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21. 发明申请

US20180190838A1 METHOD FOR MAKING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER 审中-公开
公开(公告)号：US20180190838A1
公开(公告)日：2018-07-05
申请号：US15689976
申请日：2017-08-29
申请人： STMicroelectronics (Grenoble 2) SAS
发明人： Karine Saxod , Alexandre Mas , Eric Saugier , Gaetan Lobascio , Benoit Besancon
IPC分类号： H01L31/0203 , H01L31/18 , H01L31/0232 , H01L31/02 , H01L31/12 , B29C45/14
CPC分类号： H01L31/0203 , B29C45/14065 , B29C45/14639 , B29C45/14778 , B29K2995/0026 , B29L2031/3481 , H01L31/02002 , H01L31/02325 , H01L31/02327 , H01L31/12 , H01L31/18 , H01L33/483
摘要： A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

22. 发明授权

US10002988B2 Surface treatment of a semiconductor light emitting device 有权
公开(公告)号：US10002988B2
公开(公告)日：2018-06-19
申请号：US15272902
申请日：2016-09-22
申请人： KONINKLIJKE PHILIPS N.V.
发明人： Yiwen Rong , James Gordon Neff , Tak Seng Thang
IPC分类号： H01L33/22 , H01L33/00 , H01L33/48 , H01L33/50
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/32 , H01L33/483 , H01L33/50 , H01L2933/0025 , H01L2933/0041
摘要： A semiconductor light-emitting device includes a semiconductor structure having a light-emitting region. A surface of the semiconductor structure has flattened peaks.

23. 发明申请

US20180166611A1 METHOD OF PRODUCING A HOUSING COVER, METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20180166611A1
公开(公告)日：2018-06-14
申请号：US15577837
申请日：2016-05-27
申请人： OSRAM Opto Semiconductors GmbH
发明人： Tilman Ruegheimer , Juergen Dachs
IPC分类号： H01L33/48 , H01S5/022 , H01S5/02
CPC分类号： H01L33/486 , H01L21/4817 , H01L33/483 , H01L2224/48091 , H01L2933/0033 , H01L2933/0058 , H01S5/0206 , H01S5/0216 , H01S5/02216 , H01S5/02272 , H01L2924/00014
摘要： A method of producing a housing cover includes providing a cover blank having a mounting surface formed on an underside; connecting the underside of the cover blank to a silicon slice; creating at least one opening in the silicon slice to expose at least part of the mounting surface; arranging a base metallization on the exposed part of the mounting surface; and removing the silicon slice.

24. 发明申请

US20180166424A1 LIGHT-EMITTING DIODE (LED) DEVICE FOR REALIZING MULTI-COLORS 审中-公开
公开(公告)号：US20180166424A1
公开(公告)日：2018-06-14
申请号：US15833495
申请日：2017-12-06
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Sung-hyun Sim , Yong-il Kim , Wan-tae Lim , Ji-hye Yeon , Ha-nul Yoo
IPC分类号： H01L25/075 , H01L33/50 , H01L33/62 , H01L33/44 , H01L33/60 , H01L33/48 , H01L33/54
CPC分类号： H01L25/0753 , H01L33/0079 , H01L33/22 , H01L33/44 , H01L33/483 , H01L33/504 , H01L33/505 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2933/0025 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： A light-emitting diode (LED) device includes a plurality of light-emitting structures spaced apart from each other; a plurality of electrode layers on first surfaces of the plurality of light-emitting structures, respectively; a protection layer on second surfaces of each of the plurality of light-emitting structures, respectively; a separation layer to electrically insulate the plurality of light-emitting structures from each other and electrically insulate the plurality of electrode layers from each other; a plurality of phosphor layers on second surfaces of the plurality of light-emitting structures, respectively, each of the plurality of the phosphor layers each to output a different color of light; and a partitioning layer between the phosphor layers and separating the plurality of phosphor layers from each other, the partitioning layer including a substrate structure, an insulation structure, or a metal structure.

25. 发明授权

US09991673B2 Low cost optical package 有权
公开(公告)号：US09991673B2
公开(公告)日：2018-06-05
申请号：US14741081
申请日：2015-06-16
申请人： Vixar Inc.
发明人： William Hogan , Mary Brenner
IPC分类号： H01S3/04 , H01S5/022 , H01S5/00 , H01S5/183 , H01S5/42 , H01L33/48
CPC分类号： H01S5/0228 , H01L33/483 , H01L2224/48091 , H01S5/0042 , H01S5/005 , H01S5/02208 , H01S5/02236 , H01S5/02252 , H01S5/02272 , H01S5/02296 , H01S5/183 , H01S5/423 , Y10T156/10 , Y10T156/1052 , H01L2924/00014
摘要： An optical package having a patterned submount, an optoelectronic device mounted to the patterned submount, a spacer affixed on one side to the patterned submount, the spacer having a bore hole therethrough wherein the optoelectronic device is positioned, and an optical element affixed to the spacer on a side opposite the patterned submount and covering the spacer bore hole. The patterned submount may be a circuit board. The optoelectronic device may be a VCSEL. The spacer may be affixed to the circuit board, for example, using an epoxy preform or an adhesive laminate. The spacer may, for example, be manufactured from a sheet of stainless steel or from a circuit board. The optical element may be, for example, a diffuser, a concave lens, a convex lens, a holographic element, polarizers, or diffraction gratings. The optical element may be affixed to the spacer using an epoxy preform or an adhesive laminate.

