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21. 发明申请

US20160159969A1 EPOXY RESIN COMPOSITIONS 审中-公开
标题翻译：环氧树脂组合物
公开(公告)号：US20160159969A1
公开(公告)日：2016-06-09
申请号：US14907675
申请日：2013-07-26
申请人： BLUE CUBE IP LLC
发明人： Chen CHEN , Yan WU , Yue SHEN , Yurun YANG
IPC分类号： C08G59/24 , C09D163/00 , C08G59/50 , C07D303/26
CPC分类号： C08G59/245 , C07D303/26 , C08G59/504 , C08L2205/025 , C08L2205/03 , C09D163/00
摘要： A novel modified epoxy compound that is capable of providing a coating composition with acceptable viscosity, short tack-free time and thy-hard time, and providing resultant coating films with good impact resistance; a process of preparing the modified epoxy compound; an epoxy resin composition comprising the modified epoxy compound; and a curable coating composition comprising the epoxy resin composition and a curing agent.
摘要翻译：一种新型改性环氧化合物，其能够提供具有可接受粘度，短粘合时间和耐磨时间的涂料组合物，并提供具有良好抗冲击性的所得涂膜; 制备改性环氧化合物的方法; 包含改性环氧化合物的环氧树脂组合物; 以及包含环氧树脂组合物和固化剂的可固化涂料组合物。

22. 发明申请

US20160083542A1 IMPROVEMENTS IN OR RELATING TO EPOXY RESIN FORMULATIONS 有权
标题翻译：环氧树脂配方的改进或相关
公开(公告)号：US20160083542A1
公开(公告)日：2016-03-24
申请号：US14888892
申请日：2014-06-17
申请人： HEXCEL COMPOSITES LIMITED
发明人： Matthew Cleaver
IPC分类号： C08J5/24 , C08J5/04 , B32B15/14 , C08G59/56 , C09J163/00 , C08L63/00 , C08G59/50
CPC分类号： C08J5/24 , B32B7/12 , B32B15/14 , B32B15/20 , B32B2260/021 , B32B2260/046 , B32B2262/0269 , B32B2262/101 , B32B2262/106 , B32B2305/076 , B32B2307/51 , B32B2603/00 , B32B2605/00 , C08G59/182 , C08G59/226 , C08G59/504 , C08G59/56 , C08J5/043 , C08J2363/00 , C08J2463/00 , C08J2463/02 , C08L63/00 , C08L2205/02 , C08L2205/025 , C08L2205/03 , C08L2205/035 , C09J163/00 , C08L51/00 , C08L71/00
摘要： Epoxy formulations comprising a polyfunctional epoxy resin, a solid bisphenol A epoxy resin, a phenolic end capped bisphenol A resin, a rubber epoxy adduct and a curative are provided as is their use in prepregs and as matrix materials in laminates of metal foil and fibre reinforced epoxy resins.
摘要翻译：提供包含多官能环氧树脂，固体双酚A环氧树脂，酚类封端双酚A树脂，橡胶环氧加合物和固化剂的环氧树脂配方，如它们在预浸料中的用途以及作为金属箔和纤维增强层压材料的基质材料环氧树脂。

23. 发明授权

US09249282B2 Curable resin composition and short-cure method 有权
公开(公告)号：US09249282B2
公开(公告)日：2016-02-02
申请号：US14686847
申请日：2015-04-15
申请人： CYTEC TECHNOLOGY CORP.
发明人： Jonathan E. Meegan
IPC分类号： C08L63/00 , C08L63/02 , C08G59/38 , C08G59/50 , C08K7/06 , C08G65/22 , D06M17/04 , C08G85/00 , C08G59/56 , B29C70/48 , C08G59/00 , C08J3/24 , B29C45/02 , C08G59/24 , C08G59/32 , B29K63/00 , B29K105/08
CPC分类号： C08K7/06 , B29C70/48 , B29K2063/00 , B29K2105/0809 , C08G59/00 , C08G59/38 , C08G59/50 , C08G59/5026 , C08G59/504 , C08G59/56 , C08G65/22 , C08G85/00 , C08J3/243 , C08J3/244 , C08J2363/00 , C08L63/00 , D06M17/04 , Y10T428/24994 , Y10T428/31511
摘要： Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.

