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    • 23. 发明申请
    • SUBTLE VORTEX POLISHING APPARATUS
    • SUBVLE VORTEX抛光装置
    • US20140220869A1
    • 2014-08-07
    • US13756657
    • 2013-02-01
    • Southern Taiwan University of Science and Technology
    • Hsinn-Jyh TzengJian-Liang ChenFong-Yi ChenCi-Hao HuangMing Wei LiMing-Jheng Huang
    • B24B31/00
    • B24B31/003
    • A subtle vortex polishing apparatus includes a receiving unit; a stirring unit, movably provided in the receiving unit; and a transmission unit, connected to the stirring unit. The workpiece to be polished and the fluid abrasive are placed in the in the receiving unit. The stirring unit is driven by the transmission unit so that the fluid abrasive in the receiving unit forms the eddy friction for polishing the workpiece and the deburring, polishing, chamfering for the workpiece can be finished in one time. Thereby, the grinding effect of the inner and outer surfaces of the workpiece enhances, and this invention can be thus used in processing small, bored, cracked, cambered complex surfaces, achieving the effects of easy operation, single-sided or multi-surface processing at the same time, increase in the processing rate, significant reduce in labor intensity, reduced processing costs and improved productivity.
    • 微妙的涡流抛光装置包括接收单元; 可移动地设置在所述接收单元中的搅拌单元; 以及连接到搅拌单元的传动单元。 待研磨的工件和流体磨料放置在接收单元中。 搅拌单元由传动单元驱动,使得接收单元中的流体磨料形成用于抛光工件的涡流摩擦,并且可以一次完成用于工件的去毛刺,抛光,倒角。 因此,工件的内外表面的研磨效果提高,本发明可用于加工小,无孔,裂纹,弧形复杂表面,实现易于操作,单面或多面加工的效果 同时加工速度提高,劳动强度显着降低,加工成本降低,生产效率提高。
    • 24. 发明申请
    • Apparatus for surface finishing workpieces and chucking device of an apparatus of this kind
    • 这种装置的表面处理工件和夹紧装置的装置
    • US20140199923A1
    • 2014-07-17
    • US14108381
    • 2013-12-17
    • OTEC Praezisionsfinish GmbH
    • Helmut Gegenheimer
    • B24B31/00B24B41/06B24B31/10
    • B24B31/003B24B31/10B24B31/104B24B41/061
    • An apparatus for surface finishing workpieces has a workpiece holder, on which a chucking device for releasably fixing the workpieces to be machined is secured, and a container arranged underneath the workpiece holder in order to receive grinding and/or polishing granules, which can be moved relative to the workpiece holder. A chucking device has a chuck, which is designed for at least partially positive holding of the workpiece for conjoint rotation. The chucking device furthermore has a vacuum duct, which can be connected to a vacuum generator and which opens into the chuck in order to hold the workpiece in such a way that it is fixed axially by the application of a vacuum to the vacuum duct. The chuck of the chucking device is arranged on an adapter piece, which can be fixed releasably on a supporting part of the chucking device.
    • 用于表面精加工的装置具有工件保持器,在其上固定用于可释放地固定待加工的工件的夹紧装置,以及布置在工件保持器下方的容器,以容纳可以移动的研磨和/或抛光颗粒 相对于工件夹持器。 夹紧装置具有卡盘,其被设计用于至少部分地正向保持工件以用于联合旋转。 夹紧装置还具有真空管道,该真空管道可连接到真空发生器,并且通过真空发生器连接到真空管道中,以便将工件保持为轴向固定。 夹紧装置的卡盘布置在适配件上,该适配件可以可拆卸地固定在夹紧装置的支撑部分上。
    • 28. 发明授权
    • Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method
    • 通过谷物流处理方法对记录介质用基板的端面进行研磨的方法
    • US07654884B2
    • 2010-02-02
    • US11660924
    • 2005-08-26
    • Kazuyuki HanedaYoshio Kawakami
    • Kazuyuki HanedaYoshio Kawakami
    • B24B1/00B24B31/00B24B7/19G11B5/712
    • B24B9/065G11B5/8404
    • The object of the invention is to provide a method of polishing the end surfaces of a substrate for a recording medium, which is capable of efficiently polishing the inner peripheral end surface and/or the outer peripheral end surface of the substrate preventing the reliability of performance of the recording medium from being impaired by the adhesion of the residual polishing material. According to the invention, there is provided a method of polishing end surfaces of a substrate for a recording medium wherein an inner peripheral end surface or an outer peripheral end surface of a substrate for a disk-like recording medium having a circular hole at the central portion thereof is brought into contact with a polishing medium obtained by dispersing polishing grains in a viscoelastic resin carrier and the polishing medium flows, thereby to polish the inner peripheral end surface or the outer peripheral end surface.
    • 本发明的目的是提供一种抛光用于记录介质的基板的端面的方法,其能够有效地抛光基板的内周端面和/或外周端面,从而防止性能的可靠性 的记录介质受到残留的抛光材料的粘附的损害。 根据本发明,提供了一种抛光用于记录介质的基板的端面的方法,其中在中央处具有圆形孔的盘状记录介质用基板的内周端面或外周端面 使其部分与通过将研磨颗粒分散在粘弹性树脂载体中而获得的抛光介质接触,并且抛光介质流动,从而抛光内周端面或外周端面。