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21. 发明申请

US20120177942A1 COMPOSITE STRUCTURE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：复合结构及其制造方法
公开(公告)号：US20120177942A1
公开(公告)日：2012-07-12
申请号：US13344796
申请日：2012-01-06
申请人： Chia-Ming CHANG , Shih-Chang YEH , Chung-Ho LIU , Sheng-Hung YI
发明人： Chia-Ming CHANG , Shih-Chang YEH , Chung-Ho LIU , Sheng-Hung YI
IPC分类号： B32B5/18 , B05D5/00 , B05D3/02
CPC分类号： H04M1/0277 , H05K5/0008 , Y10T428/12479
摘要： A composite structure for an electronic device includes: a metallic base part made from a metallic material and having at least one bonding region; at least one porous protrusion made from a sintered metal powder and bonded to and protruding from the bonding region; and at least one feature molded over the porous protrusion.
摘要翻译：一种用于电子设备的复合结构包括：由金属材料制成并具有至少一个接合区域的金属基部; 至少一个由烧结金属粉末制成的多孔突起，并且粘合并从接合区域突出; 以及模制在所述多孔突起上的至少一个特征。

22. 发明申请

US20070252305A1 DOUBLE-INJECTION MOLDING METHOD 审中-公开
标题翻译：双注射成型方法
公开(公告)号：US20070252305A1
公开(公告)日：2007-11-01
申请号：US11689093
申请日：2007-03-21
申请人： Nan-Hui Kuo , Chia-Meng Lai , Ying-Chieh Ting , Chi-Chao Lin
发明人： Nan-Hui Kuo , Chia-Meng Lai , Ying-Chieh Ting , Chi-Chao Lin
IPC分类号： B29C45/16
CPC分类号： B29C45/1615 , B29C37/0082 , B29C45/062 , B29C45/1657 , B29L2031/3437
摘要： Double-injection molding methods through which the products do not have any parting lines between the molding materials comprise a mold, which has at least a male mold and a female mold. The male mold comprises at least one core. The female mold comprises at least one cavity and one core. The core of the male mold and the core of the female mold can be combined tightly. The male mold is stationary but the female mold is removable. The molding method of the present invention is to manufacture a product with two different plastic materials, where these two different plastic materials are injected into the mold in a specific order. And these two different plastic materials connect each other directly. After packing and cooling process, these two different plastic materials are shaped in the mold. A product with a smooth profile at the boundary of two materials is thus performed.
摘要翻译：产品在成型材料之间不具有任何分型线的双注射成型方法包括至少具有阳模和阴模的模具。阳模包括至少一个芯。阴模包括至少一个腔和一个芯。阳模的核心和阴模的芯可以紧密结合。阳模是固定的，但是阴模是可拆卸的。本发明的成型方法是制造具有两种不同塑料材料的产品，其中这两种不同的塑料材料以特定的顺序注入到模具中。而这两种不同的塑料材料直接相连。在包装和冷却过程中，这两种不同的塑料材料在模具中成型。因此执行在两种材料的边界处具有平滑轮廓的产品。

23. 发明授权

US11752499B2 Substrate assembly and method of bonding substrates 有权
公开(公告)号：US11752499B2
公开(公告)日：2023-09-12
申请号：US17507112
申请日：2021-10-21
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Sung-Yi Yang , Pao-Chuan Wang
IPC分类号： B01L3/00 , B81B7/00 , B81C3/00 , B32B3/30 , B32B3/26 , B32B7/12 , B32B27/08
CPC分类号： B01L3/502707 , B01L3/502715 , B32B3/266 , B32B3/30 , B32B7/12 , B32B27/08 , B81B7/0025 , B81C3/001 , B01L2200/12 , B01L2300/0816 , B01L2300/0883 , B01L2300/0887 , B32B2307/73 , B81B2201/05 , B81B2203/0338 , B81B2203/0353 , B81C2203/032
摘要： A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

24. 发明授权

US11280887B2 LiDAR system and electronic device 有权
公开(公告)号：US11280887B2
公开(公告)日：2022-03-22
申请号：US16120970
申请日：2018-09-04
申请人： TAIWAN GREEN POINT ENTERPRISES CO., LTD.
发明人： Chun-Wei Chen , Ching-Lung Mao , Chin-Feng Yang
IPC分类号： H02S40/38 , G01S7/481 , H02S99/00 , H01L25/13 , H02S20/30
摘要： An electronic device includes a base seat, a rotary seat rotatably coupled to the base seat, a drive mechanism for driving the rotary seat to rotate relative to the base seat, a power consumption unit disposed on and co-rotatable with the rotary seat, and a power supply unit. The power supply unit includes a solar panel disposed in the rotary seat and electrically connected to the power consumption unit, and a light emitting module operable to emit light toward the solar panel so that the solar panel transforms light energy into electric energy, which is supplied to the power consumption unit.

