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31. 发明授权

US08125055B2 Packaging technology 有权
标题翻译：包装技术
公开(公告)号：US08125055B2
公开(公告)日：2012-02-28
申请号：US12557945
申请日：2009-09-11
申请人： Peter John Robinson
发明人： Peter John Robinson
IPC分类号： H01L29/40
CPC分类号： H01L23/585 , H01L21/78 , H01L23/481 , H01L23/552 , H01L24/11 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2223/6677 , H01L2224/0231 , H01L2224/0401 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2224/2518 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Metallized through silicon vias located in the scribe lanes between die are used to create an electrical connection between the front-side and the rear-side of a silicon die. One of the metallization layers on the front-side of the die comprises portions which extend into the scribe lanes to form capture pads for the through silicon vias. The rear-side of the wafer is metallized and this metallization may, in some embodiments, be patterned to form tracks or components. The silicon die may be used to create improved package on package devices. In other examples, other substrate materials may be used.
摘要翻译：使用位于管芯之间的划线槽内的硅通孔进行金属化，以在硅片的前侧和后侧之间形成电连接。模具前侧的金属化层之一包括延伸到划线中的部分，以形成用于硅通孔的捕获垫。在一些实施例中，晶片的后侧被金属化，并且在一些实施例中，该金属化可被图案化以形成轨道或部件。硅芯片可用于在封装器件上创建改进的封装。在其他实例中，可以使用其它基材。

32. 发明申请

US20110164710A1 TRANSMISSION TIMING ADJUSTMENT IN RADIO SYSTEMS 有权
标题翻译：无线电系统中的传输时序调整
公开(公告)号：US20110164710A1
公开(公告)日：2011-07-07
申请号：US12980588
申请日：2010-12-29
申请人： Farshid Nowshadi , Steven Wenham
发明人： Farshid Nowshadi , Steven Wenham
IPC分类号： H04L7/00
CPC分类号： H04L7/02
摘要： A method of adjusting the transmission time of a signal in a radio link, the method being performed by a transmitter configured to transmit the signal over the radio link to a receiver and comprising the steps of ascertaining an accuracy that the receiver assumes for the transmitter's clock, calculating an assumed drift of the transmitter's clock based on the assumed accuracy of that clock and the time since a previous correlation between the transmitter's clock and the receiver's clock; and transmitting the signal at a time dependent on the assumed drift.
摘要翻译：一种调整无线电链路中的信号的传输时间的方法，所述方法由被配置为通过无线电链路将信号发送到接收机的发射机执行，并且包括以下步骤：确定接收机为发射机的时钟而准备的精度基于该时钟的假设精度和从发射机的时钟与接收机的时钟之前的相关之后的时间计算发射机时钟的假定漂移; 并根据假定的漂移一次发送信号。

33. 发明申请

US20100078800A1 LOW COST FLEXIBLE SUBSTRATE 有权
标题翻译：低成本柔性基板
公开(公告)号：US20100078800A1
公开(公告)日：2010-04-01
申请号：US12557896
申请日：2009-09-11
申请人： Zaid Aboush , Peter John Robinson
发明人： Zaid Aboush , Peter John Robinson
IPC分类号： H01L23/498 , H05K1/09 , B05D5/12 , H01L21/56
CPC分类号： H05K3/0023 , H01L23/3128 , H01L23/4985 , H01L24/32 , H01L24/48 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07811 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H05K1/0393 , H05K2201/0355 , H05K2201/0394 , H01L2924/01028 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A low cost flexible substrate is described which comprises a thin metal foil and a layer of solder mask. The metal foil layer is patterned to create tracks and lands for solder bonding and/or wirebonding and the layer of solder mask is patterned to create openings for solder bonding, wirebonding and/or for mounting the die. The substrate may be used as a package substrate to create a packaged die or may be used as a replacement for more expensive flexible printed circuit boards.
摘要翻译：描述了一种低成本的柔性基板，其包括薄金属箔和一层阻焊层。图案化金属箔层以产生用于焊接和/或引线接合的轨道和焊盘，并且图案化阻焊层以产生用于焊接，引线键合和/或用于安装管芯的开口。衬底可以用作封装衬底以形成封装的裸片，或者可以用来代替更昂贵的柔性印刷电路板。

