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    • 32. 发明授权
    • Coating particles in a centrifugal bed
    • 在离心床中涂覆颗粒
    • US5698081A
    • 1997-12-16
    • US568637
    • 1995-12-07
    • David S. LashmoreGlenn L. Beane
    • David S. LashmoreGlenn L. Beane
    • C25D3/12C25D3/56C25D3/58C25D7/00C25D17/06C25D17/00C25B9/00C25B15/00
    • C25D17/16
    • An apparatus and method are provided for coating particles in a rotating container. A cathode forms an electrically conductive inner surface of a side wall of the container. An anode is positioned relative to the cathode so as to permit both the cathode and the anode to be immersed together in an electrically conductive fluid. A motor is connected to the container and arranged to cause the container to rotate so as to generate a centrifugal force. Particles are placed in the container, the container is filled with the electrically conductive fluid, and electrical current is caused to pass from the cathode to the anode through the electrically conductive fluid while the container is rotated. The particles rest against the electrically conductive inner surface of the side wall of the container while the electrical current passes from the cathode to the anode, so as to result in deposition of a coating material from the electrically conductive fluid onto the particles.
    • 提供了一种在旋转容器中涂覆颗粒的装置和方法。 阴极形成容器的侧壁的导电内表面。 阳极相对于阴极定位,以便使阴极和阳极都能够在导电流体中浸没在一起。 电动机连接到容器并且被布置成使容器旋转以产生离心力。 将颗粒放置在容器中,容器中填充有导电流体,并且当容器旋转时,使电流通过导电流体从阴极传递到阳极。 当电流从阴极流到阳极时,颗粒靠在容器侧壁的导电内表面上,从而导致涂层材料从导电流体沉积到颗粒上。
    • 34. 发明授权
    • Process for electrodepositing metal and metal alloys on tungsten,
molybdenum and other difficult to plate metals
    • 金属和金属合金在钨,钼和其他难以镀金属上电沉积的工艺
    • US5456819A
    • 1995-10-10
    • US130533
    • 1993-10-01
    • David S. LashmoreDavid Kelley
    • David S. LashmoreDavid Kelley
    • C25D5/38
    • C25D5/38
    • This invention relates to an electrochemical treatment of metal substrates, including so-called "difficult to plate metals" such as tungsten and molybdenum, wherein deoxidation and plating are carried out in the same electrolyte bath by exploiting the electrochemical window in potential and pH of a reduction/deposition. This window may be illustrated using Pourbaix diagrams. In the first step of the treatment, a direct current at a reduction potential is applied to the substrate to reduce oxides present on the surface of the substrate without causing metal to be deposited from the electrolyte. In the second step, the reduction potential is changed to a more negative deposition potential, and a direct current at this deposition potential is applied for a time sufficient to deposit metal from the electrolyte.
    • 本发明涉及金属基板的电化学处理,包括所谓的“难以平板的金属”如钨和钼,其中脱氧和电镀是在相同的电解液浴中进行的,这是通过利用电位的电化学窗口和pH 还原/沉积。 这个窗口可以用Pourbaix图来说明。 在处理的第一步骤中,将还原电位的直流电流施加到衬底上以还原存在于衬底表面上的氧化物,而不会导致从电解质中沉积金属。 在第二步骤中,将还原电位改变为更负的沉积电位,并且在该沉积电位下施加足以从电解质沉积金属的时间的直流电。