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31. 发明申请

US20130293337A1 HIGH QUALITY FACTOR PLANAR INDUCTORS 审中-公开
标题翻译：高质量因子平面电感器
公开(公告)号：US20130293337A1
公开(公告)日：2013-11-07
申请号：US13463583
申请日：2012-05-03
申请人： Chi Shun Lo , Wesley Nathaniel Allen , Jonghae Kim , Je-Hsiung Jeffrey Lan , Ravindra V. Shenoy , Justin Phelps Black , Chengjie Zuo , Changhan Hobie Yun
发明人： Chi Shun Lo , Wesley Nathaniel Allen , Jonghae Kim , Je-Hsiung Jeffrey Lan , Ravindra V. Shenoy , Justin Phelps Black , Chengjie Zuo , Changhan Hobie Yun
IPC分类号： H01F5/00 , H01F41/04
CPC分类号： H01F5/003 , H01F41/041 , Y10T29/4902
摘要： This disclosure provides systems, methods, and apparatus related to inductors. In one aspect, a planar inductor may include a substrate with a spacer in the shape of a planar spiral coil on a surface of the substrate. Disposed on the spacer may be a line of metal formed as a planar inductor in the shape of the planar spiral coil. The spacer may be between the line of metal and the surface of the substrate. The spacer may elevate the line of metal above the surface of the substrate.
摘要翻译：本公开提供了与电感器相关的系统，方法和装置。一方面，平面电感器可以包括在衬底的表面上具有平面螺旋线圈形状的间隔物的衬底。设置在间隔件上的金属线可以是形成为平面螺旋线圈形状的平面电感器的金属线。间隔物可以在金属线和基底的表面之间。间隔物可以将衬底上的金属线提升。

32. 发明申请

US20130293336A1 THREE-DIMENSIONAL MULTILAYER SOLENOID TRANSFORMER 有权
标题翻译：三维多层电磁变压器
公开(公告)号：US20130293336A1
公开(公告)日：2013-11-07
申请号：US13463257
申请日：2012-05-03
申请人： Chi Shun Lo , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun
发明人： Chi Shun Lo , Jonghae Kim , Chengjie Zuo , Changhan Hobie Yun
IPC分类号： H01F5/00 , H01F41/00
CPC分类号： H05K3/465 , H01F27/2804 , H01F2017/002 , H01F2017/004
摘要： This disclosure provides implementations of inductors, transformers, and related processes. In one aspect, a device includes a substrate having first and second surfaces. A first inducting arrangement includes a first set of vias, a second set of vias, a first set of traces arranged over the first surface connecting the first and second vias, and a second set of traces arranged over the second surface connecting the first and second vias. A second inducting arrangement is inductively-coupled and interleaved with the first inducting arrangement and includes a third set of vias, a fourth set of vias, a third set of traces arranged over the first surface connecting the third and fourth vias, and a fourth set of traces arranged over the second surface connecting the third and fourth vias. One or more sets of dielectric layers insulate portions of the traces from one another.
摘要翻译：本公开提供了电感器，变压器和相关过程的实现。一方面，一种装置包括具有第一表面和第二表面的基底。第一感应装置包括第一组通孔，第二组通孔，布置在连接第一和第二通孔的第一表面上的第一组迹线，以及布置在第二表面上的第二组迹线，该第二组迹线连接第一和第二通孔通孔第二感应装置与第一感应装置电感耦合和交错，并且包括第三组通孔，第四组通孔，布置在连接第三和第四通孔的第一表面上的第三组迹线和第四组布置在连接第三和第四通孔的第二表面上的迹线。一组或多组电介质层将迹线的一部分彼此绝缘。

33. 发明申请

US20120268440A1 WIDENING RESONATOR BANDWIDTH USING MECHANICAL LOADING 失效
标题翻译：使用机械装载的宽带谐振器带宽
公开(公告)号：US20120268440A1
公开(公告)日：2012-10-25
申请号：US13090790
申请日：2011-04-20
申请人： Changhan Hobie Yun , Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Jonghae Kim
发明人： Changhan Hobie Yun , Chengjie Zuo , Chi Shun Lo , Sanghoon Joo , Jonghae Kim
IPC分类号： H03H9/17 , G09G3/00 , G06F3/038
CPC分类号： H03H9/172 , G02B26/001 , H03H9/02062 , H03H9/02228 , H03H9/02338
摘要： This disclosure provides systems, apparatus and techniques by which electromechanical resonators are implemented. In one aspect, by mechanically loading the resonator body in specific ways, multiple resonance modes are created within the resonator body resulting in wider bandwidths.
摘要翻译：本公开提供了实现机电谐振器的系统，装置和技术。在一个方面，通过以特定方式机械负载谐振器本体，在谐振器本体内产生多个谐振模式，从而产生更宽的带宽。