25. 发明授权

US11089692B2 Catalytic ink comprising metallic material made from diamminesilver hydroxide, and uses thereof 有权
公开(公告)号：US11089692B2
公开(公告)日：2021-08-10
申请号：US16183106
申请日：2018-11-07
申请人： TAIWAN GREEN POINT ENTERPRISES CO. LTD.
发明人： Pen-Yi Liao , Hui-Ching Chuang , Wen-Chia Tsai , Jing-Yi Yang
IPC分类号： B32B5/16 , H05K3/18 , C09D11/03 , C09D11/10 , B01J27/24 , B01J35/02
摘要： A catalyst for a catalytic ink includes a support particle and a metallic material supported on the support particle. The metallic material is diamminesilver hydroxide, a silver salt, a palladium salt, a gold salt, chloroauric acid, or combinations thereof. A catalytic ink obtained from the catalyst and use of the same to fabricate a conductive circuit are also disclosed.

26. 发明授权

US10781982B2 Method for making an LED lighting fixture 有权
公开(公告)号：US10781982B2
公开(公告)日：2020-09-22
申请号：US15964989
申请日：2018-04-27
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Sheng-Hung Yi , I-Lin Tseng , Po-Cheng Huang , Hui-Ju Yang
IPC分类号： H05K3/30 , F21K9/90 , F21K9/232 , F21Y107/50 , F21Y107/30 , F21Y107/80
摘要： A method for making an LED lighting fixture includes the steps of: a) cutting a flat blank to form a flat plate including a central piece having a central region and a circumferential region, and a plurality of peripheral extensions; b) forming on the flat plate a patterned circuit which includes a plurality of electrical contact pairs that are formed on the central piece or the peripheral extensions; c) bringing a plurality of LED dies into electrical contact with the electrical contact pairs, respectively; and d) bending the peripheral extensions rearwardly relative to the central piece and toward the central axis to form a shell.

27. 发明授权

US10443131B2 Method of forming patterned metal unit, and patterned article formed with the same 有权
公开(公告)号：US10443131B2
公开(公告)日：2019-10-15
申请号：US15967041
申请日：2018-04-30
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Pen-Yi Liao , Hui-Ching Chuang , Chih-Hao Chen , Jing-Yi Yang , Wen-Chia Tsai , Yao-Tsung Ho
IPC分类号： C23C18/31 , C23C18/16 , C23C18/20 , C23C18/18 , B01J37/02 , H05K3/04 , H05K3/18 , B41M5/382 , B01J35/00
摘要： A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.

28. 发明申请

US20190045638A1 DOUBLE-SIDED CIRCUIT BOARD AND METHOD FOR PREPARING THE SAME 审中-公开
公开(公告)号：US20190045638A1
公开(公告)日：2019-02-07
申请号：US16154822
申请日：2018-10-09
申请人： TAIWAN GREEN POINT ENTERPRISES CO., LTD.
发明人： I Lin Tseng , Tzu Chun Chen
IPC分类号： H05K3/46 , H05K3/10 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/42 , H05K3/38 , H05K3/18 , H05K3/02 , B23K26/384
摘要： A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.

29. 发明申请

US20180339372A1 SOLDER ALLOY AND SOLDER COMPOSITION 审中-公开
公开(公告)号：US20180339372A1
公开(公告)日：2018-11-29
申请号：US15983960
申请日：2018-05-18
申请人： Taiwan Green Point Enterprises Co., Ltd.
发明人： Che-Cheng Chang
IPC分类号： B23K35/26 , C22C12/00 , C22C30/04
摘要： A solder alloy includes 18 wt % to 28 wt % of indium, 44.5 wt % to 54.5 wt % of bismuth, greater than 0 wt % and not more than 1.45 wt % of zirconium, and the balance being tin, based on 100 wt % of the solder alloy.

30. 发明申请

US20180245777A1 ILLUMINATING DEVICE AND METHODS FOR MAKING THE SAME 审中-公开
公开(公告)号：US20180245777A1
公开(公告)日：2018-08-30
申请号：US15965227
申请日：2018-04-27
申请人： TAIWAN GREEN POINT ENTERPRISES CO., LTD.
发明人： Pen-Yi LIAO , Chung-Ho LIU , Hung-Chun CHEN
IPC分类号： F21V15/01 , F21Y115/10
CPC分类号： F21V15/01 , F21Y2115/10 , Y10T29/49117
摘要： An illuminating device includes an insulative housing, at least two electrodes and a light source. The insulative housing has opposite front and rear surfaces and is formed with at least two through holes. Each of the through holes is defined by a hole wall and penetrates the front and rear surfaces. Each of the electrodes includes a first conductive segment formed proximate the front surface, a second conductive segment formed proximate the rear surface, and a connecting segment formed inside a respective one of the through holes and interconnecting electrically the first and second conductive segments. The light source is disposed on the front surface and includes first and second connecting terminals each being electrically coupled to the first conductive segment of a corresponding one of the electrodes.

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