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31. 发明授权

US08410371B2 Electronic device submounts with thermally conductive vias and light emitting devices including the same 有权
标题翻译：具有导热通孔的电子设备基座和包括该通孔的发光器件
公开(公告)号：US08410371B2
公开(公告)日：2013-04-02
申请号：US12555218
申请日：2009-09-08
申请人： Peter S. Andrews , Theodore D. Lowes , Robert D. Underwood
发明人： Peter S. Andrews , Theodore D. Lowes , Robert D. Underwood
IPC分类号： H05K7/20 , H05K1/16
CPC分类号： H01L33/642 , H01L23/3677 , H01L23/3735 , H01L24/48 , H01L33/641 , H01L2224/48091 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/12044 , H01L2924/181 , Y10T29/49155 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A submount for an electronic device includes an electrically insulating substrate including first and second surfaces and having a thickness between the first and second surfaces, a thermally conductive pad on the first surface of the substrate, and a thermally conductive via extending from the first surface of the substrate toward the second surface of the substrate and having a length that is less than the thickness of the substrate. The thermally conductive via has a higher thermal conductivity than a thermal conductivity of the substrate. Methods of forming submounts are also disclosed.
摘要翻译：一种用于电子设备的基座包括电绝缘基板，其包括第一表面和第二表面，并且具有在第一和第二表面之间的厚度，在基板的第一表面上的导热焊盘和从第一表面的第一表面延伸的导热通孔所述基板朝向所述基板的第二表面并且具有小于所述基板的厚度的长度。导热通孔具有比基板的热导率更高的热导率。还公开了形成底座的方法。

32. 发明授权

US08941125B2 Light emitting devices for light conversion and semiconductor chips for fabricating the same 有权
标题翻译：用于光转换的发光器件和用于制造它的半导体芯片
公开(公告)号：US08941125B2
公开(公告)日：2015-01-27
申请号：US12173393
申请日：2008-07-15
申请人： Peter S. Andrews
发明人： Peter S. Andrews
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00 , H01L33/50 , H01L33/20
CPC分类号： H01L33/508 , H01L33/20
摘要： Broad spectrum light emitting devices and methods and semiconductor chips for fabricating such devices include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies. The light emitting element includes a shaped substrate suitable for light extraction through the substrate and a cavity in the substrate proximate the light emitting element. For example, a trench adjacent the light emitting element may be provided. The cavity/trench is configured to contain light conversion material such that light extracted from sidewalls of the cavity/trench passes through the light conversion material contained in the cavity/trench. Methods of fabricating such devices and/or chips are also provided.
摘要翻译：用于制造这种器件的广谱发光器件和方法以及半导体芯片包括发射预定频率范围内的光的诸如二极管或激光器的发光元件。发光元件包括适合于通过基板的光提取的成形基板和靠近发光元件的基板中的空腔。例如，可以提供与发光元件相邻的沟槽。空腔/沟槽被配置为容纳光转换材料，使得从空腔/沟槽的侧壁提取的光通过包含在空腔/沟槽中的光转换材料。还提供了制造这种装置和/或芯片的方法。

33. 发明授权

US08333631B2 Methods for combining light emitting devices in a package and packages including combined light emitting devices 有权
标题翻译：用于组合封装中的发光器件和包括组合发光器件的封装的方法
公开(公告)号：US08333631B2
公开(公告)日：2012-12-18
申请号：US12838677
申请日：2010-07-19
申请人： David Todd Emerson , Bernd P. Keller , Mark McOlear , Peter S. Andrews
发明人： David Todd Emerson , Bernd P. Keller , Mark McOlear , Peter S. Andrews
IPC分类号： H01J9/00 , H01J1/62 , F21V9/00
CPC分类号： H05B33/0857 , F21K9/00 , F21Y2105/10 , F21Y2105/12 , F21Y2113/13 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space within a 10-step MacAdam ellipse of a target chromaticity point, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within the defined chromaticity region, selecting at least three of the plurality of light emitting devices, wherein each of the three light emitting devices emits light from a different one of the chromaticity subregions. The at least three light emitting devices are selected from chromaticity subregions that are complementary relative to the target chromaticity point to at least one other chromaticity subregion from which a light emitting device is selected.
摘要翻译：形成发光器件封装组件的方法包括在目标色度点的10步MacAdam椭圆内限定二维色度空间中的色度区域，并将定义的色度区域细分为至少三个色度子区域，提供多个发射具有落入规定色度区域内的色度的光的发光装置，选择所述多个发光装置中的至少三个，其中，所述三个发光装置中的每一个从所述色度子区域中的不同一个发射光。所述至少三个发光器件选自相对于目标色度点互补的色度子区域，所述色度子区域至少选择了发光器件的至少一个其他色度子区域。

