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    • 21. 发明申请
    • Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
    • 晶圆抛光载体设备和使用其的化学机械抛光设备
    • US20090068934A1
    • 2009-03-12
    • US12231529
    • 2008-09-03
    • Yong-Sung HongJong-Yoon ParkHyun-Joon Park
    • Yong-Sung HongJong-Yoon ParkHyun-Joon Park
    • B24B7/20B24B41/06B24B55/00B24B53/10
    • B24B37/04B24B57/00
    • A wafer polishing carrier apparatus and a chemical mechanical polishing equipment employing the same includes a drive rotary union rotating on an axis and receiving a flow of fluid through a first conduit in a sealed-up state; driven rotary unions revolving on their own axis at different sides of the drive rotary union, and receiving the flow of fluid from the drive rotary union through a second conduit in a sealed-up state; a carrier attached to an end part of the driven rotary union to adsorb/detach a wafer using a fluid pressure provided through a third conduit connected through the second conduit; and a filter filtering pollution material in the fluid flowing in and out of the third conduit on the periphery of the carrier to prevent the pollution material from escaping external to the carrier, the pollution material generated from rotation of the drive rotary union and driven rotary unions.
    • 晶片抛光载体装置和采用该晶片抛光载体的化学机械抛光装置包括:驱动旋转联轴器,其在轴上旋转并且以密封状态接收通过第一导管的流体流; 驱动旋转接头在驱动旋转接头的不同侧在其自身的轴线上旋转,并且以密封状态通过第二导管从驱动旋转接头接收流体流; 附接到从动旋转接头的端部的载体,以使用通过第二导管连接的第三导管提供的流体压力吸附/分离晶片; 以及过滤器在流入和流出载体周围的第三导管的流体中的污染物质,以防止污染物质从外部逸出,由驱动旋转联轴器和从动旋转接头旋转产生的污染物质 。
    • 22. 发明申请
    • APPARATUS FOR SMOOTHING A PRODUCT, IN PARTICULAR A SEMI-FINISHED CERAMIC PRODUCT
    • 用于吸收产品,特别是半成品陶瓷产品的设备
    • US20080311824A1
    • 2008-12-18
    • US12133818
    • 2008-06-05
    • Giorgio Sarani
    • Giorgio Sarani
    • B24B21/00B24B9/06B24B19/00B24B51/00B24B53/10B24B21/20
    • B24B19/008B24B21/16B24B55/08B28B11/0845
    • An apparatus (1) for smoothing a product (2), in particular a semi-finished ceramic product, comprises: an abrasive tool (3) in the form of an endless belt (4) which is trained around at least one pair of pulleys (5, 6), at least one of which is power-driven; the belt (4) has an active section (7) and at least one passive section (8); the active section (7) removes material from the product (2), while the passive section (8) receives a regenerating treatment that restores the abrasive capacity of the tool (3); drive means (20) acting on the belt (4) in such a way as to enable the belt (4) itself to move in the space surrounding the product (2); means (10) for spraying a liquid on the belt (4), which has liquid absorption properties, said means (10) being located in the vicinity of the belt (4) itself; and negative pressure means (9) associated with the passive section (8) of the belt (4) and operating in such a way as to extract the liquid and the materials retained by the belt (4) and removed from the product (2) during the smoothing process.
    • 一种用于平滑产品(2)的设备(1),特别是半成品陶瓷产品,包括:环形带(4)形式的研磨工具(3),其围绕至少一对滑轮 (5,6),其中至少一个是动力驱动的; 带(4)具有有效部分(7)和至少一个被动部分(8); 活动部分(7)从产品(2)中去除材料,而被动部分(8)接收恢复工具(3)的研磨能力的再生处理; 驱动装置(20)以使得带(4)本身能够在产品(2)周围的空间中移动的方式作用在带(4)上; 用于在具有液体吸收性能的带(4)上喷射液体的装置(10),所述装置(10)位于带(4)本身附近; 和负压装置(9),其与带(4)的被动部分(8)相关联并且以提取液体和由带(4)保留并从产品(2)移除的材料的方式操作, 在平滑过程中。