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    • 21. 发明授权
    • Electronic-component supplying cartridge and electronic-component
supplying and picking-up apparatus
    • 电子元件供应盒和电子元件供应和拾取装置
    • US5762754A
    • 1998-06-09
    • US816967
    • 1997-03-13
    • Yoshiyuki KondoTokiyuki KunoYasuo MutoMamoru Tsuda
    • Yoshiyuki KondoTokiyuki KunoYasuo MutoMamoru Tsuda
    • B65B15/04H05K13/02H05K13/04B65H5/08
    • H05K13/0417Y10S156/937Y10S156/941Y10T156/11Y10T156/1179Y10T156/19
    • An electronic-component supplying cartridge is provided which includes a movable and an immovable jumping-out-preventing member and is free from jumping of electronic components out of electronic-component accommodating pockets, changing of posture of the components, or standing-up of the components due to suction. A shutter 210 is attached to a cover 82 fixed to a cartridge frame, such that the shutter 210 is movable relative to the cover 82 in the tape feeding direction. The shutter 210 includes a connection portion 214 having a groove 222 opening at a downstream-side end thereof as seen in the feeding direction, and a pair of movable jumping-out-preventing strips 228. When the shutter 210 is moved to a second position thereof, the strips 228 are received in receiving recesses 200, respectively. When a component carrier tape is fed, the shutter 210 is moved to a first position thereof where the strips 228 cover a component accommodating pocket fed to an electronic-component picking-up position. A component-suction nozzle is moved downward in synchronism with the retracting movement of the shutter 210 to the second position, so that the nozzle holds by suction an electronic component through the groove 222 before completion of the retracting movement of the shutter 210. Since the component is not freed before being held by the nozzle, the component does not jump out of the carrier tape.
    • 提供了一种电子部件供应盒,其包括可移动和不可移动的防跳出构件,并且不会从电子部件容纳口中跳出电子部件,改变部件的姿势或者站立 部件由于吸力。 挡板210附接到固定到盒框架上的盖82,使得挡板210可相对于盖82在胶带进给方向上移动。 闸门210包括连接部分214,该连接部分214具有在进给方向上看到的在其下游侧端部处开口的凹槽222,以及一对可移动防脱出条带228.当挡板210移动到第二位置 条228分别容纳在接收凹槽200中。 当馈送分量载带时,快门210移动到其第二位置,其中条228覆盖馈送到电子部件拾取位置的部件容纳袋。 组件吸嘴与挡板210的回缩运动同步向下移动到第二位置,使得喷嘴在快门210的回缩运动完成之前通过抽吸电子部件通过凹槽222保持。由于 组件在被喷嘴保持之前不释放,组件不会从载带跳出。
    • 22. 发明授权
    • Electronic-component supplying cartridge
    • 电子元件供应盒
    • US5588614A
    • 1996-12-31
    • US497750
    • 1995-07-03
    • Yukinori TakadaTokiyuki KunoYasuo MutoKoichi Asai
    • Yukinori TakadaTokiyuki KunoYasuo MutoKoichi Asai
    • B23P19/00B65B15/04B65D73/02B65H37/00H05K13/02H05K13/04B65H20/02
    • B65H37/002H05K13/0421B65H2511/12B65H2701/1942
    • A cartridge for supplying a carrier tape which carries a plurality of electronic components, the tape having a plurality of pockets for accommodating the respective components, and a pair of side portions on both sides of the pockets, the pockets projecting downward from the side portions, the cartridge including a cartridge frame, a tape feeding device mounted on the cartridge frame, for feeding the carrier tape in a feeding direction, a pair of rails provided on the cartridge frame such that the rails extend parallel to the feeding direction, the pair of rails supporting the pair of the portions of the carrier tape, respectively, and permitting movement of the pockets of the tape when the tape is fed on the rails by the tape feeding device, a tape positioning device which positions the carrier tape with respect to a lateral direction in which the pair of side portions of the tape are spaced from each other, and a rail adjusting device which adjusts a spacing between the pair of rails to each of a plurality of different values.