34. 发明申请

US20120306351A1 LED-Array Light Source with Aspect Ratio Greater Than 1 有权
标题翻译： LED阵列光源，长宽比大于1
公开(公告)号：US20120306351A1
公开(公告)日：2012-12-06
申请号：US13441558
申请日：2012-04-06
申请人： Kurt S. Wilcox , Bernd Keller , Ted Lowes , Peter S. Andrews
发明人： Kurt S. Wilcox , Bernd Keller , Ted Lowes , Peter S. Andrews
IPC分类号： H05B33/02
CPC分类号： G09F9/33 , G09F19/228
摘要： An LED light source for use in LED lighting fixtures, the LED light source comprising a submount including an LED-populated area which has an aspect ratio greater than 1, an array of LEDs on the LED-populated area, and a lens on the submount over the LED-populated area. Various embodiments facilitating preferential-side lighting, such as for roadway uses, are also disclosed.
摘要翻译：一种用于LED照明灯具的LED光源，所述LED光源包括基座，所述底座包括具有大于1的纵横比的LED居住区域，所述LED填充区域上的LED阵列和所述底座上的透镜在LED居民区。还公开了诸如用于道路使用的优选侧照明的各种实施例。

35. 发明申请

US20120068594A1 Semiconductor Light Emitting Devices with Densely Packed Phosphor Layer at Light Emitting Surface 有权
标题翻译：半导体发光器件在发光面处密封磷光体层
公开(公告)号：US20120068594A1
公开(公告)日：2012-03-22
申请号：US12887097
申请日：2010-09-21
申请人： James Ibbetson , Peter S. Andrews
发明人： James Ibbetson , Peter S. Andrews
IPC分类号： H01J1/62 , H01J9/00
CPC分类号： H01L33/50 , F21K9/64 , H01L33/501 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2933/0041 , H05B33/10 , H01L2924/00014
摘要： An LED includes a chip having a light emitting surface, and a coating of phosphor-containing material on the light emitting surface. Phosphor particles are arranged in a densely packed layer within the coating at the light emitting surface, and such that the light emitting surface is in contacting relationship with the phosphor particles.
摘要翻译： LED包括具有发光表面的芯片和在发光表面上的含磷光体材料的涂层。荧光体颗粒被布置在发光表面的涂层内的密集堆积层中，并且使得发光表面与荧光体颗粒处于接触关系。

36. 发明申请

US20120061702A1 Submounts for Semiconductor Light Emitting Devices and Methods of Forming Packaged Light Emitting Devices Including Dispensed Encapsulants 有权
标题翻译：用于半导体发光器件的基座和形成封装发光器件的方法，包括分配密封剂
公开(公告)号：US20120061702A1
公开(公告)日：2012-03-15
申请号：US13149197
申请日：2011-05-31
申请人： Peter S. Andrews , Ban P. Loh , Nicholas W. Medendorp, JR. , Bernd P. Keller
发明人： Peter S. Andrews , Ban P. Loh , Nicholas W. Medendorp, JR. , Bernd P. Keller
IPC分类号： H01L33/58 , H01L33/52
CPC分类号： H01L33/54 , H01L33/486 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/10253 , H01L2924/181 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.
摘要翻译：用于安装LED芯片的基座包括：衬底，被配置为在衬底的上表面上接收LED芯片的管芯附接焊盘;围绕裸片安装焊盘的衬底上的第一弯液面控制特征，并且限定第一密封剂区域并且衬底上的第二弯液面控制特征包围第一密封剂区域并且限定衬底的上表面的第二密封剂区域。第一和第二弯液面控制特征可以与管芯附接垫基本共面。封装的LED包括如上所述的基座，并且还包括在芯片附接垫上的LED芯片，在第一密封剂区域内的衬底上的第一密封剂，以及在第二密封剂区域内的衬底上的第二密封剂，并且覆盖第一密封剂。还公开了方法实施例。

