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    • 33. 发明申请
    • ELASTOMER POROUS MATERIAL AND METHOD OF PRODUCING THE SAME
    • 弹性体多孔材料及其制造方法
    • US20100305225A1
    • 2010-12-02
    • US12745669
    • 2008-12-01
    • Wataru NemotoKazuya TakatoAsuka KoyanakiJun OgawaAtsushi Ikeda
    • Wataru NemotoKazuya TakatoAsuka KoyanakiJun OgawaAtsushi Ikeda
    • C08J9/00
    • C08J9/28B29C44/3403B29C67/202C08J2201/0504C08J2383/04Y10T428/26
    • In the elastomer porous material of the invention, when cells in a first observation region of a first cross section are observed at a certain magnification, cells having a shape factor SF2, which indicates the remoteness from complete roundness and is represented by the following formula: SF   2 = P 2 4  π   A × 100 (wherein A represents the area of each cell, and P represents the perimeter length thereof), of 130 or less account for 80% or more of all cells in the first observation region, and, when cells in a second observation region of a second cross section orthogonal to the first cross section are observed at a certain magnification, cells having a shape factor SF2, which indicates the remoteness from complete roundness and is represented by the same formula (wherein A represents the area of each cell, and P represents the perimeter length thereof), of 130 or less account for 80% or more of all cells in the second observation region.
    • 在本发明的弹性体多孔材料中,当以一定的倍率观察第一截面的第一观察区域的细胞时,具有形状因子SF2的细胞,其表示从完全圆度偏离并由下式表示: SF÷2 = P 2 4&pgr A×100(其中A表示每个细胞的面积,P表示其周长)为130以下,占第一观察区域的全部细胞的80%以上,并且当第二观察区域中的细胞 在一定的放大倍数下观察与第一截面正交的第二截面的观察区域,具有形状因子SF2的单元,其表示从完全圆度偏离并由相同的式(其中A表示每个单元的面积 ,P表示其周长)为130以下,占第二观察区域的全部细胞的80%以上。
    • 35. 发明申请
    • Semiconductor Device and Method for Fabricating the Same
    • 半导体器件及其制造方法
    • US20080083989A1
    • 2008-04-10
    • US10578351
    • 2005-05-20
    • Nobuo AoiHideo NakagawaAtsushi Ikeda
    • Nobuo AoiHideo NakagawaAtsushi Ikeda
    • H01L23/48H01L21/4763
    • H01L21/28562H01L21/76846H01L21/76873
    • A semiconductor device includes insulation films (6 and 8) formed over a silicon substrate (1), a buried wire (14) formed in the insulation films (6 and 8), and a barrier metal film (A1) formed between each of the insulation films (6 and 8) and the buried wire (14). The barrier metal film (A1) is formed of a metal oxide film (11), a transition layer (12a) and a metal film (13) stacked in this order in the direction from a side of the barrier metal film (A1) at which the insulation films (6 and 8) exists to a side thereof at which the buried wire (14) exists. The transition layer (12a) is formed of a single atomic layer having substantially an intermediate composition between respective compositions of the metal oxide film (11) and the metal film (13).
    • 半导体器件包括形成在硅衬底(1)上的绝缘膜(6和8),形成在绝缘膜(6和8)中的掩埋线(14)和形成在绝缘膜(6和8)之间的阻挡金属膜 绝缘膜(6和8)和掩埋线(14)。 阻挡金属膜(A 1)由金属氧化物膜(11),过渡层(12a)和金属膜(13)沿着从阻挡金属膜(A 1),其中绝缘膜(6和8)存在于存在埋地线(14)的一侧。 过渡层(12a)由在金属氧化物膜(11)和金属膜(13)的各组成之间基本上具有中间组成的单一原子层形成。