24. 发明申请

US20150305152A1 EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING INSULATING LAYER USING THE EPOXY RESIN COMPOSITION 有权
标题翻译：环氧树脂组合物和印刷电路板包括使用环氧树脂组合物的绝缘层
公开(公告)号：US20150305152A1
公开(公告)日：2015-10-22
申请号：US14647721
申请日：2013-11-22
申请人： LG INNOTEK CO., LTD.
发明人： Geon Young KIL , Myeong Jeong KIM , Jae Man PARK , Jong Heum YOON , Jeung Ook PARK , Sung Jin YUN , Jong Sik LEE , Sang A. JU , Yeo Eun YOON
IPC分类号： H05K1/03 , C08G59/22 , C09K5/14 , C08G59/56 , C08L63/00 , H05K1/05 , C08K3/22 , C08G59/50
CPC分类号： H05K1/0373 , C08G59/226 , C08G59/245 , C08G59/5033 , C08G59/504 , C08G59/56 , C08G2250/00 , C08K3/013 , C08K3/22 , C08K5/41 , C08K2003/2227 , C08L63/00 , C08L2203/20 , C09K5/14 , H01B3/40 , H05K1/056 , H05K2201/0209
摘要： An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.
摘要翻译：根据本发明实施方案的环氧树脂组合物包括环氧化合物，包括二氨基二苯砜和无机填料的固化剂。

25. 发明申请

US20150284608A1 AMINE COMPOSITION FOR A CRASH-RESISTANT 2K EPOXY ADHESIVE 审中-公开
标题翻译：用于耐冲击2K环氧胶的胺组合物
公开(公告)号：US20150284608A1
公开(公告)日：2015-10-08
申请号：US14440418
申请日：2013-11-08
申请人： SIKA TECHNOLOGY AG
发明人： David Hofstetter , Tina Voci , Jan Olaf Schulenburg
IPC分类号： C09J163/00 , C08K3/36
CPC分类号： C09J163/00 , C08G59/4021 , C08G59/5026 , C08G59/504 , C08G59/56 , C08G2650/50 , C08K3/36
摘要： The invention relates to a curing agent component for use in a two-component epoxy adhesive made of a component A including an epoxy resin and a curing agent component B, wherein the curing agent component B1) includes at least one aliphatic alicyclic polyether amine with at least 2 amino groups and B2) at least one polyamine selected from a phenalkylamine or an aliphatic polyether amine, containing at least one alicyclic alkoxylate segment and at least one cycloaliphatic segment, and optionally B3) at least one amine compound selected from an amine-terminated rubber, an amine-terminated poly(tetramethylene ether glycol) and an amine-terminated poly(tetramethylene ether glycol)-poly(propylene glycol) copolymer.
摘要翻译：本发明涉及一种用于由包含环氧树脂和固化剂组分B的组分A制成的双组分环氧粘合剂中的固化剂组分，其中固化剂组分B1）包括至少一种脂族脂环族聚醚胺，其具有至少2个氨基和B2）至少一种选自苯烷基胺或脂族聚醚胺的多胺，其含有至少一个脂环族烷氧基化物链段和至少一个脂环族链段，以及任选地B3）至少一种胺化合物，其选自胺封端橡胶，胺封端的聚（四亚甲基醚二醇）和胺封端的聚（四亚甲基醚二醇） - 聚（丙二醇）共聚物。