37. 发明申请

US20110089456A1 SEMICONDUCTOR LIGHT EMITTING DEVICES WITH APPLIED WAVELENGTH CONVERSION MATERIALS AND METHODS FOR FORMING THE SAME 有权
标题翻译：具有应用波长转换材料的半导体发光器件及其形成方法
公开(公告)号：US20110089456A1
公开(公告)日：2011-04-21
申请号：US12976769
申请日：2010-12-22
申请人： Peter S. Andrews , Ronan P. Le Toquin , James Ibbetson
发明人： Peter S. Andrews , Ronan P. Le Toquin , James Ibbetson
IPC分类号： H01L33/50 , H01L33/52
CPC分类号： H01L33/508 , H01L33/20 , H01L33/504 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor structure includes an active region configured to emit light upon the application of a voltage thereto, a window layer configured to receive the light emitted by the active region, and a plurality of discrete phosphor-containing regions on the window layer and configured to receive light emitted by the active region and to convert at least a portion of the received light to a different wavelength than a wavelength of light emitted by the active region. Methods of forming a semiconductor structure including an active region configured to emit light and a window layer include forming a plurality of discrete phosphor-containing regions on the window layer.
摘要翻译：半导体结构包括被配置为在施加电压时发光的有源区，被配置为接收由有源区发射的光的窗口层和窗口层上的多个离散的含磷光体的区域，并且被配置为接收由有源区发射的光并将至少一部分接收的光转换成与由有源区发射的光的波长不同的波长。形成包括被配置为发光的有源区域和窗口层的半导体结构的方法包括在窗口层上形成多个离散的含磷光体区域。

38. 发明授权

US07405094B2 Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same 有权
标题翻译：用于光转换的发光器件及其制造方法和半导体芯片
公开(公告)号：US07405094B2
公开(公告)日：2008-07-29
申请号：US11011545
申请日：2004-12-14
申请人： Peter S. Andrews
发明人： Peter S. Andrews
IPC分类号： H01L21/00
CPC分类号： H01L33/508 , H01L33/20
摘要： Broad spectrum light emitting devices and methods and semiconductor chips for fabricating such devices include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies. The light emitting element includes a shaped substrate suitable for light extraction through the substrate and a cavity in the substrate proximate the light emitting element. For example, a trench adjacent at least a portion of the periphery of the light emitting element may be provided. The cavity/trench is configured to contain light conversion material such that light extracted from sidewalls of the cavity/trench passes through the light conversion material contained in the cavity/trench. Methods of fabricating such devices and/or chips are also provided.
摘要翻译：用于制造这种器件的广谱发光器件和方法以及半导体芯片包括发射预定频率范围内的光的诸如二极管或激光器的发光元件。发光元件包括适合于通过基板的光提取的成形基板和靠近发光元件的基板中的空腔。例如，可以提供与发光元件的周边的至少一部分相邻的沟槽。空腔/沟槽被配置为容纳光转换材料，使得从空腔/沟槽的侧壁提取的光通过包含在空腔/沟槽中的光转换材料。还提供了制造这种装置和/或芯片的方法。

39. 发明授权

US06885033B2 Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same 有权
公开(公告)号：US06885033B2
公开(公告)日：2005-04-26
申请号：US10385034
申请日：2003-03-10
申请人： Peter S. Andrews
发明人： Peter S. Andrews
IPC分类号： H01L33/20 , H01L33/50 , H01L33/00
CPC分类号： H01L33/508 , H01L33/20
摘要： Broad spectrum light emitting devices and methods and semiconductor chips for fabricating such devices include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies. The light emitting element includes a shaped substrate suitable for light extraction through the substrate and a cavity in the substrate proximate the light emitting element. For example, a trench adjacent at least a portion of the periphery of the light emitting element may be provided. The cavity/trench is configured to contain light conversion material such that light extracted from sidewalls of the cavity/trench passes through the light conversion material contained in the cavity/trench. Methods of fabricating such devices and/or chips are also provided.

40. 发明授权

US09754926B2 Light emitting diode (LED) arrays including direct die attach and related assemblies 有权
公开(公告)号：US09754926B2
公开(公告)日：2017-09-05
申请号：US13027006
申请日：2011-02-14
申请人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
发明人： Matthew Donofrio , John Adam Edmond , Hua-Shuang Kong , Peter S. Andrews , David Todd Emerson
IPC分类号： H01L27/15 , H01L25/075 , H01L33/50 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/62 , H01L2224/16
摘要： An electronic device may include a packaging substrate having a packaging substrate face with a plurality of electrically conductive pads on the packaging substrate face. A first light emitting diode die may bridge first and second ones of the electrically conductive pads. More particularly, the first light emitting diode die may include first anode and cathode contacts respectively coupled to the first and second electrically conductive pads using metallic bonds. Moreover, widths of the metallic bonds between the first anode contact and the first pad and between the first cathode contact and the second pad may be at least 60 percent of a width of the first light emitting diode die. A second light emitting diode die may bridge third and fourth ones of the electrically conductive pads. The second light emitting diode die may include second anode and cathode contacts respectively coupled to the third and fourth electrically conductive pads using metallic bonds. Widths of the metallic bonds between the second anode contact and the second pad and between the second cathode contact and the third pad may be at least 60 percent of a width of the first light emitting diode die.

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