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21. 发明授权

US06433427B1 Wafer level package incorporating dual stress buffer layers for I/O redistribution and method for fabrication 有权
标题翻译：晶圆级封装结合了用于I / O再分配的双应力缓冲层和制造方法
公开(公告)号：US06433427B1
公开(公告)日：2002-08-13
申请号：US09761487
申请日：2001-01-16
申请人： Enboa Wu , Tsung-Yao Chu , Hsin-Chien Huang , Chung-Tao Chang
发明人： Enboa Wu , Tsung-Yao Chu , Hsin-Chien Huang , Chung-Tao Chang
IPC分类号： H01L2940
CPC分类号： H01L24/03 , H01L23/3114 , H01L23/3192 , H01L24/11 , H01L2224/02125 , H01L2224/0231 , H01L2224/0401 , H01L2224/05572 , H01L2224/1147 , H01L2224/13099 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A wafer level package that incorporates dual stress buffer layers for achieving I/O pad redistribution and a method for forming the package are disclosed. In the package, a first stress buffer layer and a second stress buffer layer are sequentially deposited on top of an IC die by a method such as spin coating, laminating, screen printing or stencil printing of an elastic material which has a Young's modulus of less than 10 MPa. A suitable thickness for the first and the second stress buffer layer is between about 10 &mgr;m and about 70 &mgr;m. Metal traces are formed on top of the first and the second stress buffer layer for connecting a first plurality of I/O pads and a second plurality of I/O pads to achieve I/O redistribution.
摘要翻译：公开了一种晶片级封装，其包含用于实现I / O焊盘再分配的双应力缓冲层和形成封装的方法。在封装中，第一应力缓冲层和第二应力缓冲层通过诸如旋涂，层压，丝网印刷或模板印刷的方法依次沉积在IC管芯的顶部上，弹性材料的杨氏模量较小超过10MPa。用于第一和第二应力缓冲层的合适的厚度在约10μm至约70μm之间。金属迹线形成在用于连接第一多个I / O焊盘和第二多个I / O焊盘的第一和第二应力缓冲层的顶部，以实现I / O再分配。

22. 发明申请

US20120300453A1 OMNI REFLECTIVE OPTICS FOR WIDE ANGLE EMISSION LED LIGHT BULB 有权
标题翻译： OMNI反射光学用于宽角度发射LED灯泡
公开(公告)号：US20120300453A1
公开(公告)日：2012-11-29
申请号：US13426627
申请日：2012-03-22
申请人： Li Zhou , Kai Chiu Wu , Enboa Wu
发明人： Li Zhou , Kai Chiu Wu , Enboa Wu
IPC分类号： F21V7/00 , F21V29/00
CPC分类号： F21V29/505 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V3/00 , F21V3/063 , F21V3/12 , F21V13/02 , F21V29/773 , F21V29/86 , F21Y2115/10
摘要： A structure is provided to create an efficient light pattern conversion from a narrow angular light beam pattern of a light emitting source to a wide angle light intensity distribution for an omnidirectional lighting assembly. A heat conductive substrate includes an LED array with at least one central and at least one surrounding LED. A hollow light diverting component is positioned over the LED array; a central LED is within the hollow component while surrounding LEDs are positioned outside. Light emitted by the central LED is reflected off inner surfaces of the hollow component to be discharged from an upper opening. The outer component surface is configured to reflect light from the surrounding LEDs in azimuthal and circumferential directions towards a region below the upper opening. In this manner, plural LEDs are used to form a wide angle emission pattern suitable for use in conventional light bulb replacement devices.
摘要翻译：提供一种结构以产生从发光源的窄角度光束图案到全向照明组件的广角光强度分布的有效的光图案转换。导热基板包括具有至少一个中心和至少一个周围LED的LED阵列。中空光转向部件位于LED阵列上方; 中央LED在中空部件内，而周围的LED位于外部。由中央LED发射的光从中空部件的内表面反射，从上部开口排出。外部部件表面被配置为将方位角和圆周方向上的周围LED的光反射到上部开口下方的区域。以这种方式，使用多个LED来形成适用于常规灯泡更换装置的广角发射图案。