34. 发明授权

US08471643B2 Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation 失效
标题翻译：具有压电轮廓模式谐振器的机电系统振荡器用于多频发生
公开(公告)号：US08471643B2
公开(公告)日：2013-06-25
申请号：US13107764
申请日：2011-05-13
申请人： Jonghae Kim , Je-Hsiung Lan , Changhan Yun , Chi Shun Lo , Matthew Nowak
发明人： Jonghae Kim , Je-Hsiung Lan , Changhan Yun , Chi Shun Lo , Matthew Nowak
IPC分类号： H03B5/30
CPC分类号： H03H9/2426 , H03H9/02228 , H03H9/2405 , H03H9/462 , H03H2009/241
摘要： Electromechanical systems resonator structures, devices, circuits, and systems are disclosed. In one aspect, an oscillator includes an active component and a passive component connected in a feedback configuration. The passive component includes one or more contour mode resonators (CMR). A CMR includes a piezoelectric layer disposed between a first conductive layer and a second conductive layer. The conductive layers include an input electrode and an output electrode. The passive component is configured to output a first resonant frequency and a second resonant frequency, which is an odd integer harmonic of the first resonant frequency. The active component is configured to output a signal including the first resonant frequency and the second resonant frequency. This output signal can be a substantially square wave signal, which can serve as a clock in various applications.
摘要翻译：公开了机电系统谐振器结构，器件，电路和系统。一方面，振荡器包括以反馈配置连接的有源部件和无源部件。无源部件包括一个或多个轮廓模式谐振器（CMR）。 CMR包括设置在第一导电层和第二导电层之间的压电层。导电层包括输入电极和输出电极。无源部件被配置为输出第一谐振频率和第二谐振频率，其是第一谐振频率的奇整数谐波。有源部件被配置为输出包括第一谐振频率和第二谐振频率的信号。该输出信号可以是基本上为方波信号，其可以用作各种应用中的时钟。

35. 发明申请

US20120293520A1 PIEZOELECTRIC RESONATORS WITH CONFIGURATIONS HAVING NO GROUND CONNECTIONS TO ENHANCE ELECTROMECHANICAL COUPLING 审中-公开
标题翻译：具有无接地连接的配置的压电谐振器，以增强机电耦合
公开(公告)号：US20120293520A1
公开(公告)日：2012-11-22
申请号：US13111683
申请日：2011-05-19
申请人： Changhan Yun , Sang-June Park , Chi Shun Lo , Jonghae Kim , Je-Hsiung Lan , Sanghoon Joo
发明人： Changhan Yun , Sang-June Park , Chi Shun Lo , Jonghae Kim , Je-Hsiung Lan , Sanghoon Joo
IPC分类号： G06T1/00 , H03H9/17
CPC分类号： H03H9/173 , H03H9/02228
摘要： This disclosure provides implementations of electromechanical systems resonator structures, devices, apparatus, systems, and related processes. In one aspect, resonator apparatus includes a first conductive layer including a first electrode and a second electrode. The first electrode is coupled to receive a first input signal, and the second electrode is coupled to provide a first output signal. A piezoelectric layer includes a piezoelectric material. The piezoelectric layer has a first side and a second side opposite the first side. The first side is proximate the first conductive layer, and the second side is electrically isolated from ground. In some examples, the second side of the piezoelectric layer can be exposed and/or electrically de-coupled from one or more components.
摘要翻译：本公开提供了机电系统谐振器结构，设备，装置，系统和相关过程的实现。在一个方面，谐振器装置包括包括第一电极和第二电极的第一导电层。第一电极被耦合以接收第一输入信号，并且第二电极被耦合以提供第一输出信号。压电层包括压电材料。压电层具有与第一侧相对的第一侧和第二侧。第一侧靠近第一导电层，第二侧与地电隔离。在一些示例中，压电层的第二面可以暴露和/或从一个或多个部件电脱耦合。

