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    • 22. 发明申请
    • HEAT CURABLE ADHESIVE AND RESIN LAMINATED-TYPE IC CARD
    • 热固性粘合剂和树脂层压型IC卡
    • US20110149541A1
    • 2011-06-23
    • US12997436
    • 2009-06-10
    • Chihiro FunakoshiYoshitomo Aoyama
    • Chihiro FunakoshiYoshitomo Aoyama
    • H05K7/00C09J167/04
    • B42D25/47B42D25/00B42D2033/46C08K3/36C08L25/08C08L2666/04C09J167/00G06K19/07
    • Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin.
    • 提供一种能够牢固地结合由结晶性聚酯树脂形成的基材的热固性粘合剂,可以自由调节粘合剂层的厚度,具有优异的耐化学性,并且同时具有优异的储存稳定性。 此外,提供了一种树脂层压型IC卡,其中过去难以使用的液体热固化型粘合剂可以被使用,并且液体热固化性粘合剂可以通过没有 需要对热熔片进行成型以将由结晶性聚酯树脂形成的基材粘合。 因此,树脂层叠型IC卡可以在IC卡的厚度设计上具有高自由度。 可热固化的粘合剂包括(a)含羟基的非结晶聚酯树脂,(b)含有羧酸酐的树脂和(c)用于溶解(a)含羟基的非结晶聚酯 树脂。
    • 26. 发明授权
    • Biodegradable/compostable hot melt adhesives comprising polyester of
lactic acid
    • 包含乳酸聚酯的可生物降解/可堆肥热熔粘合剂
    • US5753724A
    • 1998-05-19
    • US786430
    • 1997-01-21
    • Garry J. EdgingtonChristopher M. Ryan
    • Garry J. EdgingtonChristopher M. Ryan
    • C09J11/00C08G63/08C08L67/04C08L75/06C08L101/16C09J11/06C09J167/00C09J167/04C09J201/00C08F120/26
    • C08L75/06C08G63/08C08L67/04C09J167/04C08L2201/06
    • A hot melt adhesive composition can be made using a polyester derived from 2-propanoic acid (lactic acid). A thermoplastic resin grade polyester can be formulated into a functional adhesive using adhesive components. A lower molecular weight material can be used as a tackifying resin with a biodegradable/compostable resin in a formulated hot melt adhesive. The adhesive material can be made pressure sensitive and can be made entirely by a degradable by combining the polyester polymer with other biodegradable/compostable ingredients. The resulting adhesive composition that can be used in a variety of applications. The biodegradable/compostable adhesive material can be used as a substitute for non-biodegradable materials made from commercial polymers that resist attack by bacteria, fungi and other microbial populations. The hot melt adhesives can be used in (e.g.) packaging and the manufacture of disposable articles which are made from degradable materials. The entire disposable article can be made from adhesives and structural materials that are fully biodegradable/compostable.
    • 热熔粘合剂组合物可以使用来自2-丙酸(乳酸)的聚酯来制造。 热塑性树脂级聚酯可以使用粘合剂组分配制成功能性粘合剂。 较低分子量的材料可以在配制的热熔粘合剂中用作具有可生物降解/可堆肥树脂的增粘树脂。 粘合剂材料可以制成压敏性,并且可以通过将聚酯聚合物与其它可生物降解/可堆肥的成分组合而完全通过可降解的方式制备。 所得粘合剂组合物可用于各种应用。 可生物降解/可堆肥的粘合剂材料可用作由商业聚合物制成的不可生物降解材料的替代物,其抵抗细菌,真菌和其他微生物群体的攻击。 热熔粘合剂可用于(例如)包装和制造由可降解材料制成的一次性制品。 整个一次性物品可以由完全可生物降解/可堆肥的粘合剂和结构材料制成。
    • 29. 发明授权
    • Biodegradable/compostable hot melt adhesives comprising polyester of
lactic acid
    • 包含乳酸聚酯的可生物降解/可堆肥热熔粘合剂
    • US5700344A
    • 1997-12-23
    • US779291
    • 1997-01-21
    • Garry J. EdgingtonChristopher M. Ryan
    • Garry J. EdgingtonChristopher M. Ryan
    • C09J11/00C08G63/08C08L67/04C08L75/06C08L101/16C09J11/06C09J167/00C09J167/04C09J201/00C08K5/12C08F120/26
    • C08L75/06C08G63/08C08L67/04C09J167/04C08L2201/06
    • A hot melt adhesive composition can be made using a polyester derived from 2-propanoic acid (lactic acid). A thermoplastic resin grade polyester can be formulated into a functional adhesive using adhesive components. A lower molecular weight material can be used as a tackifying resin with a biodegradable/compostable resin in a formulated hot melt adhesive. The adhesive material can be made pressure sensitive and can be made entirely by a degradable by combining the polyester polymer with other biodegradable/compostable ingredients. The resulting adhesive composition that can be used in a variety of applications. The biodegradable/compostable adhesive material can be used as a substitute for non-biodegradable materials made from commercial polymers that resist attack by bacteria, fungi and other microbial populations. The hot melt adhesives can be used in (e.g.) packaging and the manufacture of disposable articles which are made from degradable materials. The entire disposable article can be made from adhesives and structural materials that are fully biodegradable/compostable.
    • 热熔粘合剂组合物可以使用来自2-丙酸(乳酸)的聚酯来制造。 热塑性树脂级聚酯可以使用粘合剂组分配制成功能性粘合剂。 较低分子量的材料可以在配制的热熔粘合剂中用作具有可生物降解/可堆肥树脂的增粘树脂。 粘合剂材料可以制成压敏性,并且可以通过将聚酯聚合物与其它可生物降解/可堆肥的成分组合而完全通过可降解的方式制备。 所得粘合剂组合物可用于各种应用。 可生物降解/可堆肥的粘合剂材料可用作由商业聚合物制成的不可生物降解材料的替代物,其抵抗细菌,真菌和其他微生物群体的攻击。 热熔粘合剂可用于(例如)包装和制造由可降解材料制成的一次性制品。 整个一次性制品可以由完全可生物降解/可堆肥的粘合剂和结构材料制成。