23. 发明授权

US07351609B2 Method for wafer level package of sensor chip 有权
标题翻译：传感器芯片晶圆级封装方法
公开(公告)号：US07351609B2
公开(公告)日：2008-04-01
申请号：US11385882
申请日：2006-03-22
申请人： Enboa Wu , Rou-Ching Yang
发明人： Enboa Wu , Rou-Ching Yang
IPC分类号： H01L21/00
CPC分类号： H01L27/14618 , H01L23/3114 , H01L2924/0002 , H01L2924/00
摘要： A method for wafer level package (WLP) of sensor chips is provided, including the steps of: providing a wafer, the wafer including a plurality of die regions, each the die region on a first surface of the wafer comprising an active area and a pad surrounding the active area; bounding a transparent protective layer to the first surface of the wafer; forming a stress buffer on a second surface of the wafer; using etching or laser drill to form a via hole at the location between two neighboring die regions through the stress buffer and the wafer to expose the pad or a conductive line between two neighboring pads; and forming a plurality of bump electrodes on the stress buffer for electrical connection to the pads through the via holes. The method can prevent pollution of the die, improve the convenience of package, reduce the manufacture cost, increase the package reliability, and solve the stress problem caused by attaching the die directly to the PCB.
摘要翻译：提供了一种用于传感器芯片的晶片级封装（WLP）的方法，包括以下步骤：提供晶片，晶片包括多个管芯区域，每个管芯区域在晶片的第一表面上包括有源区和围绕活动区域的垫; 将透明保护层限定在晶片的第一表面上; 在所述晶片的第二表面上形成应力缓冲器; 使用蚀刻或激光钻孔在通过应力缓冲器和晶片的两个相邻管芯区域之间的位置处形成通孔，以暴露焊盘或两个相邻焊盘之间的导电线; 以及在所述应力缓冲器上形成多个凸起电极，以通过所述通孔与所述焊盘电连接。该方法可以防止模具污染，提高包装的便利性，降低制造成本，提高包装可靠性，解决将模具直接连接到PCB所引起的应力问题。

24. 发明授权

US07271020B2 Light emitting diode covered with a reflective layer and method for fabricating the same 有权
标题翻译：用反射层覆盖的发光二极管及其制造方法
公开(公告)号：US07271020B2
公开(公告)日：2007-09-18
申请号：US11234223
申请日：2005-09-26
申请人： Enboa Wu , Xing-Xiang Liu , Chia-Shou Chang
发明人： Enboa Wu , Xing-Xiang Liu , Chia-Shou Chang
IPC分类号： H01L21/00
CPC分类号： H01L33/46 , H01L2924/0002 , H01L2924/00
摘要： A light emitting diode (LED) covered with a reflective layer by imprinting process is provided. The imprinting process includes coating a plastic layer on a mold to form an imprinting substrate; coating a reflective layer on the plastic layer and modifying the shape of the reflective layer to fit the shape of outer surfaces of the light emitting diode; softening the plastic layer and impressing the mold covered with the reflective layer upon the LED structure so that the reflective layer adheres to the surfaces of LED; and removing the mold. Because the reflective layer has high reflectivity, the light emitted from the top surface and side surfaces of LED is reflected back to the light extraction direction, and thereby the light extraction efficiency is enhanced.
摘要翻译：提供了通过压印工艺覆盖有反射层的发光二极管（LED）。压印方法包括在模具上涂覆塑料层以形成压印基板; 在塑料层上涂覆反射层并改变反射层的形状以适应发光二极管外表面的形状; 软化塑料层并将覆盖有反射层的模具压印在LED结构上，使得反射层粘附到LED的表面; 并移除模具。由于反射层具有高反射率，所以从LED的顶表面和侧表面发射的光被反射回到光提取方向，从而提高了光提取效率。

25. 发明授权

US07203426B2 Optical subassembly of optical transceiver 有权
标题翻译：光收发器光组件
公开(公告)号：US07203426B2
公开(公告)日：2007-04-10
申请号：US11144720
申请日：2005-06-04
申请人： Enboa Wu , Ying-Ching Shih
发明人： Enboa Wu , Ying-Ching Shih
IPC分类号： H04B10/00
CPC分类号： G02B6/4214 , G02B6/29361 , G02B6/4246
摘要： A transceiver module comprised of a multiplexing/demultiplexing optical subassembly is provided. The optical subassembly includes either a transmitter module or a receiver module or both. The transmitter module has laser diodes emitting optical signals, which are reflected by reflectors, and coupled together by thin film filter. The receiver module includes thin film filters that decouple a received optical signal into constituent components. These components are reflected by reflectors to photo detectors by which the optical signals are converted into electrical signals. The reflector are capable of dual axis adjustment for adjustment of inclination thereof to effect active alignment. Further, the transmitter module and the receiver module define positioning recesses to position the laser diodes and photo detectors. The recesses are sized in accordance with the wavelengths associated with the laser diodes and photo detectors to effect passive alignment.
摘要翻译：提供了由复用/解复用光学子组件组成的收发器模块。光学子组件包括发射器模块或接收器模块或两者。发射器模块具有发射光信号的激光二极管，其被反射器反射并通过薄膜滤波器耦合在一起。接收器模块包括将接收的光信号分离成组成部件的薄膜滤波器。这些部件被反射器反射到光电检测器，光信号将被转换成电信号。反射器能够进行双轴调节，以调整其倾斜度以实现主动对准。此外，发射器模块和接收器模块限定定位凹槽以定位激光二极管和光电检测器。根据与激光二极管和光电检测器相关联的波长来调整凹槽的大小，以实现被动对准。

