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    • 24. 发明授权
    • Nonvolatile memory and three-state FETs using cladded quantum dot gate structure
    • 非易失性存储器和采用包层量子点栅极结构的三态FET
    • US09153594B2
    • 2015-10-06
    • US12077453
    • 2008-03-20
    • Faquir C. Jain
    • Faquir C. Jain
    • H01L29/06H01L27/115G11C11/56H01L21/28H01L27/11H01L29/10H01L29/423H01L29/66H01L29/778G11C11/412
    • H01L27/11521G11C11/412G11C11/56H01L21/28273H01L21/28282H01L27/1104H01L29/1054H01L29/42332H01L29/42348H01L29/66825H01L29/66833H01L29/7782H01L29/7783
    • The present invention discloses use of quantum dot gate FETs as a nonvolatile memory element that can be used in flash memory architecture as well as in a nonvolatile random access memory (NVRAM) configuration that does not require refreshing of data as in dynamic random access memories. Another innovation is the design of quantum dot gate nonvolatile memory and 3-state devices using modulation doped field-effect transistors (MODFETs), particularly MOS-gate field effect transistors. The cladded quantum dot gate MODFETs can be designed in Si—SiGe, InGaAs—InP and other material systems. The incorporation of 3-state FET devices in static random access memory (SRAM) cell is described to result in advanced multi-state memory operation. Unlike conventional SRAMs, the 3-state QD-FET based of SRAMs provides 3 and 4-state memory operation due to the utilization of the intermediate states particularly in CMOS configuration. QD-gate FETs, potentially suitable for 8 nm channel lengths, in vertical configuration (VFET) are also described.
    • 本发明公开了使用量子点栅极FET作为非易失性存储器元件,其可用于闪速存储器结构以及不需要刷新数据的非易失性随机存取存储器(NVRAM)配置,如在动态随机存取存储器中。 另一个创新是使用调制掺杂场效应晶体管(MODFET),特别是MOS栅场效应晶体管的量子点栅非易失性存储器和3态器件的设计。 包层的量子点栅极MODFET可以在Si-SiGe,InGaAs-InP等材料体系中进行设计。 描述了将三态FET器件并入到静态随机存取存储器(SRAM)单元中以导致高级多状态存储器操作。 与传统SRAM不同,由于采用了中间状态,因此,基于SRAM的3态QD-FET可以提供3和4态存储器操作,特别是在CMOS配置中。 还描述了垂直配置(VFET)中可能适合于8nm沟道长度的QD栅极FET。
    • 28. 发明授权
    • Semiconductor device
    • 半导体器件
    • US09000488B2
    • 2015-04-07
    • US13946602
    • 2013-07-19
    • Fujitsu Limited
    • Akira Endoh
    • H01L29/778H01L29/66H01L29/423H01L29/205
    • H01L29/778H01L29/205H01L29/42316H01L29/66462H01L29/7782H01L29/7784
    • A semiconductor device includes: an electron transit layer formed with a semiconductor material, the electron transit layer being formed on a semiconductor substrate; an n-type semiconductor layer formed with a semiconductor material having a wider bandgap than the electron transit layer, the n-type semiconductor layer being formed on the electron transit layer; a δ doping area having an n-type impurity doped in a sheet-shaped region, the δ doping area being formed on the n-type semiconductor layer; and a barrier layer formed with a semiconductor material having a wider bandgap than the electron transit layer, the barrier layer being formed on the δ doping area.
    • 半导体器件包括:形成有半导体材料的电子转移层,电子转移层形成在半导体衬底上; 形成有比电子转移层宽的带隙的半导体材料的n型半导体层,n型半导体层形成在电子转移层上; 具有掺杂在片状区域中的n型杂质的δ掺杂区域,所述δ掺杂区域形成在所述n型半导体层上; 以及阻挡层,其形成有具有比电子转移层更宽的带隙的半导体材料,所述势垒层形成在δ掺杂区域上。