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    • 33. 发明授权
    • Electroless palladium plating solution
    • 无电镀钯溶液
    • US07632343B2
    • 2009-12-15
    • US12186136
    • 2008-08-05
    • Kazuhiro KojimaHideto Watanabe
    • Kazuhiro KojimaHideto Watanabe
    • C23C18/44
    • C23C18/44H05K3/244
    • An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. An electroless palladium plating solution includes: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate: the first complexing agent being an organopalladium complex having ethylenediamine as a ligand: the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
    • 化学镀钯溶液能够直接在化学镀镍膜上形成纯钯电镀膜,而不需要(预处理)诸如取代的钯电镀处理等,其中纯钯电镀膜具有良好的附着力和较小的电镀膜变化 厚度。 化学镀钯溶液包括:第一络合剂,第二络合剂,磷酸或磷酸盐,硫酸或硫酸盐,甲酸或甲酸盐:第一络合剂是具有乙二胺作为配体的有机钯络合物: 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。
    • 35. 发明申请
    • ELECTROLESS PALLADIUM PLATING SOLUTION
    • 电镀磷酸盐溶液
    • US20090044720A1
    • 2009-02-19
    • US12186136
    • 2008-08-05
    • Kazuhiro KojimaHideto Watanabe
    • Kazuhiro KojimaHideto Watanabe
    • C23C18/44
    • C23C18/44H05K3/244
    • [Object] To provide, an electroless palladium plating solution capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness.[Means to Solve the Problem] An electroless palladium plating solution comprising: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate; the first complexing agent being an organopalladium complex having ethylenediamine as a ligand; the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
    • 本发明提供一种无电镀钯溶液,其能够直接在化学镀镍膜上形成纯钯电镀膜,而不需要(预处理)如取代的钯电镀处理等,该纯钯电镀膜具有良好的附着力, 镀膜厚度变化小。 解决问题的方法一种无电镀钯溶液,包括:第一络合剂,第二络合剂,磷酸或磷酸盐,硫酸或硫酸盐,甲酸或甲酸盐; 第一络合剂是具有乙二胺作为配体的有机钯络合物; 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。
    • 37. 发明授权
    • Catheter for simultaneously measuring monophasic action potential and
endocardiac cavity pressure
    • 用于同时测量单相动作电位和心内膜压力的导管
    • US5022396A
    • 1991-06-11
    • US448921
    • 1989-12-12
    • Hideto Watanabe
    • Hideto Watanabe
    • A61B5/0408A61B5/0205A61B5/0215A61B5/042A61B5/0478A61B5/0492A61N1/05
    • A61N1/056A61B5/0215A61B5/0422
    • A catheter capable of simultaneously measuring the action potential of myocardiac cells by means of a pair of electrodes, and the endocardiac cavity pressure by means of a pressure transducer. One electrode is provided to the enclosing front surface of a catheter body when the catheter body is brought into contact with the endocardiac surface guided into the endocardiac cavity. The other electrode is provided to the distal peripheral surface of the catheter body and is disposed within the endocardiac cavity when the catheter is guided into the endocardiac cavity and the other electrode contacts the endocardiac surface. The pressure transducer is provided to the peripheral surface of the distal section, for measuring the endocardiac cavity pressure and outputting it in the form of an electrical pressure signal. Lead wires are connected to the pair of electrodes and the pressure transducer, and are guided from the rear section of the catheter body in order to transfer the measured action potential and electrical pressure signals, from the catheter body, to processing and display equipment.
    • 能够通过一对电极同时测量心肌细胞的动作电位的导管,以及借助于压力传感器的心内膜腔压力。 当导管主体与引导进入心内膜腔的心内膜表面接触时,将一个电极提供到导管主体的封闭前表面。 另一个电极被提供到导管主体的远端外周表面,并且当导管被引导到心内膜腔中并且另一个电极接触心内膜表面时,设置在心内膜腔内。 压力传感器被提供到远端部分的外周表面,用于测量心内膜腔压力并以电压信号的形式输出。 引线连接到一对电极和压力传感器,并且从导管主体的后部引导,以将测量的动作电位和电压信号从导管主体传送到处理和显示设备。
    • 38. 发明授权
    • Blast-furnace tuyere
    • 高炉风口
    • US4189130A
    • 1980-02-19
    • US952930
    • 1978-10-19
    • Hideto WatanabeShigeo ShojiAkimune SatoTakashi Oka
    • Hideto WatanabeShigeo ShojiAkimune SatoTakashi Oka
    • C21B7/16C23C4/02C23C4/10
    • C23C4/02C21B7/16C23C4/11Y10S428/926Y10T428/1291
    • A blast-furnace tuyere having excellent thermal shock resistance and high durability consists of a tuyere substrate composed of copper or copper alloy, a self-fluxing alloy metallized layer sprayed on the substrate, a cermet coating sprayed on the alloy metallized layer, and a ceramic coating sprayed on the cermet coating. The cermet coating is made from a mixture of an alloy material consisting essentially of 5 to 60 wt% of Co, 5 to 50 wt% of Ni, 5 to 25 wt% of Cr, 5 to 40 wt% of Mo, 5 to 40 wt% of W, 3 to 40 wt% of Si and inevitable impurities, and a ceramic eutectic material consisting essentially of 95 to 65 wt% of Al.sub.2 O.sub.3, 5 to 30 wt% of ZrO.sub.2, 2 to 20 wt% of TiO.sub.2, 3 to 30 wt% of SiO.sub.2 and inevitable impurities. The ceramic coating is made from the same ceramic material as used in the formation of the cermet coating.
    • 具有优异的耐热冲击性和高耐久性的高炉风口包括由铜或铜合金构成的风口基板,喷涂在基板上的自熔合金金属化层,喷涂在合金金属化层上的金属陶瓷涂层和陶瓷 喷涂在金属陶瓷涂层上。 金属陶瓷涂层由基本上由Co组成的5〜60重量%的Co,5〜50重量%的Ni,5〜25重量%的Cr,5〜40重量%的Mo,5〜40 W为3〜40重量%,不可避免的杂质为3〜40重量%,Al 2 O 3为95〜65重量%,ZrO 5〜30重量%,TiO 2为2〜20重量%,TiO 2为3〜 30重量%的SiO 2和不可避免的杂质。 陶瓷涂层由与形成金属陶瓷涂层相同的陶瓷材料制成。
    • 40. 发明申请
    • ELECTROLESS PALLADIUM PLATING SOLUTION
    • 电镀磷酸盐溶液
    • US20120118196A1
    • 2012-05-17
    • US13319194
    • 2010-05-07
    • Hideto WatanabeKazuhiro KojimaKaoru Yagi
    • Hideto WatanabeKazuhiro KojimaKaoru Yagi
    • C09D1/00
    • C23C18/44H01L2224/85464H05K3/244
    • Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
    • 公开了一种化学镀钯溶液,其可以形成对电子部件等具有优异的焊接性质的镀层,并且具有优异的引线接合性能。 化学镀钯溶液包括钯化合物,胺化合物,无机硫化合物和还原剂,其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂,以及 其中钯化合物,胺化合物,无机硫化合物,次磷酸化合物,甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔 分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。 无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。