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31. 发明授权

US10486285B2 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method 有权
公开(公告)号：US10486285B2
公开(公告)日：2019-11-26
申请号：US15601575
申请日：2017-05-22
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
IPC分类号： B24B37/34 , H01L21/677 , H01L21/306 , H01L21/67
CPC分类号： B24B37/345 , H01L21/30625 , H01L21/67219 , H01L21/67739 , H01L21/67742 , H01L21/67754 , Y10T137/0318 , Y10T137/8593
摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

32. 发明授权

US10438817B2 Cleaning apparatus and substrate processing apparatus 有权
公开(公告)号：US10438817B2
公开(公告)日：2019-10-08
申请号：US15403719
申请日：2017-01-11
申请人： Ebara Corporation
发明人： Haiyang Xu , Mitsuru Miyazaki
IPC分类号： H01L21/67 , B08B1/04 , B08B3/04
摘要： A cleaning apparatus includes: a cleaning chamber configured to clean a substrate; a transfer chamber positioned adjacent to the cleaning chamber and configured to transfer the substrate; a partition wall partitioning the cleaning chamber and the transfer chamber; a gutter fixed to the partition wall; and a discharge pipe connected to a bottom portion of the gutter. A first pass hole and a second pass hole positioned below the first pass hole are formed in the partition wall. The gutter is positioned between the first pass hole and the second pass hole, and extends from one side end to the other side end of the partition wall.

33. 发明授权

US09892953B2 Substrate gripping apparatus 有权
公开(公告)号：US09892953B2
公开(公告)日：2018-02-13
申请号：US14995952
申请日：2016-01-14
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Naoki Matsuda , Junji Kunisawa , Manao Hoshina
IPC分类号： B25B11/00 , H01L21/687
CPC分类号： H01L21/68728 , H01L21/68742 , H01L21/68785 , Y10T279/26
摘要： The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.

34. 发明申请

US20170372893A1 CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS 审中-公开
公开(公告)号：US20170372893A1
公开(公告)日：2017-12-28
申请号：US15631149
申请日：2017-06-23
申请人： Ebara Corporation
发明人： Koji Maeda , Hiroshi Shimomoto , Kuniaki Yamaguchi , Hiroshi Aono , Tetsuya Yashima , Hidetatsu Isokawa , Kenji Shinkai , Mitsuhiko Inaba , Koichi Hashimoto , Junji Kunisawa , Mitsuru Miyazaki , Fujihiko Toyomasu
IPC分类号： H01L21/02
摘要： The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

35. 发明授权

US09362129B2 Polishing apparatus and polishing method 有权
标题翻译：抛光设备和抛光方法
公开(公告)号：US09362129B2
公开(公告)日：2016-06-07
申请号：US14061673
申请日：2013-10-23
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Kenichi Kobayashi , Teruaki Hombo , Akira Imamura , Boyu Dong , Hiroyuki Shinozaki
IPC分类号： B24B37/10 , B24B37/30 , B24B37/34 , H01L21/306 , H01L21/67
CPC分类号： H01L21/30625 , B24B37/30 , B24B37/34 , B24B37/345 , H01L21/67051 , H01L21/67219
摘要： A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.
摘要翻译：抛光装置用于抛光诸如半导体晶片的基板的表面以平坦化基板的表面。抛光装置包括具有抛光表面的抛光台，以及顶环，其构造成保持基板的外周边缘由保持环包围并将基板压靠在抛光表面上。顶环可在抛光台上方的抛光位置，抛光台侧面的位置和清洁位置之间移动。抛光装置包括清洁单元，该清洁单元设置在清洁位置并且被配置为朝着正在旋转的顶环的下表面喷射清洁液体，由此清洁由顶环保持的基板与顶部的下表面环。

36. 发明授权

US09358662B2 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method 有权
公开(公告)号：US09358662B2
公开(公告)日：2016-06-07
申请号：US14309152
申请日：2014-06-19
申请人： Ebara Corporation
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
IPC分类号： H01L21/67 , H01L21/306 , B24B37/34 , H01L21/677
CPC分类号： B24B37/345 , H01L21/30625 , H01L21/67219 , H01L21/67739 , H01L21/67742 , H01L21/67754 , Y10T137/0318 , Y10T137/8593
摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