34. 发明申请

US20090201815A1 FLOW CONTROL METHOD 有权
标题翻译：流量控制方法
公开(公告)号：US20090201815A1
公开(公告)日：2009-08-13
申请号：US12355005
申请日：2009-01-16
申请人： Timothy Condren Smith
发明人： Timothy Condren Smith
IPC分类号： H04L1/00
CPC分类号： H04L1/1835 , H04L1/0002 , H04L1/0032 , H04L1/0035
摘要： Methods and apparatus for providing a flow control mechanism in a wireless network are described. In order to force a transmitting station to implement a rate adaptation mechanism, in which speed is traded off for reliability, a receiver within a receiving station behaves as if the radio conditions were degraded. This may be implemented when defined criteria are met, such as when the available buffer space falls below a threshold, and for some or all types of frames. In an embodiment, when the criteria are met, the receiver does not acknowledge frames received at one or more higher data rates.
摘要翻译：描述了在无线网络中提供流量控制机制的方法和装置。为了强制发射台实现速率适应机制，其中以可靠性的速度被消除，接收站内的接收机的行为就好像无线电条件恶化一样。当满足定义的标准时，例如当可用缓冲区空间低于阈值时，以及对于某些或所有类型的帧，可以实现这一点。在一个实施例中，当满足标准时，接收机不承认以一个或多个更高数据速率接收的帧。

35. 发明申请

US20080037801A1 Dual microphone noise reduction for headset application 有权
标题翻译：双麦克风降噪耳机应用
公开(公告)号：US20080037801A1
公开(公告)日：2008-02-14
申请号：US11502312
申请日：2006-08-10
申请人： Rogerio G. Alves , Kuan-Chieh Yen
发明人： Rogerio G. Alves , Kuan-Chieh Yen
IPC分类号： A61F11/06 , H04R1/10 , G10K11/16 , H03B29/00
CPC分类号： H04R3/02 , G10L21/02 , G10L2021/02165 , H04R1/1083 , H04R3/04 , H04R2410/05
摘要： Improved vocal signals are obtained in headsets and similar devices by including a microphone inside a chamber formed at least in part by the wearer's ear. This second microphone provides a reduced noise input signal. The reduced noise signal is corrected by input from another microphone, located outside the chamber. This correction can include echo cancellation, spectral shaping, frequency extension, and the like.
摘要翻译：通过在至少部分由佩戴者的耳朵形成的室内包括麦克风来在耳机和类似装置中获得改善的声音信号。该第二麦克风提供降低的噪声输入信号。减小的噪声信号通过位于室外的另一麦克风的输入来校正。该校正可以包括回波消除，频谱整形，频率扩展等。

36. 发明授权

US08962391B2 Method of fabricating a wafer level chip scale package without an encapsulated via 有权
标题翻译：制造没有封装通孔的晶片级芯片级封装的方法
公开(公告)号：US08962391B2
公开(公告)日：2015-02-24
申请号：US14091040
申请日：2013-11-26
申请人： Cambridge Silicon Radio Ltd.
发明人： Andrew Holland
IPC分类号： H01L21/332 , H01L23/00 , H01L23/31 , H01L23/525 , H01L21/78
CPC分类号： H01L24/94 , H01L21/78 , H01L23/3114 , H01L23/525 , H01L24/02 , H01L24/12 , H01L24/17 , H01L2224/02351 , H01L2224/0401 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/01082 , H01L2924/014
摘要： An improved wafer level chip scale packaging technique is described which does not use an encapsulated via to connect between a redirection layer and a pad within the pad ring on the semiconductor die. In an embodiment, a first dielectric layer is formed such that it terminates on each die within the die's pad ring. Tracks are then formed in a conductive layer which contact one of the pads and run over the edge of an opening onto the surface of the first dielectric layer. These tracks may be used to form an electrical connection between the pad and a solder ball.
摘要翻译：描述了改进的晶片级芯片级封装技术，其不使用封装通孔来连接半导体管芯上的焊盘环中的重定向层和焊盘之间。在一个实施例中，形成第一介电层，使得其在模具的衬垫环内的每个管芯上终止。然后在导电层中形成轨道，该导电层接触一个焊盘之一并在开口的边缘上延伸到第一介电层的表面上。这些轨道可用于在焊盘和焊球之间形成电连接。

