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31. 发明申请

US20120032216A1 Light Emitting Diode Package Structure 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20120032216A1
公开(公告)日：2012-02-09
申请号：US13107872
申请日：2011-05-13
申请人： Chao-Hsien Dong , Chien-Chang Pei
发明人： Chao-Hsien Dong , Chien-Chang Pei
IPC分类号： H01L33/58
CPC分类号： H01L33/58 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Embodiments of a light emitting diode (LED) package structure are provided. In one aspect, an LED package structure includes a base, at least one LED chip, a blocking plate, and a transparent cover plate. The LED chip is disposed on and electrically coupled to the base. The blocking plate is disposed on the base and surrounds the LED chip. The blocking plate has an opening for exposing the LED chip. The blocking plate comprises a light-absorbing material that is opaque. The transparent cover plate is disposed on the blocking plate and covers the opening of the blocking plate.
摘要翻译：提供了一种发光二极管（LED）封装结构的实施例。一方面，LED封装结构包括基底，至少一个LED芯片，阻挡板和透明盖板。 LED芯片设置在电连接到基座上。阻挡板设置在基座上并围绕LED芯片。阻挡板具有用于暴露LED芯片的开口。阻挡板包括不透明的光吸收材料。透明盖板设置在挡板上并覆盖挡板的开口。

32. 发明申请

US20110255030A1 Light Emitting Diode Module 失效
标题翻译：发光二极管模块
公开(公告)号：US20110255030A1
公开(公告)日：2011-10-20
申请号：US13118564
申请日：2011-05-30
申请人： Chien-Chang Pei
发明人： Chien-Chang Pei
IPC分类号： G02F1/13357 , F21S4/00
CPC分类号： H05K3/0061 , F21K9/00 , F21V19/003 , F21V29/503 , F21V29/89 , F21Y2103/10 , F21Y2115/10 , G02F2001/133628 , H05K2201/10106 , H05K2201/10393
摘要： Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board.
摘要翻译：描述照明模块的各种实施例。一方面，照明模块包括金属支架，电路板和多个发光二极管。金属支撑件在侧壁上具有凹槽，侧壁和多个孔。电路板被固定在金属支撑件的凹部的底部，并且在两个长边的每一个上具有两个长边，两个短边和相应的多个凸缘。凸缘插入金属支架的孔中以压缩电路板和金属支架。发光二极管设置在电路板上。

33. 发明授权

US07982308B2 Light-emitting diode packaging structure and light-emitting diode module 有权
标题翻译：发光二极管封装结构和发光二极管模块
公开(公告)号：US07982308B2
公开(公告)日：2011-07-19
申请号：US12076487
申请日：2008-03-19
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L23/34
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.
摘要翻译：公开了一种发光二极管封装结构，封装模块及其组装方法。组装方法包括以下步骤：提供发光二极管，其中发光二极管具有两个电极引线; 提供两个金属板，其中每个金属板具有至少一个夹紧部分; 将电极引线分别固定在金属板上; 并且弯曲每个金属板的夹紧部分以将电极引线固定在金属板上。此外，允许多个发光二极管安装在金属板上以形成发光二极管封装模块。

34. 发明申请

US20090166661A1 Light-emitting diode packaging structure and module and assembling method thereof 有权
标题翻译：发光二极管封装结构及模块及其组装方法
公开(公告)号：US20090166661A1
公开(公告)日：2009-07-02
申请号：US12076487
申请日：2008-03-19
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode packaging structure, a packaging module and the assembling method thereof are disclosed. The assembling method comprises the steps of: providing a light-emitting diode, wherein the light-emitting diode has two electrode leads; providing two metal plates, wherein each of the metal plates has at least a clamping portion; holding the electrode leads against the metal plates respectively; and bending the clamping portion of each of the metal plates to fix the electrode leads on the metal plates. Further, a plurality of light-emitting diodes are allowed to be mounted on the metal plates to form the light-emitting diode packaging module.
摘要翻译：公开了一种发光二极管封装结构，封装模块及其组装方法。组装方法包括以下步骤：提供发光二极管，其中发光二极管具有两个电极引线; 提供两个金属板，其中每个金属板具有至少一个夹紧部分; 将电极引线分别固定在金属板上; 并且弯曲每个金属板的夹紧部分以将电极引线固定在金属板上。此外，允许多个发光二极管安装在金属板上以形成发光二极管封装模块。

35. 外观设计

USD646419S1 Lampshade of a street lamp 有权
标题翻译：路灯的灯罩
公开(公告)号：USD646419S1
公开(公告)日：2011-10-04
申请号：US29363384
申请日：2010-06-08
申请人： Jen-Ta Chiang , Chien-Chang Pei , Pet-Hsuan Chen
设计人： Jen-Ta Chiang , Chien-Chang Pei , Pet-Hsuan Chen

