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    • 32. 发明申请
    • DEVICE AND METHOD FOR FABRICATING THIN FILMS BY REACTIVE EVAPORATION
    • 通过反应蒸发来制造薄膜的装置和方法
    • US20110303153A1
    • 2011-12-15
    • US13219380
    • 2011-08-26
    • Brian H. MoecklyWard S. Ruby
    • Brian H. MoecklyWard S. Ruby
    • C23C16/448H01L39/24H01L41/22C23C16/458H01L21/00
    • H01L39/2487C23C14/067C23C14/24C23C14/568H01L39/2451Y10T29/49014
    • A device for fabricating thin films on a substrate includes a vacuum chamber, a rotatable platen configured to hold one or more substrates within the vacuum chamber, and a housing disposed within the vacuum chamber. The housing contains a heating element and is configured to enclose an upper surface of the platen and a lower portion configured to partially enclose an underside surface of the platen which forms a reaction zone. A heated evaporation cell is operatively coupled to the lower portion of the housing and configured to deliver a pressurized metallic reactant to the reaction zone. The device includes a deposition zone disposed in the vacuum chamber and isolated from the reaction zone and is configured to deposit a deposition species to the exposed underside of the substrates when the substrates are not contained in the reaction zone.
    • 用于在衬底上制造薄膜的器件包括真空室,被配置为保持真空室内的一个或多个衬底的可旋转压板以及设置在真空室内的壳体。 壳体包含加热元件,并且被构造成封闭压板的上表面,并且下部构造成部分地封闭形成反应区的压板的下表面。 加热的蒸发池可操作地联接到壳体的下部并且被配置成将加压的金属反应物输送到反应区。 该装置包括设置在真空室中并与反应区隔离的沉积区,并且构造成当基底不包含在反应区中时,将沉积物质沉积到基底的暴露下侧。
    • 36. 发明申请
    • SYSTEMS AND METHODS FOR SIMPLE EFFICIENT ASSEMBLY AND PACKAGING OF ELECTRONIC DEVICES
    • 用于简单高效组装和电子设备包装的系统和方法
    • US20100053907A1
    • 2010-03-04
    • US11459336
    • 2006-07-21
    • Edward R. SoaresStacey M. BilskiJames R. CostaKen S. Ono
    • Edward R. SoaresStacey M. BilskiJames R. CostaKen S. Ono
    • H05K7/00H05K9/00
    • H05K9/0022
    • Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.
    • 提供了用于简单,有效和/或成本有效地制造和组装电子设备的系统和方法。 本发明的各种系统和方法可以包括将系统的各种部件彼此联接,附接和/或连接的各种方式,以提高成本和易于组装。 可以使用多个夹子来将电子系统和壳体的各个部分连接在一起,包括电路装置,封闭盖和壳体,和/或布线。 这些夹子可以是无螺纹的,可以由弹性或弹簧材料制成,设计成使得它们快速卡入到位,以便提供良好的机械强度和电连接。 各种电路元件可以包括平面电路,并且可以包括由高温超导体材料制成的滤波器。 平面电缆可用于组件的电连接。 这些系统和设备可以用于例如无线通信系统中。
    • 38. 发明授权
    • Systems and methods for receiver upgrade
    • 接收机升级的系统和方法
    • US07395091B2
    • 2008-07-01
    • US10946309
    • 2004-09-22
    • Sunil KapoorAshok Burton TripathiGregory Lynton Hey-ShiptonGena Marie YatesEdward Robert Soares
    • Sunil KapoorAshok Burton TripathiGregory Lynton Hey-ShiptonGena Marie YatesEdward Robert Soares
    • H04M1/00H04B1/38
    • H04B1/38
    • Systems and methods for an upgradeable and/or reconfigurable receiver are provided. In general, the present invention is directed to providing systems and methods for designing an electronic communication system having easy and cost effective upgradeable receiver systems and components including, for example, an amplifier and/or a filter. For example, a receiver may include a receiver front end that is configured so that at least one of the original conventional system components may be used along with one or more new system components to provide greater receiver sensitivity and/or selectivity. In various embodiments, portions of an upgradeable receiver system may be made as modular components that allow easy replacement for the upgradeable components which may include a signal amplifier and/or a signal filter. In various embodiments the receiver may be upgraded by replacing a conventional low noise amplifier (LNA) with a high temperature superconductor (HTS) filter and/or a cryo-cooled LNA.
    • 提供了用于可升级和/或可重新配置的接收机的系统和方法。 通常,本发明旨在提供用于设计具有容易且成本有效的可升级的接收机系统和组件的电子通信系统的系统和方法,包括例如放大器和/或滤波器。 例如,接收机可以包括接收机前端,其被配置为使得可以将原始常规系统组件中的至少一个与一个或多个新系统组件一起使用以提供更大的接收机灵敏度和/或选择性。 在各种实施例中,可升级的接收机系统的部分可以被制成为允许容易地替换可升级部件的模块化部件,其可以包括信号放大器和/或信号滤波器。 在各种实施例中,可以通过用高温超导体(HTS)滤波器和/或低温冷却LNA代替传统的低噪声放大器(LNA)来升级接收器。
    • 39. 发明申请
    • MEMS-BASED BYPASS SYSTEM FOR USE WITH A HTS RF RECEIVER
    • 基于MEMS的旁路系统,用于HTS RF接收机
    • US20040092243A1
    • 2004-05-13
    • US10017147
    • 2001-12-13
    • Superconductor Technologies, Inc.
    • Gregory L. Hey-Shipton
    • H04B001/10H04M001/00H04B001/38
    • H04B1/036
    • A HTS-based RF receiver includes a cryocooler and a cryogenic enclosure in thermal communication with the cryocooler. The cryogenic enclosure contains a HTS filter and a LNA therein. A first MEMS bypass switch is positioned between a RF input and the HTS filter, the first MEMS bypass switch operatively coupling the RF input to the HTS filter. A second MEMS bypass switch is positioned between the LNA and RF output, the second MEMS bypass switch operatively coupling the LNA to the RF output. A bypass pathway located within the cryogenic enclosure is connected between the first and second MEMS switches to bypass the HTS filter and LNA when an operating parameter of the RF receiver falls outside a pre-determined range.
    • 基于HTS的RF接收机包括与低温冷却器热连接的低温冷却器和低温外壳。 低温外壳包含HTS过滤器和LNA。 第一MEMS旁路开关位于RF输入和HTS滤波器之间,第一MEMS旁路开关可操作地将RF输入耦合到HTS滤波器。 第二MEMS旁路开关位于LNA和RF输出之间,第二MEMS旁路开关可操作地将LNA耦合到RF输出端。 当RF接收器的操作参数落在预定范围之外时,位于低温外壳内的旁路通路连接在第一和第二MEMS开关之间以绕过HTS滤波器和LNA。