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    • 35. 发明申请
    • PRINTER
    • 打印机
    • US20140293302A1
    • 2014-10-02
    • US14201987
    • 2014-03-10
    • CITIZEN HOLDINGS CO., LTD.CITIZEN SYSTEMS JAPAN CO., LTD.
    • Yutaka INOKUCHITakeshi YAMAZAKI
    • G06K15/16
    • G06K15/16G06K15/1868
    • A printer includes a recording unit that executes on a recording medium, a recording operation under a sublimation transfer scheme; a conveying unit that using a protrusion roller having protrusions protruding toward an outer periphery and abutting a first surface of the recording medium, conveys the recording medium to a recording position for the recording operation; a pseudo recorded image data producing unit that produces pseudo recorded image data that includes pseudo pixels obtained by correcting a density of each predetermined pixel that is determined corresponding to an arrangement pattern of the protrusions on the protrusion roller and is determined from among pixels to be recorded in a second area that excludes a first area that is in contact with the protrusions, on the first surface of the conveyed recording medium; and a recording control unit that controls the recording unit based on the pseudo recorded image data.
    • 打印机包括在记录介质上执行的记录单元,升华转移方案下的记录操作; 输送单元,其使用具有向外周突出并且抵靠所述记录介质的第一表面的突起的突出辊,将所述记录介质传送到用于记录操作的记录位置; 伪记录图像数据产生单元,其产生伪记录图像数据,所述伪记录图像数据包括通过校正与突出辊上的突起的布置图案相对应地确定的每个预定像素的浓度而获得的伪像素,并从要记录的像素中确定 在排出与所述突起接触的第一区域的第二区域中,在所传送的记录介质的第一表面上; 以及记录控制单元,其基于伪记录图像数据来控制记录单元。
    • 39. 发明授权
    • Mounting board and structure of the same
    • 安装板和结构相同
    • US08766313B2
    • 2014-07-01
    • US13581135
    • 2011-02-23
    • Kohsuke KashitaniKoichi FukasawaJun TakashimaKatsuyuki Kiyozumi
    • Kohsuke KashitaniKoichi FukasawaJun TakashimaKatsuyuki Kiyozumi
    • H01L33/00
    • H01L33/62H01L33/64H01L2224/48091H01L2224/48227H01L2924/00014
    • A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.
    • 一种安装板,包括一对图案化电极,下表面和与其相对的上表面,其上安装有电子部件的基板,贯穿上表面和下表面的通孔, 侧表面限定了通孔。 贯通孔包括多个穿透槽,该贯通槽被切入安装板并穿过上表面和下表面。 多个穿透槽电分离该对图案化电极。 该一对构图电极部分地位于周边侧表面内,并且连接至少一对图形化电极的连接部分和设置在电子部件的基板的上表面上的至少一对图案化电极为 设置在限定通孔的周边侧表面内。
    • 40. 发明申请
    • OPTICAL DEVICE
    • 光学装置
    • US20140161387A1
    • 2014-06-12
    • US14119853
    • 2012-05-22
    • Masafumi IdeTakaaki NozakiKaoru YodaYosuke Abe
    • Masafumi IdeTakaaki NozakiKaoru YodaYosuke Abe
    • G02F1/377G02B6/12
    • G02F1/377G02B6/12G02F2001/3505G02F2203/21
    • The invention is directed to the provision of an optical device in which provisions are made to form a gap between an optical waveguide and a substrate without having to form a groove or the like in the substrate and to prevent any stress from being applied to an optical element even when it is heated by a heater for temperature adjustment. More specifically, the invention provides an optical device includes a substrate, an optical element with an optical waveguide formed in a surface thereof that faces the substrate, bonding portions formed on the substrate at positions that oppose each other across the optical waveguide, a heater, formed on at least one of the optical element and the substrate, for heating the optical waveguide, and a micro bump structure formed from a metallic material, wherein the optical element is bonded to the bonding portions via the micro bump structure in such a manner that a gap is formed between the optical waveguide and the substrate.
    • 本发明涉及提供一种光学装置,其中在不需要在基板中形成凹槽等而在光波导和基板之间形成间隙,并且防止任何应力施加到光学器件上 即使通过加热器加热来进行温度调节。 更具体地说,本发明提供了一种光学器件,包括:基板,在其表面上形成有面向基板的光波导的光学元件,在基板上形成的在光波导上彼此相对的位置的接合部,加热器, 形成在所述光学元件和所述基板中的至少一个上,用于加热所述光波导,以及由金属材料形成的微凸块结构,其中所述光学元件经由所述微凸块结构结合到所述接合部, 在光波导和基板之间形成间隙。