会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明授权
    • MEMS on-chip inertial navigation system with error correction
    • 具有误差校正的MEMS片上惯性导航系统
    • US08151640B1
    • 2012-04-10
    • US12027247
    • 2008-02-06
    • Randall L. Kubena
    • Randall L. Kubena
    • G01C19/00
    • G01C19/5684
    • An on-chip navigation system, optionally combined with GPS (Global Positioning System) and/or an imaging array, which incorporates MEMS (MicroElectroMechanical Systems) components is possible by the use of careful material selection and novel bonding techniques used during fabrication. The use of MEMS components permits many of the components of a typical inertial navigation system to reside on a single chip. Because the components are in close proximity, the components can then be used to monitor the environmental changes of the chip, such as temperature and vibration, and correct for the resulting offsets of other components. This allows improved system performance even if the individual sensor components are not ideal.
    • 通过使用仔细的材料选择和在制造期间使用的新型结合技术,可以选择结合使用MEMS(微电子机械系统)部件的GPS(全球定位系统)和/或成像阵列的片上导航系统。 使用MEMS组件允许典型惯性导航系统的许多组件驻留在单个芯片上。 由于组件非常接近,因此可以使用组件来监视芯片的环境变化,例如温度和振动,并纠正其他组件产生的偏移。 这样即使各个传感器组件不理想,也可以提高系统性能。
    • 35. 发明授权
    • MEMS on-chip inertial navigation system with error correction
    • 具有误差校正的MEMS片上惯性导航系统
    • US08522612B1
    • 2013-09-03
    • US13410998
    • 2012-03-02
    • Randall L. Kubena
    • Randall L. Kubena
    • G01C19/00
    • G01C19/5684
    • An on-chip navigation system, optionally combined with GPS (Global Positioning System) and/or an imaging array, which incorporates MEMS (MicroElectroMechanical Systems) components is possible by the use of careful material selection and novel bonding techniques used during fabrication. The use of MEMS components permits many of the components of a typical inertial navigation system to reside on a single chip. Because the components are in close proximity, the components can then be used to monitor the environmental changes of the chip, such as temperature and vibration, and correct for the resulting offsets of other components. This allows improved system performance even if the individual sensor components are not ideal.
    • 通过使用仔细的材料选择和在制造期间使用的新型结合技术,可以选择结合使用MEMS(微电子机械系统)部件的GPS(全球定位系统)和/或成像阵列的片上导航系统。 使用MEMS组件允许典型惯性导航系统的许多组件驻留在单个芯片上。 由于组件非常接近,因此可以使用组件来监视芯片的环境变化,例如温度和振动,并纠正其他组件产生的偏移。 这样即使各个传感器组件不理想,也可以提高系统性能。
    • 37. 发明授权
    • Microgyro tuning using focused ion beams
    • 使用聚焦离子束进行微型调谐
    • US06698287B2
    • 2004-03-02
    • US10285886
    • 2002-11-01
    • Randall L. KubenaRichard JoyceRobert Thomas M'CloskeyA. Dorian Challoner
    • Randall L. KubenaRichard JoyceRobert Thomas M'CloskeyA. Dorian Challoner
    • G01C1900
    • G01C19/5719G01P2015/084
    • The present invention discloses methods of manufacturing mechanical resonator microgyroscopes using focused ion beam machining and the mechanical resonator gyroscopes produced therefrom. An exemplary method of tuning a mechanical resonator gyroscope, includes the steps of mounting a mechanical resonator gyroscope in a vacuum chamber with a controllable focused ion beam where the gyroscope includes exciting and sensing elements for measuring a resonant frequency of the gyroscope. The exciting and sensing elements are activated to measure the resonant frequency of the mechanical resonator gyroscope and the resonant frequency of the gyroscope is adjusted to a desired resonant frequency value by controlling the focused ion beam to remove material of the gyroscope.