36. 发明申请

US20120286886A1 Electromechanical Systems Oscillator with Piezoelectric Contour Mode Resonator for Multiple Frequency Generation 失效
标题翻译：机电系统振荡器用于多频发生的压电轮廓模式谐振器
公开(公告)号：US20120286886A1
公开(公告)日：2012-11-15
申请号：US13107764
申请日：2011-05-13
申请人： Jonghae Kim , Je-Hsiung Lan , Changhan Yun , Chi Shun Lo , Matthew Nowak
发明人： Jonghae Kim , Je-Hsiung Lan , Changhan Yun , Chi Shun Lo , Matthew Nowak
IPC分类号： H03B7/14
CPC分类号： H03H9/2426 , H03H9/02228 , H03H9/2405 , H03H9/462 , H03H2009/241
摘要： Electromechanical systems resonator structures, devices, circuits, and systems are disclosed. In one aspect, an oscillator includes an active component and a passive component connected in a feedback configuration. The passive component includes one or more contour mode resonators (CMR). A CMR includes a piezoelectric layer disposed between a first conductive layer and a second conductive layer. The conductive layers include an input electrode and an output electrode. The passive component is configured to output a first resonant frequency and a second resonant frequency, which is an odd integer harmonic of the first resonant frequency. The active component is configured to output a signal including the first resonant frequency and the second resonant frequency. This output signal can be a substantially square wave signal, which can serve as a clock in various applications.
摘要翻译：公开了机电系统谐振器结构，器件，电路和系统。一方面，振荡器包括以反馈配置连接的有源部件和无源部件。无源部件包括一个或多个轮廓模式谐振器（CMR）。 CMR包括设置在第一导电层和第二导电层之间的压电层。导电层包括输入电极和输出电极。无源部件被配置为输出第一谐振频率和第二谐振频率，其是第一谐振频率的奇整数谐波。有源部件被配置为输出包括第一谐振频率和第二谐振频率的信号。该输出信号可以是基本上为方波信号，其可以用作各种应用中的时钟。

37. 发明授权

US08384507B2 Through via inductor or transformer in a high-resistance substrate with programmability 有权
标题翻译：通过电感或变压器在高电阻基板上具有可编程性
公开(公告)号：US08384507B2
公开(公告)日：2013-02-26
申请号：US12791023
申请日：2010-06-01
申请人： Xia Li , Jonghae Kim , Chi Shun Lo
发明人： Xia Li , Jonghae Kim , Chi Shun Lo
IPC分类号： H01F5/00
CPC分类号： H05K1/165 , H01F21/08 , H01F41/041 , H01F2017/002 , H01L21/4846 , H01L23/15 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/645 , H01L2924/0002 , H05K1/0251 , Y10T29/4902 , H01L2924/00
摘要： A through via inductor or transformer in a high-resistance substrate in an electronic package. In one embodiment, the package comprises a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. In another embodiment, a transformer can comprise a primary loop and a secondary loop, each of which includes a plurality of through-vias that are coupled to a plurality of conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio.
摘要翻译：电子封装中的高电阻基板中的通孔电感器或变压器。在一个实施例中，封装包括目标电感器，其包括形成在基板中的通孔，信号通过该通孔，以及调谐器电感器，其包括形成在基板中的通孔，使得通孔具有独立的信号通过通过。可以独立地控制通过调谐器电感器的信号的方向来调节目标电感器的总电感。在另一个实施例中，变压器可以包括主回路和次级回路，每个回路包括耦合到多个导电迹线的多个通孔。主回路形成第一连续导电路径，次级环形成第二连续导电路径。通过主回路的信号可以在次级回路中感应出信号，使感应信号取决于变压器的比例。

38. 发明授权

US09406865B2 Composite piezoelectric laterally vibrating resonator 有权
标题翻译：复合压电横向振动谐振器
公开(公告)号：US09406865B2
公开(公告)日：2016-08-02
申请号：US13587618
申请日：2012-08-16
申请人： Chengjie Zuo , Changhan Hobie Yun , Jonghae Kim
发明人： Chengjie Zuo , Changhan Hobie Yun , Jonghae Kim
IPC分类号： H01L41/09 , H01L41/18 , H03H9/02 , H01L41/277
CPC分类号： H01L41/183 , H01L41/277 , H03H9/02015 , H03H9/02228 , Y10T29/42
摘要： A resonator is described. The resonator includes multiple electrodes. The resonator also includes a composite piezoelectric material. The composite piezoelectric material includes at least one layer of a first piezoelectric material and at least one layer of a second piezoelectric material. At least one electrode is coupled to a bottom of the composite piezoelectric material. At least one electrode is coupled to a top of the composite piezoelectric material.
摘要翻译：描述谐振器。谐振器包括多个电极。谐振器还包括复合压电材料。复合压电材料包括至少一层第一压电材料和至少一层第二压电材料。至少一个电极耦合到复合压电材料的底部。至少一个电极耦合到复合压电材料的顶部。