26. 发明授权

US09985171B2 Optoelectronic semiconductor component 有权
公开(公告)号：US09985171B2
公开(公告)日：2018-05-29
申请号：US15632544
申请日：2017-06-26
申请人： OSRAM Opto Semiconductors GmbH
发明人： Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC分类号： H01L29/18 , H01L33/00 , H01L31/02 , H01L31/0232 , H01L31/18 , H01L33/62 , H01L33/60 , H01L33/50
CPC分类号： H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.

27. 发明申请

US20180145237A1 ULTRAVIOLET RAY EMITTING DEVICE 审中-公开
公开(公告)号：US20180145237A1
公开(公告)日：2018-05-24
申请号：US15572051
申请日：2016-04-25
申请人： SEOUL VIOSYS CO., LTD.
发明人： Jun Yong PARK , Jae Hyun PARK , Yeo Jin YOON , In Kyu PARK
IPC分类号： H01L33/64 , H01L25/075 , H01L33/48 , H01L33/62
CPC分类号： H01L33/647 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/16225
摘要： A light-emitting device is provided. The light-emitting device comprises: a first body unit including a base part and at least three conductive patterns positioned on the base part while including a plurality of element loading areas; and a plurality of light-emitting elements positioned on the plurality of element loading areas of the first body unit, wherein at least one conductive pattern among the conductive patterns is electrically connected to at least two light-emitting elements, the at least two light-emitting elements are connected to each other in series, at least two conductive patterns among the conductive patterns include pad electrode areas, an area of the plurality of conductive patterns is 80% or more of an upper surface area of the base part, and a separation distance among the plurality of conductive patterns is 200 μm to 2,400 μm.

28. 发明申请

US20180138375A1 LIGHT-EMITTING DEVICE PACKAGE 审中-公开
公开(公告)号：US20180138375A1
公开(公告)日：2018-05-17
申请号：US15728579
申请日：2017-10-10
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Woo Jung PARK , JungSung KIM , JungKyu PARK , Taeyoung CHOI
IPC分类号： H01L33/50 , H01L33/54 , H01L33/48 , H01L33/60
CPC分类号： H01L33/504 , H01L33/44 , H01L33/483 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16245
摘要： A light-emitting device (LED) package including a package body including a mounting region at an upper portion thereof; a lead frame below the package body; a semiconductor light-emitting device in the mounting region and electrically connected to the lead frame; a top layer attached to a top surface of the semiconductor light-emitting device, the top layer including a red phosphor; and a molding layer in the mounting region, the molding layer covering the top layer and including a short-wavelength phosphor having a peak emission wavelength that is shorter than a peak emission wavelength of the red phosphor, wherein the top layer exposes a side surface of the semiconductor light-emitting device, and the molding layer is in contact with the side surface of the semiconductor light-emitting device.

29. 发明申请

US20180132329A1 TUNABLE LED EMITTER WITH CONTINUOUS SPECTRUM 审中-公开
公开(公告)号：US20180132329A1
公开(公告)日：2018-05-10
申请号：US15348940
申请日：2016-11-10
申请人： LedEngin, Inc.
发明人： Xiantao Yan , Kachun Lee , Shifan Cheng , Julio Cesar Alvarado
IPC分类号： H05B33/08 , H01L25/075 , H01L33/62 , H01L33/48 , H01L33/54 , H01L33/56 , H01L33/58
CPC分类号： H05B33/0857 , H01L25/0753 , H01L33/483 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/62 , H05B33/0827 , H05B33/0845 , H05B33/086
摘要： A light emitting device can include a substrate with LED chips disposed on a surface of the substrate. The LED chips can include chips of at least four different colors. Electrical paths disposed in part on the substrate and in part within the substrate can connect the LED chips into at least three independently addressable groups, and the number of independently addressable groups can be less than the number of colors of LED chips, so that at least one of the groups includes LED chips of two or more different colors.

30. 发明授权

US09966510B2 Signaling system having improved contrast ration 有权
公开(公告)号：US09966510B2
公开(公告)日：2018-05-08
申请号：US13502565
申请日：2009-10-30
申请人： Marcel Peter Gerard Maes
发明人： Marcel Peter Gerard Maes
IPC分类号： H01L33/58 , G08G1/095 , H01L33/46 , H01L33/48 , F21Y115/10
CPC分类号： G08G1/095 , F21S43/14 , F21Y2115/10 , H01L33/46 , H01L33/483 , H01L33/58
摘要： The invention relates to a signaling system comprising at least one light-emitting device (1) for showing a signal or warning to a viewer (99), wherein, in operational use, the light-emitting device (1) is configured for emitting radiation with a light distribution forming a solid angle in space, wherein a center line of the solid angle is defined as an optical axis (Z) of the light-emitting device (1). The light-emitting device (1) comprises a transparent housing (3), a reflector (5) and a light-emitting part (7) arranged within the housing (3), wherein the reflector (5) and the light-emitting part (7) are configured for generating the radiation with said light distribution. The signaling system further comprises blocking means (10) are arranged substantially at one side of the light-emitting device (1). The blocking means (10) are configured for individually blocking, in operational use, at least part of the radiation emitted by the light-emitting device (1) in a direction substantially parallel to the optical axis (Z), wherein the one side is defined with respect to a fictitious plane through the optical axis (Z). The invention further relates to various applications of such signaling system. Despite the lower luminance of the light-emitting device, the invention provides for a higher-contrast ratio in case of a low-angled sun with respect to the optical axis (Z).

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