26. 发明申请

US20070007237A1 Method for self-assembling microstructures 审中-公开
标题翻译：自组装微结构的方法
公开(公告)号：US20070007237A1
公开(公告)日：2007-01-11
申请号：US11172960
申请日：2005-07-05
申请人： Enboa Wu , Chia-Shou Chang
发明人： Enboa Wu , Chia-Shou Chang
IPC分类号： C23F1/00 , B44C1/22 , C03C15/00
CPC分类号： B81C1/00214 , B23K3/0623 , B23K2101/40 , B81C3/002 , H01L24/95 , H01L25/50 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/95085 , H01L2224/95092 , H01L2224/95122 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/00 , H01L2224/05599
摘要： A method for self-assembling microstructures onto a substrate includes using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force. The microstructures are self-aligned with the substrate, and further are permanently fixed on and electrically connected with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the method. The method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.
摘要翻译：用于将微结构自组装到衬底上的方法包括使用接合材料通过物理吸引力将微结构组装在衬底上。微结构与衬底自对准，并且通过由微焊料和衬底之间的焊料凸块永久地固定在衬底上并与衬底电连接，该焊料凸块通过回焊工艺由焊料凸块形成。在该方法中不需要使用传统的拾取和放置装置。该方法可以应用于发光二极管，RFID标签，微集成电路或其他类型的微结构。

27. 发明申请

US20060274999A1 Optical subassembly of optical transceiver 有权
标题翻译：光收发器光组件
公开(公告)号：US20060274999A1
公开(公告)日：2006-12-07
申请号：US11144720
申请日：2005-06-04
申请人： Enboa Wu , Ying-Ching Shih
发明人： Enboa Wu , Ying-Ching Shih
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , G02B6/29361 , G02B6/4246
摘要： A transceiver module comprised of a multiplexing/demultiplexing optical subassembly is provided. The optical subassembly includes either a transmitter module or a receiver module or both. The transmitter module has laser diodes emitting optical signals, which are reflected by reflectors, and coupled together by thin film filter. The receiver module includes thin film filters that decouple a received optical signal into constituent components. These components are reflected by reflectors to photo detectors by which the optical signals are converted into electrical signals. The reflector are capable of dual axis adjustment for adjustment of inclination thereof to effect active alignment. Further, the transmitter module and the receiver module define positioning recesses to position the laser diodes and photo detectors. The recesses are sized in accordance with the wavelengths associated with the laser diodes and photo detectors to effect passive alignment.
摘要翻译：提供了由复用/解复用光学子组件组成的收发器模块。光学子组件包括发射器模块或接收器模块或两者。发射器模块具有发射光信号的激光二极管，其被反射器反射并通过薄膜滤波器耦合在一起。接收器模块包括将接收的光信号分离成组成部件的薄膜滤波器。这些部件被反射器反射到光电检测器，光信号将被转换成电信号。反射器能够进行双轴调节，以调整其倾斜度以实现主动对准。此外，发射器模块和接收器模块限定定位凹槽以定位激光二极管和光电检测器。根据与激光二极管和光电检测器相关联的波长来调整凹槽的大小，以实现被动对准。

28. 发明授权

US07013066B1 Tunable long period fiber grating structure and fabrication method 失效
标题翻译：可调谐长周期光纤光栅结构及制作方法
公开(公告)号：US07013066B1
公开(公告)日：2006-03-14
申请号：US11038321
申请日：2005-01-19
申请人： Enboa Wu , Rou-Ching Yang , Kuo-Ching San
发明人： Enboa Wu , Rou-Ching Yang , Kuo-Ching San
IPC分类号： G02B6/34
CPC分类号： G02B6/02071 , G02B6/022
摘要： The invention discloses a tunable long period fiber grating structure and fabrication method, which produces an expected microbending deformation by adjusting the temperature and making use of the unmatched coefficients of thermal expansion between different materials, and thus creating a phenomenon of mode coupling effect occurred in traditional optical gratings in order to provide the structure and fabrication method for having an effect of tuning spectra by controlling the temperature. This invention not only can be applied to the optical communications and wavelength dependent multiplexed devices and equipments, but also can be applied to the temperature and deformation detection. The tunable long period fiber grating structure in accordance to the present invention comprises a substrate; a periodic structure being disposed thereon and having a first coefficient of thermal expansion; a coupling agent, having a second coefficient of thermal expansion for fixing a fiber to the periodic structure; wherein the first and second coefficients of thermal expansion are different.
摘要翻译：本发明公开了一种可调谐长周期光纤光栅结构及其制造方法，通过调节温度并利用不同材料之间的不匹配的热膨胀系数产生预期的微弯曲变形，从而产生传统的模式耦合效应现象光栅，以提供通过控制温度来调节光谱的效果的结构和制造方法。本发明不仅可以应用于光通信和波长依赖多路复用装置和设备，而且可以应用于温度和变形检测。根据本发明的可调谐长周期光纤光栅结构包括基板; 周期性结构设置在其上并具有第一热膨胀系数; 具有用于将纤维固定到周期性结构的第二热膨胀系数的偶联剂; 其中所述第一和第二热膨胀系数不同。

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