suzuki , Toshihiro Nishii , Satoru Tomekawa , Fumio Echigo
IPC分类号： B32B300
CPC分类号： H05K3/4069 , H05K1/0366 , H05K1/115 , H05K3/0032 , H05K3/0047 , H05K3/4614 , H05K3/4652 , H05K2201/0287 , H05K2201/029 , H05K2201/0355 , H05K2201/094 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T428/24322 , Y10T428/24802 , Y10T428/24917 , Y10T428/24994 , Y10T428/249953
摘要： A circuit board includes an electrical insulator layer formed of a reinforcer sheet with density distribution in its in-plane direction, an electrical conductor filled in a plurality of inner via holes provided in the electrical insulator layer in its thickness direction, and a wiring layer connected to the electrical conductor. The inner via holes provided in a high-density portion of the reinforcer sheet are formed to have a smaller cross-section than the inner via holes provided in a low-density portion of the reinforcer sheet. In this manner, it is possible to provide a circuit board that can achieve a high-density wiring and an inner via connection resistance with less variation, when a base material including a reinforcer sheet with density distribution in its in-plane direction such as a glass-epoxy base material is used for an insulator layer.

37. 发明申请

US20100230138A1 WIRING BOARD 审中-公开
标题翻译：接线板
公开(公告)号：US20100230138A1
公开(公告)日：2010-09-16
申请号：US12278344
申请日：2008-03-26
申请人： Toshiyuki Asahi , Yukihiro Shimasaki , Fumio Echigo
发明人： Toshiyuki Asahi , Yukihiro Shimasaki , Fumio Echigo
IPC分类号： H05K1/09
CPC分类号： H05K1/0209 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/202 , H05K3/28 , H05K3/284 , H05K3/285 , H05K2201/0209 , H05K2201/035 , H01L2224/0401
摘要： A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength λ=0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.
摘要翻译：布线基板包括绝缘板，该绝缘板具有布置成安装有电子部件的顶表面，形成在绝缘板的顶表面上的导体图案，以及由覆盖导体图案的发热材料制成的发热层。对于波长λ= 0.002898 / T的电磁波，在293K〜473K的温度T下，发光材料的发射率不低于0.8。该布线板抑制电子部件的温度上升。

38. 发明授权

US06596381B2 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board 失效
公开(公告)号：US06596381B2
公开(公告)日：2003-07-22
申请号：US09962245
申请日：2001-09-26
申请人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
发明人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
IPC分类号： B32B300
CPC分类号： H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

39. 发明授权

US5342668A Magnetic recording medium having improved electromagnetic conversion characteristics and durability 失效
标题翻译：具有改善的电磁转换特性和耐久性的磁记录介质
公开(公告)号：US5342668A
公开(公告)日：1994-08-30
申请号：US690489
申请日：1991-04-24
申请人： Fumio Echigo , Masahiro Saida , Naoko N. F. Mizuno , Hideo Hatanaka , Yoshio Enoki
发明人： Fumio Echigo , Masahiro Saida , Naoko N. F. Mizuno , Hideo Hatanaka , Yoshio Enoki
IPC分类号： C09D5/23 , C09D7/12 , G11B5/708 , B32B3/02 , B32B5/16 , G11B5/66
CPC分类号： G11B5/708 , Y10T428/25 , Y10T428/257
摘要： A magnetic recording medium which comprises a support and a magnetic layer formed on opposite sides of the support and comprised of a ferromagnetic fine powder and an non-magnetic powder of an abrasive both dispersed in a resin binder. The non-magnetic powder consists essentially of a first non-magnetic inorganic powder having an average particle size of from 0.01 to 1.0 .mu.m and a second non-magnetic inorganic powder having an arborescent or chain-like structure and an average particle size of from 0.03 to 2.0 .mu.m. The first and second powders is present at a mixing ratio by weight of 8:2 to 2:8.
摘要翻译：一种磁记录介质，其包括形成在载体的相对侧上的载体和磁性层，并由铁磁细粉末和分散在树脂粘合剂中的研磨剂的非磁性粉末组成。非磁性粉末基本上由平均粒度为0.01〜1.0μm的第一非磁性无机粉末和第二非磁性无机粉末组成，其具有环状或链状结构，平均粒径为 0.03〜2.0μm。第一和第二粉末以8:2至2:8的重量比混合存在。

40. 发明申请

US20060283626A1 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board 审中-公开
公开(公告)号：US20060283626A1
公开(公告)日：2006-12-21
申请号：US11511416
申请日：2006-08-29
申请人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
发明人： Takeshi Suzuki , Satoru Tomekawa , Yoshihiro Kawakita , Yasushi Nakagiri , Fumio Echigo
IPC分类号： H05K1/03
CPC分类号： H05K1/024 , H05K1/036 , H05K3/20 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K3/4658 , H05K2201/0116 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2203/1461 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/49165 , Y10T428/24917 , Y10T428/31511
摘要： A compression function layer 60 is provided on at least one board surface. The compression function layer 60 adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board 10 which includes this layer. Thereby a sufficient pressure is applied to conductors 14.

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