    • 一种用于提供承载多个电子部件的载带的盒,所述带具有用于容纳各个部件的多个袋,以及在所述袋的两侧上的一对侧部,所述袋从侧部向下突出, 所述盒包括盒框架,安装在盒框架上的带馈送装置,用于沿馈送方向馈送载带;设置在盒框架上的一对轨道,使得轨道平行于馈送方向延伸,所述一对 分别支撑载带的一对部分的轨道,并且当带通过带馈送装置馈送在轨道上时,允许带的移动;带定位装置,其将载带相对于 带子的一对侧部彼此间隔开的横向方向,以及调整一对轨道之间的间隔的轨道调节装置 到多个不同值中的每一个。
    • 27. 发明授权
    • Apparatus for automatically taping electronic components
    • 用于自动胶带电子元件的设备
    • US4954207A
    • 1990-09-04
    • US317639
    • 1989-03-01
    • Hirokazu HiguchiMitsuro Hamuro
    • Hirokazu HiguchiMitsuro Hamuro
    • B65B15/04H05K13/02
    • B65B15/04Y10T156/1734
    • A method and apparatus for handling electronic components. The method includes: (a) advancing an elongated support member in a first direction; (b) automatically extracting electronic components from the elongated support member in a second direction while the elongated support member is advancing in the first direction, the second direction being substantially perpendicular to the first direction; and (c) placing the electronic components on an elongated first tape and applying a second tape to the first tape to fix the electronic components between the tapes. The spacing between the electronic components within the support assembly and the spacing between the electronic components fixed between the tapes may be different. A sensor may be provided to sense the presence or absence of an electronic component within the apparatus.
    • 一种处理电子元件的方法和装置。 该方法包括:(a)沿第一方向推进细长的支撑构件; (b)当所述细长支撑构件沿所述第一方向前进时,所述第二方向基本上垂直于所述第一方向,从所述细长支撑构件沿第二方向自动地提取电子部件; 和(c)将电子部件放置在细长的第一带上并将第二带施加到第一带以将电子部件固定在带之间。 支撑组件内的电子部件之间的间隔和固定在带之间的电子部件之间的间隔可以是不同的。 可以提供传感器以感测装置内的电子部件的存在或不存在。
    • 28. 发明授权
    • Method and machine for aligning and securing rod shaped fasteners
    • 用于对准和固定杆形紧固件的方法和机器
    • US4805687A
    • 1989-02-21
    • US001365
    • 1987-01-08
    • Kenneth J. Gall
    • Kenneth J. Gall
    • B65B15/04F16B15/08B22D19/04
    • B65B15/04F16B15/08
    • A bonded strip of similar rod-like members like nails comprise a plurality of shanks aligned in an adjacent side-by-side flat parallel array, each shank having a longitudinal cylindrical shank. The shanks define at one end, a head of larger transverse dimension than the shank along most of the head transverse dimension while also communicating with a point on the circumference of the shank so that 2 adjacent nails so formed may be placed so that the shanks are preferably juxtaposed and are held by a bonding material surrounding each shank and interjoining the next with a meniscus so as to hold the strip rigid. The bonding material preferably has a melting temperature above ambient temperature during normal working conditions. In order to achieve the bonded strip the nails are collated into side-by-side relation with the flat head of one nail overlapping that of the other and preferably the head of each nail defining at least one point on the perimeter thereof of the nail that is coincident with the shank of the nail. A portion of the shank and tip of the nail are emmersed in a solution which solidifies at normal room temperature and thus acts as a rigid bonding agent to hold the nails juxtaposed, heads overlapping. The range so structured is rigid and the adhesive, if molten zinc, is on extremely cheap bonding agent.