37. 发明授权

US08952424B2 RF CMOS transistor design 有权
标题翻译：射频CMOS晶体管设计
公开(公告)号：US08952424B2
公开(公告)日：2015-02-10
申请号：US13948948
申请日：2013-07-23
申请人： Cambridge Silicon Radio Limited
发明人： Rainer Herberholz
IPC分类号： H01L27/118 , H01L23/528 , H01L29/06 , H01L29/40 , H01L29/417 , H01L23/482 , H01L23/00
CPC分类号： H01L23/5283 , H01L23/4824 , H01L24/06 , H01L29/0692 , H01L29/402 , H01L29/41758 , H01L2924/14 , H01L2924/00
摘要： An improved RF CMOS transistor design is described. Local, narrow interconnect lines, which are located substantially above the active area of the transistor, are each connected to either a source terminal or a drain terminal. The source and the drain terminal are arranged orthogonally to the local interconnect lines and each terminal is significantly wider than a local interconnect line. In an example, the local interconnect lines are formed in a first metal layer and the source and drain terminals are formed in one or more subsequent metal layers.
摘要翻译：描述了改进的RF CMOS晶体管设计。位于晶体管的有效面积上方的局部，窄的互连线分别连接到源极端子或漏极端子。源极和漏极端子与本地互连线正交配置，并且每个端子比局部互连线宽得多。在一个示例中，局部互连线形成在第一金属层中，并且源极和漏极端子形成在一个或多个后续金属层中。

38. 发明授权

US08600433B2 Receiver comprising selectable signal processing sub-systems 失效
标题翻译：接收机包括可选信号处理子系统
公开(公告)号：US08600433B2
公开(公告)日：2013-12-03
申请号：US12165954
申请日：2008-07-01
申请人： Diego Giancola
发明人： Diego Giancola
IPC分类号： H04B1/10 , H04L27/06
CPC分类号： H04L25/03006 , H04B1/7097 , H04B2201/7071
摘要： A receiver for a telecommunications system, wherein the receiver is capable of using a plurality of available alternative receiver sub-systems and the receiver comprises selection means for selecting one of the plurality of receiver sub-systems for use in processing a received signal according to conditions of the propagation channel through which the received signal was received.
摘要翻译：一种用于电信系统的接收机，其中所述接收机能够使用多个可用的替代接收机子系统，并且所述接收机包括选择装置，用于根据条件选择所述多个接收机子系统中的一个用于处理接收信号的接收信号通过其传送。

39. 发明授权

US08589155B2 Adaptive tuning of the perceptual model 有权
标题翻译：感知模型的自适应调整
公开(公告)号：US08589155B2
公开(公告)日：2013-11-19
申请号：US13562841
申请日：2012-07-31
申请人： Esfandiar Zavarehei , David Hargreaves
发明人： Esfandiar Zavarehei , David Hargreaves
IPC分类号： G10L19/02 , G10L19/00
CPC分类号： H04B1/665 , G10L19/032
摘要： Methods of encoding a signal using a perceptual model are described in which a signal to mask ratio parameter within the perceptual model is tuned. The signal to mask ratio parameter is tuned based on a function of the bitrate of the part of the signal which has already been encoded and the target bitrate for the encoding process. The tuned signal to mask ratio parameter is used to compute a masking threshold for the signal which is then used to quantize the signal.
摘要翻译：描述使用感知模型对信号进行编码的方法，其中调谐感知模型内的信号屏蔽比参数。基于已经编码的信号的部分的比特率和编码处理的目标比特率的函数来调整信号到掩模比参数。调谐信号到掩模比参数用于计算信号的掩蔽阈值，然后将其用于量化信号。

40. 发明授权

US08513707B2 RF CMOS transistor design 有权
公开(公告)号：US08513707B2
公开(公告)日：2013-08-20
申请号：US13133808
申请日：2009-11-25
申请人： Rainer Herberholz
发明人： Rainer Herberholz
IPC分类号： H01L27/118 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/00
CPC分类号： H01L23/5283 , H01L23/4824 , H01L24/06 , H01L29/0692 , H01L29/402 , H01L29/41758 , H01L2924/14 , H01L2924/00
摘要： An improved RF CMOS transistor design is described. Local, narrow interconnect lines, which are located substantially above the active area of the transistor, are each connected to either a source terminal or a drain terminal. The source and the drain terminal are arranged orthogonally to the local interconnect lines and each terminal is significantly wider than a local interconnect line. In an example, the local interconnect lines are formed in a first metal layer and the source and drain terminals are formed in one or more subsequent metal layers.

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