专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US5539257A Resin molded type semiconductor device having a conductor film 失效
公开(公告)号：US5539257A
公开(公告)日：1996-07-23
申请号：US456942
申请日：1995-06-01
申请人： Yuji Hara , Satoru Ito , Tatsuro Toya
发明人： Yuji Hara , Satoru Ito , Tatsuro Toya
IPC分类号： H01L23/29 , H01L23/31 , H01L23/58 , H01L27/02 , H01L23/48 , H01L29/34 , H01L29/44
CPC分类号： H01L23/3171 , H01L23/291 , H01L23/585 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/181
摘要： A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

22. 发明授权

US4625227A Resin molded type semiconductor device having a conductor film 失效
标题翻译：具有导体膜的树脂模制型半导体器件
公开(公告)号：US4625227A
公开(公告)日：1986-11-25
申请号：US744151
申请日：1985-06-13
申请人： Yuji Hara , Satoru Ito , Tatsuro Toya
发明人： Yuji Hara , Satoru Ito , Tatsuro Toya
IPC分类号： H01L21/822 , H01L21/31 , H01L21/3205 , H01L23/29 , H01L23/31 , H01L23/52 , H01L23/58 , H01L27/04 , H01L29/40 , H01L23/48 , H01L27/02 , H01L29/34
CPC分类号： H01L23/585 , H01L23/291 , H01L23/3171 , H01L24/05 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/01014 , H01L2924/01068 , H01L2924/01077 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/181
摘要： A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.
摘要翻译：树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。

23. 发明授权

US08461251B2 Method for producing fluoroolefin copolymer solution and method for producing coating composition 有权
标题翻译：氟烯烃共聚物溶液的制备方法和涂料组合物的制备方法
公开(公告)号：US08461251B2
公开(公告)日：2013-06-11
申请号：US13186730
申请日：2011-07-20
申请人： Yuji Hara , Kiyoshi Kasahara , Shou Masuda
发明人： Yuji Hara , Kiyoshi Kasahara , Shou Masuda
IPC分类号： C09D127/12
CPC分类号： C08F2/44 , C08F214/18 , C08F214/186 , C08F216/14 , C08F216/1408 , C08K3/26 , C09D127/12
摘要： A method for producing a fluoroolefin copolymer solution, gives the copolymer solution good storage stability and suppressed coloration. The method for producing a fluoroolefin copolymer solution includes subjecting at least one fluoroolefin and at least one monomer other than the fluoroolefin to a solution polymerization in an organic solvent in the presence of potassium carbonate and hydrotalcite.
摘要翻译：一种制备氟代烯烃共聚物溶液的方法，使共聚物溶液具有良好的储存稳定性和抑制着色。氟代烯烃共聚物溶液的制造方法包括在碳酸钾和水滑石的存在下，使至少一种氟代烯烃和除氟代烯烃以外的至少一种单体在有机溶剂中进行溶液聚合。

24. 发明授权

US07652110B2 Powder coating composition 有权
标题翻译：粉末涂料组合物
公开(公告)号：US07652110B2
公开(公告)日：2010-01-26
申请号：US12248923
申请日：2008-10-10
申请人： Sho Masuda , Yuji Hara , Kouichi Sasaki
发明人： Sho Masuda , Yuji Hara , Kouichi Sasaki
IPC分类号： C08F12/20
CPC分类号： C09D127/12 , C08G18/6279 , C08G2150/20 , C08K5/0025 , C08K5/29 , C09D5/03 , C09D175/04
摘要： The claimed invention relates to a powder coating composition containing a fluorinated copolymer (X) having a glass transition point of at least 50° C. and a number average molecular weight of from 10,000 to 22,000, and a curing agent (Y), wherein the fluorinated copolymer (X) is a copolymer obtained by polymerization of a monomer mixture containing (A) from 45 to 55 mol % of chlorotrifluoroethylene and/or tetrafluoroethylene, (B) from 2 to 40 mol % of a vinyl ether which has a C4 or 5 alkyl group containing a tertiary carbon atom, (C) from 5 to 20 mol % of a vinyl ether having a crosslinkable functional group, and (E) from 1 to 32 mol % of a vinyl ester which has a C3-5 alkyl group containing a tertiary or higher carbon atom, wherein the total content of (B) and (E) is from 30 to 50 mol %, and the curing agent (Y) is reactive with the crosslinkable functional group.
摘要翻译：所要求保护的发明涉及含有玻璃化转变温度为至少50℃，数均分子量为10,000〜22,000的氟化共聚物（X）和固化剂（Y）的粉末涂料组合物，其中，含氟共聚物（X）是通过聚合含有（A）45〜55摩尔％的三氟氯乙烯和/或四氟乙烯的单体混合物，（B）的2-40摩尔％的具有C4或 5个含有叔碳原子的烷基，（C）5〜20摩尔％的具有交联性官能团的乙烯基醚，（E）1〜32摩尔％的具有C3-5烷基的乙烯基酯（B）和（E）的总含量为30〜50摩尔％，固化剂（Y）与交联性官能团反应。