36. 发明授权

US08013358B2 Light emitting diode 失效
标题翻译：发光二极管
公开(公告)号：US08013358B2
公开(公告)日：2011-09-06
申请号：US12606051
申请日：2009-10-26
申请人： Chien-Chang Pei
发明人： Chien-Chang Pei
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48227 , H01L2224/49113 , H01L2924/09701 , H01L2924/3025 , H01L2924/00
摘要： The invention provides a light emitting diode. The light emitting diode includes a ceramic substrate having a first surface and an opposite second surface. A first conductive trace metal layer and a second conductive trace metal layer are disposed on the first surface of the ceramic substrate. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate, respectively and electrically connected to the first and second conductive trace metal layers. A plurality of thermal metal pads is disposed on the second surface of the ceramic substrate, wherein the thermal metal pads are electrically isolated from the light emitting diode chip.
摘要翻译：本发明提供一种发光二极管。发光二极管包括具有第一表面和相对的第二表面的陶瓷基板。第一导电迹线金属层和第二导电迹线金属层设置在陶瓷基板的第一表面上。至少一个发光二极管芯片分别设置在陶瓷基板的第一表面上并电连接到第一和第二导电迹线金属层。多个热金属焊盘设置在陶瓷衬底的第二表面上，其中热金属焊盘与发光二极管芯片电隔离。

37. 发明授权

US08294263B2 Light-emitting diode packaging structure and module and assembling method thereof 有权
标题翻译：发光二极管封装结构及模块及其组装方法
公开(公告)号：US08294263B2
公开(公告)日：2012-10-23
申请号：US13149309
申请日：2011-05-31
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L23/34
CPC分类号： H01L33/62 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.
摘要翻译：发光二极管封装结构包括发光二极管和安装有发光二极管的第一和第二金属板。发光二极管包括第一和第二电极引线，第二电极引线在第二电极引线的外边缘上具有第一和第二接触表面。第一金属板包括夹持并固定第一金属板上的第一电极引线的至少一个夹持部分。第二金属板至少包括第一和第二夹紧部分。第二电极引线的第一接触表面接触第一夹持部分，第二电极引线的第二接触表面接触第二夹持部分，使得发光二极管至少在两个维度上固定在第二金属板上平行于其上安装有发光二极管的第二金属板的主表面。

38. 发明授权

US08143642B2 Light emitting diode 失效
标题翻译：发光二极管
公开(公告)号：US08143642B2
公开(公告)日：2012-03-27
申请号：US13149704
申请日：2011-05-31
申请人： Chien-Chang Pei
发明人： Chien-Chang Pei
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48227 , H01L2224/49113 , H01L2924/09701 , H01L2924/3025 , H01L2924/00
摘要： The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip.
摘要翻译：本发明提供一种发光二极管。发光二极管包括具有第一表面和相对的第二表面的基板。至少一个发光二极管芯片设置在陶瓷基板的第一表面上。多个热金属焊盘设置在衬底的第二表面上，其中热金属焊盘与至少一个发光二极管芯片电隔离。

39. 发明申请

US20110198663A1 STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF 有权
标题翻译：发光二极管的结构及其组装方法
公开(公告)号：US20110198663A1
公开(公告)日：2011-08-18
申请号：US13095059
申请日：2011-04-27
申请人： Sheng-Jia Sheu , Chien-Chang Pei
发明人： Sheng-Jia Sheu , Chien-Chang Pei
IPC分类号： H01L33/62
CPC分类号： H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
摘要： A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.
摘要翻译：提供发光二极管的结构。在一个方面，发光二极管结构包括发光二极管，导电框架和基板。导电框架电连接到发光二极管，并且具有连接导电框架的第一侧和导电框架与第一侧相对的第二侧的固定孔。固定孔具有梯形内侧壁，其内侧壁的第一半径与第一侧相邻，小于邻近第二侧的内侧壁的第二半径。衬底具有通过从导电框架的第一侧进入固定孔而被固定在固定孔中的导电柱，并使其导电柱粘附到固定孔的梯形内侧壁。

40. 发明申请

US20090085051A1 Light emitting diode device 审中-公开
标题翻译：发光二极管装置
公开(公告)号：US20090085051A1
公开(公告)日：2009-04-02
申请号：US12078490
申请日：2008-04-01
申请人： Chung-Chuan Hsieh , Chien-Chang Pei , Chia-Hsien Chang
发明人： Chung-Chuan Hsieh , Chien-Chang Pei , Chia-Hsien Chang
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48247 , H01L2924/19107 , H01L2224/48091 , H01L2924/00014
摘要： A light emitting diode device includes a light emitting diode chip, a thermal conducting part, two electric conducting parts and two first conducting wires. The light emitting diode chip has a surface and two electrodes disposed on the surface. The thermal conducting part is electrically insulated to the electrodes. The thermal conducting part includes a core bearing the light emitting diode chip, and four outward lead-frames connected to the core. The electric conducting parts are electrically insulated to the thermal conducting part. The first conducting wires have ends electrically connected to the electrodes.
摘要翻译：发光二极管器件包括发光二极管芯片，导热部件，两个导电部件和两个第一导线。发光二极管芯片具有设置在表面上的表面和两个电极。导热部分与电极电绝缘。导热部件包括承载发光二极管芯片的芯和连接到芯的四个外部引线框架。导电部件与导热部件电绝缘。第一导线具有电连接到电极的端部。

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