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31. 发明授权

US08579675B2 Methods of using optical metrology for feed back and feed forward process control 有权
标题翻译：使用光学计量学进行反馈和前馈过程控制的方法
公开(公告)号：US08579675B2
公开(公告)日：2013-11-12
申请号：US12625345
申请日：2009-11-24
申请人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
发明人： Jeffrey Drue David , Harry Q. Lee , Boguslaw A. Swedek , Dominic J. Benvegnu , Zhize Zhu , Wen-Chiang Tu
IPC分类号： B24B49/12
CPC分类号： B24B37/013 , B24B49/12 , H01L22/12 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： A method includes polishing a substrate on a first platen using a first set of parameters, obtaining a plurality of measured spectra from at least two zones, comparing the plurality of measured spectra with a reference spectrum to evaluate the thickness of each of the at least two zones of the substrate, comparing a thickness of a first zone with a thickness of a second zone, determining whether the thickness of the first zone falls within a predetermined range of the thickness of the second zone, and if the thickness does not fall within the predetermined range, at least one of a) adjusting at least one parameter of the first set and polishing a second substrate on the first platen using the adjusted parameters, or b) adjusting at least one parameter of a second set and polishing the substrate on a second platen using the adjusted parameters.
摘要翻译：一种方法包括使用第一组参数来抛光第一台板上的基板，从至少两个区域获得多个测量光谱，将多个测量光谱与参考光谱进行比较，以评估至少两个区域，比较第一区域的厚度和第二区域的厚度，确定第一区域的厚度是否落在第二区域的厚度的预定范围内，并且如果厚度不在第二区域的厚度内预定范围，以下至少一个：a）调整第一组的至少一个参数并使用经调整的参数来研磨第一台上的第二基板，或b）调整第二组的至少一个参数并在一个第二个压盘使用调整参数。

32. 发明授权

US08554351B2 Spectrographic monitoring of a substrate during processing using index values 有权
标题翻译：使用指标值对处理过程中的基板进行光谱监测
公开(公告)号：US08554351B2
公开(公告)日：2013-10-08
申请号：US13599766
申请日：2012-08-30
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , B24B49/00 , G01B11/28
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

33. 发明申请

US20130204424A1 Adjusting Polishing Rates by Using Spectrographic Monitoring of a Substrate During Processing 有权
标题翻译：通过在处理过程中使用基板的光谱监测来调整抛光速率
公开(公告)号：US20130204424A1
公开(公告)日：2013-08-08
申请号：US13725691
申请日：2012-12-21
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek
IPC分类号： H01L21/302
CPC分类号： B24B37/005 , B24B37/013 , B24B49/12 , H01L21/302
摘要： A computer-implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best-match reference spectra; determining a goodness of fit for the sequence of best-match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
摘要翻译：计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

34. 发明申请

US20120323355A1 SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES 有权
标题翻译：使用指数值处理过程中基板的光谱监测
公开(公告)号：US20120323355A1
公开(公告)日：2012-12-20
申请号：US13599766
申请日：2012-08-30
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G05B19/18
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

35. 发明授权

US07952708B2 High throughput measurement system 失效
标题翻译：高通量测量系统
公开(公告)号：US07952708B2
公开(公告)日：2011-05-31
申请号：US12059464
申请日：2008-03-31
申请人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
发明人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
IPC分类号： G01J3/40
CPC分类号： G01N21/31 , G01N21/253 , H01L21/67161 , H01L21/67207 , H01L21/67253 , H01L21/67766
摘要： A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.
摘要翻译：衬底处理系统包括处理衬底的处理模块，被配置为容纳用于保持衬底的至少一个盒的工厂接口模块，位于工厂接口模块中或邻接工厂接口模块的光谱监测系统，以及衬底处理器，用于传送衬底在所述至少一个盒，所述光谱监视系统和所述处理模块之间。

36. 发明申请

US20100217430A1 SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING USING INDEX VALUES 有权
标题翻译：使用指数值处理过程中基板的光谱监测
公开(公告)号：US20100217430A1
公开(公告)日：2010-08-26
申请号：US12699014
申请日：2010-02-02
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： G06F19/00 , H01L21/00 , B24B49/00
CPC分类号： G05B15/02 , B24B37/013 , B24B49/12
摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.
摘要翻译：描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

37. 发明授权

US07768659B2 Determining copper concentration in spectra 有权
标题翻译：测定光谱中的铜浓度
公开(公告)号：US07768659B2
公开(公告)日：2010-08-03
申请号：US11868911
申请日：2007-10-08
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
IPC分类号： G01B9/08 , G01B11/28
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described.
摘要翻译：描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。

38. 发明申请

US20090036026A1 SUBSTRATE THICKNESS MEASURING DURING POLISHING 有权
标题翻译：衬底厚度测量在抛光期间
公开(公告)号：US20090036026A1
公开(公告)日：2009-02-05
申请号：US12185719
申请日：2008-08-04
申请人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
发明人： Jeffrey Drue David , Dominic J. Benvegnu , Harry Q. Lee , Boguslaw A. Swedek , Lakshmanan Karuppiah
IPC分类号： B24B49/04 , B24B49/12
CPC分类号： B24B49/12 , B24B37/013 , B24B37/205 , B24B49/08 , B24D7/14 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
摘要翻译：确定抛光终点的计算机程序产品包括在抛光序列的不同时间内从基板上的不同区域获得光谱，将光谱与库中的索引匹配，并使用该指标来确定每个不同区域的抛光速率指标。可以为一个区域确定调整的抛光速率，这导致当达到抛光结束时间时，基板具有期望的轮廓。

39. 发明申请

US20080243433A1 METHODS AND APPARATUS FOR GENERATING A LIBRARY OF SPECTRA 有权
标题翻译：用于生成谱图的方法和装置
公开(公告)号：US20080243433A1
公开(公告)日：2008-10-02
申请号：US12059435
申请日：2008-03-31
申请人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
发明人： Abraham Ravid , Boguslaw A. Swedek , Dominic J. Benvegnu , Jeffrey Drue David , Jun Qian , Sidney P. Huey , Ingemar Carlsson , Lakshmanan Karuppiah , Harry Q. Lee
IPC分类号： G01B5/06
CPC分类号： G01N21/31 , G01N21/253 , H01L21/67161 , H01L21/67207 , H01L21/67253 , H01L21/67766
摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.
摘要翻译：描述了从用于处理产品晶片的参考基板产生库的方法。该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联。

40. 发明申请

US20080130000A1 DETERMINING COPPER CONCENTRATION IN SPECTRA 有权
标题翻译：确定光谱中的铜浓度
公开(公告)号：US20080130000A1
公开(公告)日：2008-06-05
申请号：US11868911
申请日：2007-10-08
申请人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
发明人： Dominic J. Benvegnu , Jeffrey Drue David , Boguslaw A. Swedek , Jimin Zhang , Harry Q. Lee
IPC分类号： G01J3/46 , G06F19/00
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described.
摘要翻译：描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。

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