    • 本发明公开了使用聚焦离子束加工和由其制造的机械谐振器陀螺仪制造机械谐振器微型光学器件的方法。 调谐机械谐振器陀螺仪的示例性方法包括以下步骤:将机械谐振器陀螺仪安装在具有可控聚焦离子束的真空室中,其中陀螺仪包括用于测量陀螺仪的谐振频率的激励和感测元件。 激励和感测元件被激活以测量机械谐振器陀螺仪的谐振频率,并且通过控制聚焦离子束以去除陀螺仪的材料,将陀螺仪的谐振频率调整到期望的谐振频率值。
    • 39. 发明授权
    • Method of fabricating quartz resonators
    • 石英谐振器的制造方法
    • US08176607B1
    • 2012-05-15
    • US12575634
    • 2009-10-08
    • Randall L. KubenaTsung-Yuan Hsu
    • Randall L. KubenaTsung-Yuan Hsu
    • H04R17/10B21D53/76
    • H04R17/00Y10T29/42Y10T29/49165Y10T29/49401
    • A method for fabricating VHF and/or UHF quartz resonators (for higher sensitivity) in a cartridges design with the quartz resonators requiring much smaller sample volumes than required by conventional resonators, and also enjoying smaller size and more reliable assembly. MEMS fabrication approaches are used to fabricate with quartz resonators in quartz cavities with electrical interconnects on a top side of a substrate for electrical connection to the electronics preferably through pressure pins in a plastic module. An analyte is exposed to grounded electrodes on a single side of the quartz resonators, thereby preventing electrical coupling of the detector signals through the analyte. The resonators can be mounted on the plastic cartridge or on arrays of plastic cartridges with the use of inert bonding material, die bonding or wafer bonding techniques. This allows the overall size, cost, and required biological sample volume to be reduced while increasing the sensitivity for detecting small mass changes.
    • 一种用于在墨盒设计中制造VHF和/或UHF石英谐振器(用于更高灵敏度)的方法,其中石英谐振器比常规谐振器要求的样品体积要小得多,并且还具有更小的尺寸和更可靠的组装。 MEMS制造方法用于在石英腔中制造石英谐振器,在基底的顶侧具有电互连,用于通过塑料模块中的压力引脚电连接到电子装置。 分析物暴露于石英谐振器单侧的接地电极,从而防止检测器信号通过分析物的电耦合。 谐振器可以使用惰性接合材料,管芯接合或晶片接合技术安装在塑料盒或塑料盒阵列上。 这允许减小整体尺寸,成本和所需的生物样品体积,同时增加用于检测小质量变化的灵敏度。
    • 40. 发明授权
    • Single crystal, dual wafer, tunneling sensor and a method of making same
    • 单晶,双晶,隧道传感器及其制造方法
    • US06730978B2
    • 2004-05-04
    • US10429988
    • 2003-05-06
    • Randall L. KubenaMichael J. LittleLeRoy H. Hackett
    • Randall L. KubenaMichael J. LittleLeRoy H. Hackett
    • H01L2714
    • B81C1/0015B81B2201/0292B81C2203/036H01H59/0009
    • A method of making a micro electromechanical switch or tunneling sensor. A cantilevered beam structure and a mating structure are defined on a first substrate or wafer; and at least one contact structure and a mating structure are defined on a second substrate or wafer, the mating structure on the second substrate or wafer being of a complementary shape to the mating structure on the first substrate or wafer. A bonding layer, preferably a eutectic bonding layer, is provided on at least one of the mating structures. The mating structure of the first substrate is moved into a confronting relationship with the mating structure of the second substrate or wafer. Pressure is applied between the two substrates so as to cause a bond to occur between the two mating structures at the bonding or eutectic layer. Then the first substrate or wafer is removed to free the cantilevered beam structure for movement relative to the second substrate or wafer.
    • 制造微机电开关或隧道传感器的方法。 在第一基板或晶片上限定悬臂梁结构和配合结构; 并且在第二衬底或晶片上限定至少一个接触结构和配合结构,所述第二衬底或晶片上的配合结构与第一衬底或晶片上的配合结构互补形状。 在至少一个配合结构上提供粘合层,优选共晶粘合层。 第一基板的配合结构被移动成与第二基板或晶片的配合结构面对面的关系。 在两个基板之间施加压力,以便在接合或共晶层处在两个配合结构之间发生结合。 然后移除第一衬底或晶片以释放悬臂梁结构以相对于第二衬底或晶片移动。