    • 类似棒状构件的钉状粘合条包括多个在相邻并排的平行平行阵列中排列的柄,每个柄具有纵向圆柱形柄。 柄部的一端形成有大于头部横向尺寸的横向尺寸比头部大的横向尺寸的头部,同时还与柄部的圆周上的点连通,使得如此形成的2个相邻的钉子可以被放置成使得柄部 优选地并置并且由围绕每个柄部的接合材料保持,并且随后连接弯月面,以便将带材保持刚性。 接合材料在正常工作条件下优选具有高于环境温度的熔化温度。 为了实现粘合带材,钉子与一个钉子的平头相反并排,与另一个钉子的平头重叠,并且优选地每个钉子的头部限定钉子的周边上的至少一个点, 与钉子的柄吻合。 指甲的柄部和尖端的一部分浸在溶液中,该溶液在正常的室温下固化,因此用作刚性粘合剂以将钉子并置,头部重叠。 如此结构的范围是刚性的,如果熔融的锌,粘合剂是非常便宜的粘合剂。
    • 29. 发明授权
    • Method of receiving small-sized electronic parts
    • 接收小型电子零件的方法
    • US4702788A
    • 1987-10-27
    • US853211
    • 1986-04-17
    • Tokujiro Okui
    • Tokujiro Okui
    • B65B15/04B65D73/02H05K13/04B32B31/00
    • H05K13/0417Y10T156/1056Y10T156/1064Y10T156/1082Y10T156/1168Y10T428/1476Y10T428/24331
    • A number of holes for individually receiving small-sized electronic parts such as chip capacitors and ceramic capacitors are formed in a strip of carrier tape to preserve these parts. The carrier tape is made of a strip of base material and a strip of double-sided adhesive tape stuck on one surface of the base material such that the area of each portion of the adhesive layer exposed through the holes is smaller than the area of each hole. The base material is made of an electrically conductive material. Alternatively, the base material may be made of nonconductive material and the surface may be treated so as to be electrically conductive. Incisions are formed in the adhesive layer to facilitate removal of the adhesive in withdrawing the electronic parts from the tape. When the electronic parts are inserted in the holes, they are stuck on the adhesive layer, and then the tape is wound on a reel for storgage.
    • 用于单独接收诸如片状电容器和陶瓷电容器的小尺寸电子部件的多个孔形成在载带条中以保持这些部件。 载带由基材条和粘贴在基材的一个表面上的双面胶带形成,使得通过孔露出的粘合剂层的每个部分的面积小于每个部分的面积 孔。 基材由导电材料制成。 或者,基材可以由非导电材料制成,并且表面可以被处理以便导电。 在粘合剂层中形成切口,以有助于从胶带中取出电子部件中的粘合剂。 当电子部件插入孔中时,将它们粘贴在粘合剂层上,然后将带卷绕在用于存放的卷轴上。
    • 30. 发明授权
    • Electronic components assembly apparatus and method for making
    • 电子元件组装装置及制造方法
    • US4253291A
    • 1981-03-03
    • US101186
    • 1979-12-07
    • Akio YamagamiTadashi Kubota
    • Akio YamagamiTadashi Kubota
    • B65D73/02B65B15/04H01F5/02H01F17/04H05K13/02
    • H01F17/043H01F17/041H01F5/02
    • An apparatus for making electronic component assembly comprising:a first tape feeder for feeding a supporting tape to an assembly stage,a punching tool for making perforations with a predetermined pitch on said supporting tape,a feeding way for feeding electronic components near said assembly stage at then consecutively pushes said electronic component onto said supporting tape in said assembly stage,a rotating drum having around its outer face a number of projections to engage to said perforations and a number of guiding member to define positions of lead-wires of said electronic components when pushed onto said supporting tape,a second tape feeder for feeding a bonding tape onto said supporting tape at a position after said assembly stage in a manner not to cover said perforations anda bonding roller for pressing to bond said bonding tape onto said supporting roller with said lead-wires inbetween.
    • 一种用于制造电子部件组件的装置,包括:用于将支撑带馈送到组装台的第一带式馈送器,用于在所述支撑带上以预定间距进行穿孔的冲压工具,用于在所述组装台附近馈送电子部件的馈送方式 然后在所述组装台中将所述电子部件连续地推动到所述支撑带上;旋转滚筒,其周围具有若干突起以与所述穿孔接合,并且多个引导部件限定所述电子部件的引线的位置, 推入所述支撑带上的第二带式进料器,用于在不覆盖所述穿孔的方式在所述组装台之后的位置将粘合带馈送到所述支撑带上的第二带式进料器,以及用于将所述粘合带粘合到所述支撑辊上的压接辊, 说中间的导线。