26. 发明申请

US20150284525A1 THERMALLY EXPANDABLE RESIN COMPOSITION 有权
标题翻译：热膨胀树脂组合物
公开(公告)号：US20150284525A1
公开(公告)日：2015-10-08
申请号：US14434796
申请日：2013-10-10
申请人： SEKISUI CHEMICAL CO., LTD.
发明人： Toshitaka Yoshitake , Masaki Tono , Kenji Otsuka , Hideaki Yano
IPC分类号： C08J9/00 , C08K3/26 , C08G59/50 , C08K3/32 , C08K3/04 , C08G59/22
CPC分类号： C08K5/34928 , C08G59/226 , C08G59/308 , C08G59/504 , C08J9/0066 , C08J2363/02 , C08K3/04 , C08K3/22 , C08K3/26 , C08K3/32 , C08K2003/2241 , C08K2003/265 , C08K2003/323 , C08L2205/02 , C08L2205/03 , C08L63/00
摘要： A thermally expandable resin composition containing an epoxy resin, a thermally expandable graphite, and an inorganic filler excluding graphite. The epoxy compound contained in said epoxy resin contains a brominated epoxy compound, and contains, in addition to the brominated epoxy compound, a bisphenol-type epoxy compound and/or an aliphatic epoxy compound, wherein the weight ratio of the brominated epoxy compound to the bisphenol-type epoxy compound and/or aliphatic epoxy compound is in the range 99:1-1:99.
摘要翻译：一种含有环氧树脂，可热膨胀石墨和不含石墨的无机填料的热膨胀性树脂组合物。所述环氧树脂中含有的环氧化合物含有溴化环氧化合物，除溴系环氧化合物外还含有双酚型环氧化合物和/或脂肪族环氧化合物，其中溴化环氧化合物与双酚型环氧化合物和/或脂肪族环氧化合物的比例在99:1-1:99的范围内。

27. 发明申请

US20150218345A1 CURABLE RESIN COMPOSITION AND SHORT-CURE METHOD 审中-公开
标题翻译：可固化树脂组合物和短效方法
公开(公告)号：US20150218345A1
公开(公告)日：2015-08-06
申请号：US14686847
申请日：2015-04-15
申请人： CYTEC TECHNOLOGY CORP.
发明人： Jonathan E. Meegan
IPC分类号： C08K7/06 , B29C70/48 , C08G59/00
CPC分类号： C08K7/06 , B29C70/48 , B29K2063/00 , B29K2105/0809 , C08G59/00 , C08G59/38 , C08G59/50 , C08G59/5026 , C08G59/504 , C08G59/56 , C08G65/22 , C08G85/00 , C08J3/243 , C08J3/244 , C08J2363/00 , C08L63/00 , D06M17/04 , Y10T428/24994 , Y10T428/31511
摘要： Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.
摘要翻译：本文公开了一种利用由低温固化反应产生的放热能进行高温固化反应的方法，否则在所选择的工具温度下能够达到高能量固化反应，从而产生固化的树脂基质，其特性与所生产的通过高温固化反应，但通过短的固化时间和低固化温度实现。还公开了一种短固化树脂组合物，其包含：（a）至少一种环氧官能度大于1的多官能环氧树脂; （b）一种硬化剂组合物，其包含（i）至少一种每分子具有一个或多个氨基的脂族或脂环族胺固化剂; （ii）每分子具有一个或多个氨基的至少一种芳族胺固化剂; 和（iii）咪唑作为固化促进剂。该树脂组合物的改进的性质包括在<120℃的温度下可固化的时间小于10分钟，以达到比由相同组成衍生的固化程度更高的刚性（i）脂族/ 脂环族胺或（ii）芳族胺。

28. 发明授权

US09068040B2 Solvent resistant thermoplastic toughened epoxy 有权
标题翻译：耐溶剂热塑性增韧环氧树脂
公开(公告)号：US09068040B2
公开(公告)日：2015-06-30
申请号：US12902302
申请日：2010-10-12
申请人： Yen-Seine Wang
发明人： Yen-Seine Wang
IPC分类号： C08L63/00 , C08G59/50 , C08G59/32
CPC分类号： C08G59/504 , C08G59/32 , C08L63/00 , C08L2205/02 , C08L81/06
摘要： Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4′-Bis(p-aminophenoxy) biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.
摘要翻译：热塑性增韧环氧树脂，用于制造用于航空航天应用的预浸料。树脂包括作为固化剂的包含三官能环氧树脂和/或四官能环氧树脂，热塑性组分和4,4'-双（对氨基苯氧基）联苯（BAPB）的环氧树脂组分。发现使用BAPB作为固化剂可以增加固化树脂对溶剂的抵抗力。