37. 发明申请

US20160133503A1 SUBSTRATE GRIPPING APPARATUS 审中-公开
标题翻译：基板搬运装置
公开(公告)号：US20160133503A1
公开(公告)日：2016-05-12
申请号：US14995952
申请日：2016-01-14
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Naoki Matsuda , Junji Kunisawa , Manao Hoshina
IPC分类号： H01L21/687
CPC分类号： H01L21/68728 , H01L21/68742 , H01L21/68785 , Y10T279/26
摘要： The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.
摘要翻译：本发明涉及一种基板夹持装置，其包括基座，可相对于基座垂直移动的多个支撑柱，构造成提升支撑柱的提升机构，以及安装到每个支撑柱上的基板保持器和基板引导构件支持岗位。每个支撑柱包括相对运动机构，该相对运动机构构造成当支撑柱向上移动时，使衬底保持器沿衬底保持器释放衬底的周边部分的方向移动，同时使衬底引导构件相对于衬底保持器升高并且当支撑柱向下移动时，使衬底保持器沿衬底保持器夹持衬底的周边部分的方向移动，同时相对于衬底保持器降低衬底引导构件。

38. 发明授权

US09269605B2 Substrate gripping apparatus 有权
标题翻译：基板夹持装置
公开(公告)号：US09269605B2
公开(公告)日：2016-02-23
申请号：US14150257
申请日：2014-01-08
申请人： EBARA CORPORATION
发明人： Mitsuru Miyazaki , Naoki Matsuda , Junji Kunisawa , Manao Hoshina
IPC分类号： H01L21/687
CPC分类号： H01L21/68728 , H01L21/68742 , H01L21/68785 , Y10T279/26
摘要： The present invention relates to a substrate gripping apparatus includes a base, a plurality of support posts which are vertically movable relative to the base, a lifting mechanism configured to lift the support posts, and a substrate holder and a substrate guide member mounted to each of the support posts. Each of the support posts includes a relative movement mechanism configured to move the substrate holder in such a direction that the substrate holder releases a peripheral portion of a substrate, while raising the substrate guide member relative to the substrate holder, when the support post moves upward, and to move the substrate holder in such a direction that the substrate holder grips the peripheral portion of the substrate, while lowering the substrate guide member relative to the substrate holder, when the support post moves downward.
摘要翻译：本发明涉及一种基板夹持装置，其包括基座，可相对于基座垂直移动的多个支撑柱，构造成提升支撑柱的提升机构，以及安装到每个支撑柱上的基板保持器和基板引导构件支持岗位。每个支撑柱包括相对运动机构，该相对运动机构构造成当支撑柱向上移动时，使衬底保持器沿衬底保持器释放衬底的周边部分的方向移动，同时使衬底引导构件相对于衬底保持器升高并且当支撑柱向下移动时，使衬底保持器沿衬底保持器夹持衬底的周边部分的方向移动，同时相对于衬底保持器降低衬底引导构件。

39. 发明申请

US20140373289A1 SUBSTRATE HOLDING APPARATUS AND SUBSTRATE CLEANING APPARATUS 有权
标题翻译：基板保持装置和基板清洁装置
公开(公告)号：US20140373289A1
公开(公告)日：2014-12-25
申请号：US14309287
申请日：2014-06-19
申请人： Ebara Corporation
发明人： Mitsuru Miyazaki , Takuya Inoue
IPC分类号： H01L21/687 , H01L21/67
CPC分类号： H01L21/67046 , H01L21/67051 , H01L21/687 , H01L21/68728
摘要： A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus includes: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate.
摘要翻译：公开了能够减少诸如晶片的基板的偏转量的基板保持装置。基板保持装置包括：多个卡盘，其构造成保持基板的周边边缘; 设置在所述基板下方的至少一个支撑构件; 以及致动装置，其构造成使得所述卡盘与所述基板的周边边缘接触，同时升高所述支撑构件以使所述支撑构件与所述基板的下表面接触，并且构造成使所述卡盘沿远离所述基板的方向移动同时降低支撑构件以将支撑构件分离离开衬底的下表面。

40. 发明授权

US12100587B2 Substrate cleaning apparatus and cleaning method of substrate 有权
公开(公告)号：US12100587B2
公开(公告)日：2024-09-24
申请号：US17068114
申请日：2020-10-12
申请人： EBARA CORPORATION
发明人： Fumitoshi Oikawa , Tomoaki Fujimoto , Mitsuru Miyazaki , Koichi Fukaya
IPC分类号： H01L21/02 , B08B1/32 , B08B3/10 , B08B13/00 , H01L21/67
CPC分类号： H01L21/02087 , B08B1/32 , B08B3/102 , B08B13/00 , H01L21/67017
摘要： A substrate cleaning apparatus has: a substrate rotating part that rotates a substrate; an edge cleaning member for cleaning an edge part of the substrate; an edge rotating part that rotates the edge cleaning member around an edge rotary shaft that extends in a direction orthogonal to a substrate rotary shaft; a moving part that moves a position of the edge cleaning member with respect to the edge part of the substrate; and a control part that controls the moving part to move the position of the edge cleaning member with respect to the edge part of the substrate, and causes the edge cleaning member to clean a one-side edge area including a face on one side, a side face area including a side face, and an another-side edge area including a face on another side in the edge part of the substrate.

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