会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 32. 发明申请
    • METHOD FOR MEASURING THICKNESS BY PULSED INFRARED THERMAL WAVE TECHNOLOGY
    • 通过脉冲红外热波技术测量厚度的方法
    • US20140153608A1
    • 2014-06-05
    • US14002022
    • 2011-06-14
    • Zhi ZengXun WangNing TaoLichun Feng
    • Zhi ZengXun WangNing TaoLichun Feng
    • G01B21/08G01N25/72
    • G01B21/085G01N25/72
    • A method for measuring thickness or defect depth by pulsed infrared thermal wave technology is described. The method includes heating a measured object by pulsed heating devices, and at the same time, obtaining a thermal image sequence on the surface of the measured object by an infrared thermography device, and storing the thermal image sequence in a general-purpose memory. The method also includes multiplying a temperature-time curve at every point of the thermal image sequence by a corresponding time, thereby obtaining a new curve. The method also includes calculating a first-order differential and obtaining a peak time thereof. The method also includes use of one or more formulas to thereby determine the thickness or the defect depth of the measured object.
    • 描述了通过脉冲红外热波技术测量厚度或缺陷深度的方法。 该方法包括通过脉冲加热装置加热测量对象,同时通过红外热成像装置获得被测物体表面上的热图像序列,并将热图像序列存储在通用存储器中。 该方法还包括将热图像序列的每个点处的温度 - 时间曲线乘以相应的时间,从而获得新的曲线。 该方法还包括计算一阶差分并获得其峰值时间。 该方法还包括使用一个或多个公式从而确定被测物体的厚度或缺陷深度。