29. 发明申请

US20150094448A1 SMART POLYMER MATERIALS WITH EXCESS REACTIVE MOLECULES 有权
标题翻译：具有超强反应性分子的SMART聚合物材料
公开(公告)号：US20150094448A1
公开(公告)日：2015-04-02
申请号：US14385403
申请日：2013-03-13
申请人： MEDIPACS, INC , THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA
发明人： Mark Banister , Yordan Geronov , Dominic McGrath
IPC分类号： C08G65/26
CPC分类号： C08G65/2624 , C08G59/22 , C08G59/504 , C08G83/004 , C08G2650/50 , C08L63/00 , C08L67/00
摘要： A three-dimensional smart polymer matrix is formed by a first epoxy chemical reaction linking a linear polymer chain and a branched polymer chain, wherein the polymer chains are flexible and one or more reactive molecule species remain unreacted, at a predetermined mathematical ratio of reacted to un-reacted molecules and molecule species, and the un-reacted molecular species are available for further chemical reaction, protonation or deprotonation after the first chemical reaction. The resulting smart polymer matrix is hydrophilic and non-soluble to a solvent or electrolyte.
摘要翻译：通过连接线性聚合物链和支链聚合物链的第一环氧化学反应形成三维智能聚合物基质，其中聚合物链是柔性的并且一个或多个反应性分子物质保持未反应，以预定的数学比率反应未反应的分子和分子物质，未反应的分子物质可用于在第一次化学反应后进一步的化学反应，质子化或去质子化。所得的智能聚合物基质是亲水的并且不溶于溶剂或电解质。

30. 发明申请

US20150093320A1 CARBON PRECURSOR COMPOSITION 审中-公开
标题翻译：碳前驱体组合物
公开(公告)号：US20150093320A1
公开(公告)日：2015-04-02
申请号：US14391721
申请日：2013-05-17
申请人： Dow Global Technologies LLC
发明人： Hamed H. Lakrout , Maurice J. Marks , Ludovic Valette
IPC分类号： C08G59/24 , C08G59/50 , C01B31/02 , C08G59/62
CPC分类号： C09D163/00 , C01B32/05 , C08G59/245 , C08G59/504 , C08G59/621
摘要： A liquid carbon precursor composition including (a) at least one aromatic epoxy resin; and (b)(i) at least one aromatic co-reactive curing agent or (b)(ii) at least one catalytic curing agent, or (b)(iii) a mixture thereof; wherein the liquid composition prior to adding optional components and curing, has a neat viscosity of less than 10,000 mPa-s, at 25° C.; and wherein the liquid precursor composition has a neat viscosity of less than 10,000 mPa-s at 25° C. prior to adding optional components, prior to curing, and prior to carbonizing; and wherein the liquid precursor composition being cured has a carbon yield of at least 35 weight percent as measured in the absence of optional components; a cured liquid carbon precursor composition; a carbonized material made from the above liquid carbon precursor composition; and processes for producing the above compositions.
摘要翻译：一种液体碳前体组合物，其包含（a）至少一种芳族环氧树脂; 和（b）（i）至少一种芳族共反应性固化剂或（b）（ii）至少一种催化固化剂，或（b）（iii）它们的混合物; 其中在添加任选组分和固化之前的液体组合物在25℃下具有小于10,000mPa·s的纯粘度; 并且其中所述液体前体组合物在25℃下具有小于10,000mPa·s的纯粘度，然后在固化之前和在碳化之前添加任选组分。并且其中固化的液体前体组合物具有至少35重量％的碳收率，在不存在任选组分的情况下测量; 固化液体碳前体组合物; 由上述液态碳前体组合物制成的碳化材料; 以及制备上述组合物的方法。

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