39. 发明授权

US08093982B2 Three dimensional inductor and transformer design methodology of glass technology 有权
标题翻译：玻璃技术的三维电感和变压器设计方法
公开(公告)号：US08093982B2
公开(公告)日：2012-01-10
申请号：US12731393
申请日：2010-03-25
申请人： Jonghae Kim , Milind P. Shah , Chi Shun Lo , Je-Hsiung Lan , Xia Li , Matthew Michael Nowak
发明人： Jonghae Kim , Milind P. Shah , Chi Shun Lo , Je-Hsiung Lan , Xia Li , Matthew Michael Nowak
IPC分类号： H01F5/00
CPC分类号： H01L28/10 , H01F2017/004 , H01L21/84 , H01L23/645 , H01L27/12 , H01L2924/0002 , H01L2924/00
摘要： An inductor or transformer for use in integrated circuit devices that includes a high-resistivity substrate. The inductor includes a plurality of conductive traces around the substrate forming a continuous conductive path from a first to a second port. The conductive path can be solenoid-shaped. Some of the conductive traces can be formed during back-end-of-line processing or backside plating of an integrated circuit die. The transformer includes a first inductor with input and output ports, and a first continuous conductive path therebetween; and a second inductor with input and output ports, and a second continuous conductive path therebetween. The second inductor is independent of and electromagnetically coupled to the first inductor. The first and second conductive paths can be solenoid-shaped. The first conductive path can be interleaved with the second conductive path.
摘要翻译：一种用于集成电路器件的电感器或变压器，其包括高电阻率衬底。电感器包括围绕衬底的多个导电迹线，形成从第一端口到第二端口的连续导电路径。导电路径可以是螺线管形的。一些导电迹线可以在集成电路管芯的后端处理或背面电镀期间形成。变压器包括具有输入和输出端口的第一电感器和它们之间的第一连续导电路径; 以及具有输入和输出端口的第二电感器以及它们之间的第二连续导电路径。第二电感器与第一电感器无关并与其电磁耦合。第一和第二导电路径可以是螺线管形的。第一导电路径可以与第二导电路径交错。

40. 发明授权

US08970516B2 Integrated passives and power amplifier 有权
标题翻译：集成无源和功率放大器
公开(公告)号：US08970516B2
公开(公告)日：2015-03-03
申请号：US13235158
申请日：2011-09-16
申请人： Justin Phelps Black , Ravindra V. Shenoy , Evgeni Petrovich Gousev , Aristotele Hadjichristos , Thomas Andrew Myers , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Chi Shun Lo
发明人： Justin Phelps Black , Ravindra V. Shenoy , Evgeni Petrovich Gousev , Aristotele Hadjichristos , Thomas Andrew Myers , Jonghae Kim , Mario Francisco Velez , Je-Hsiung Jeffrey Lan , Chi Shun Lo
IPC分类号： G06F3/041 , G02B26/00 , H01L21/56 , H01L23/31
CPC分类号： G02B26/001 , H01L21/565 , H01L23/3128 , H01L2224/16225 , H01L2924/09701 , H01L2924/12044 , H01L2924/1461 , H01L2924/00
摘要： This disclosure provides systems, methods and apparatus for combining devices deposited on a first substrate, with integrated circuits formed on a second substrate such as a semiconducting substrate or a glass substrate. The first substrate may be a glass substrate. The first substrate may include conductive vias. A power combiner circuit may be deposited on a first side of the first substrate. The power combiner circuit may include passive devices deposited on at least the first side of the first substrate. The integrated circuit may include a power amplifier circuit disposed on and configured for electrical connection with the power combiner circuit, to form a power amplification system. The conductive vias may include thermal vias configured for conducting heat from the power amplification system and/or interconnect vias configured for electrical connection between the power amplification system and a conductor on a second side of the first substrate.
摘要翻译：本公开提供了用于组合沉积在第一衬底上的器件与形成在第二衬底（例如半导体衬底或玻璃衬底）上的集成电路的系统，方法和装置。第一基板可以是玻璃基板。第一衬底可以包括导电通孔。功率组合器电路可以沉积在第一衬底的第一侧上。功率组合器电路可以包括沉积在第一衬底的至少第一侧上的无源器件。集成电路可以包括设置在功率合成器电路上并被配置为与功率组合器电路电连接的功率放大器电路，以形成功率放大系统。导电通孔可以包括被配置为用于传导来自功率放大系统的热的热通孔和/或配置用于功率放大系统和第一衬底的第二侧上的导体之间的电连接的互连通孔。

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