25. 发明申请

US20090078974A1 Solid-state image capturing device; manufacturing method for the solid-state image capturing device; and electronic information device 审中-公开
标题翻译：固态摄像装置; 固体摄像装置的制造方法; 和电子信息设备
公开(公告)号：US20090078974A1
公开(公告)日：2009-03-26
申请号：US12229915
申请日：2008-08-28
申请人： Kenichi Nagai , Noboru Takeuchi , Kazuo Ootsubo , Yuji Hara
发明人： Kenichi Nagai , Noboru Takeuchi , Kazuo Ootsubo , Yuji Hara
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L27/14685 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14636
摘要： A solid-state image capturing device is provided with a plurality of light receiving elements arranged on a surface section of a semiconductor substrate, a color filter of each color for each of the plurality of light receiving elements, and a plurality of microlenses each for condensing incident light into each of the plurality of light receiving elements, in which the interlayer insulation film is provided directly below the color filter of each color in a state where a passivation and hydrogen sintering process film is removed from the interlayer insulation film.
摘要翻译：固体摄像装置具备配置在半导体衬底的表面部分上的多个光接收元件，多个光接收元件中的每一个的每种颜色的滤色器以及用于冷凝的多个微透镜在从层间绝缘膜去除钝化和氢烧结工艺膜的状态下，将入射光引入到多个光接收元件中的每一个中，其中层间绝缘膜直接设置在每种颜色的滤色器的正下方。

26. 发明授权

US5583381A Resin molded type-semiconductor device having a conductor film 失效
标题翻译：具有导体膜的树脂模制型半导体器件
公开(公告)号：US5583381A
公开(公告)日：1996-12-10
申请号：US535956
申请日：1995-09-28
申请人： Yuji Hara , Satoru Ito , Tatsuro Toya
发明人： Yuji Hara , Satoru Ito , Tatsuro Toya
IPC分类号： H01L23/29 , H01L23/31 , H01L23/58 , H01L29/34 , H01L23/48 , H01L27/02 , H01L29/40
CPC分类号： H01L23/3171 , H01L23/291 , H01L23/585 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/181
摘要： A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.
摘要翻译：树脂模制型半导体器件具有形成为覆盖四边形半导体衬底的表面的周缘的金属保护环。为了防止保护环上的钝化膜由于聚集在半导体衬底的四个角中的树脂模具封装而受到应力的破坏，在保护环的角部形成有狭缝或一排小孔。

27. 发明授权

US08875654B2 Apparatus for manufacturing cylindrical member and method of manufacturing cylindrical member 有权
标题翻译：用于制造圆柱形构件的装置和制造圆柱形构件的方法
公开(公告)号：US08875654B2
公开(公告)日：2014-11-04
申请号：US12543030
申请日：2009-08-18
申请人： Yuji Hara , Arimichi Fukuda
发明人： Yuji Hara , Arimichi Fukuda
IPC分类号： B05C11/00 , B05C11/10 , G03G15/16 , G03G15/02 , G03G15/08
CPC分类号： G03G15/0233 , B05C11/1015 , G03G15/0818 , G03G15/1685
摘要： The invention provides an apparatus for manufacturing a cylindrical member comprising a cylindrical core body having an outer peripheral surface with a releasing property, the apparatus comprising: a film-forming device that forms a resin film in a region at a central portion from both ends in the axial direction of the outer peripheral surface of the core body; a judging device that judges the deterioration of the releasing property of regions continuous from the region where the resin film is to be formed in the region at the inner side from both ends in the axial direction of the outer peripheral surface of the core body, before the resin film is formed by the film-forming device; and a control device that controls the film-forming device such that the resin film is formed by exposing regions with an undeteriorated releasing property on both ends in the axial direction of the outer peripheral surface of the core body, in accordance with the results of judgment by the judging device.
摘要翻译：本发明提供了一种用于制造圆柱形构件的装置，其包括具有释放性能的外周表面的圆柱形芯体，该装置包括：成膜装置，其在来自两端的中心部分的区域中形成树脂膜芯体的外周面的轴向; 判断装置，其判断从在芯体的外周面的轴向的两端的内侧的区域中与要形成树脂膜的区域连续的区域的剥离性的劣化，树脂膜由成膜装置形成; 以及控制装置，其根据判断结果控制成膜装置，使得树脂膜通过在核心体的外周面的轴向的两端露出具有未脱离性的区域而形成，由判断装置。

28. 发明授权

US5900884A Parametric curve generating device generating a Bezier curve for font character utilization or an arbitrary parametric curve 失效
标题翻译：参数曲线生成装置生成用于字体字符利用的贝塞尔曲线或任意参数曲线
公开(公告)号：US5900884A
公开(公告)日：1999-05-04
申请号：US657033
申请日：1996-05-29
申请人： Toshiaki Minami , Tatsuhiko Yamazaki , Hayao Ohzu , Yuji Hara
发明人： Toshiaki Minami , Tatsuhiko Yamazaki , Hayao Ohzu , Yuji Hara
IPC分类号： G06F7/00 , G06F17/17 , G06T11/20 , G06F17/21
CPC分类号： G06F17/17
摘要： A parametric curve generating device for developing a Bezier curve is provided. The device is capable of executing a high speed division operation with a limited magnitude of hardware scale. Adders perform calculations that are stored in registers. Convergence discrimination circuits discriminate whether data stored in the registers converge. Subsequent processing varies depending on the discrimination result. A stack memory is used to store data from the registers.
摘要翻译：提供了一种用于开发贝塞尔曲线的参数曲线生成装置。该设备能够以有限的硬件规模执行高速分割操作。加法器执行存储在寄存器中的计算。收敛识别电路鉴别存储在寄存器中的数据是否收敛。随后的处理因辨别结果而异。堆栈存储器用于存储寄存器中的数据。

29. 发明授权

US5872574A Image processing apparatus and method 失效
标题翻译：图像处理装置及方法
公开(公告)号：US5872574A
公开(公告)日：1999-02-16
申请号：US866113
申请日：1997-05-30
申请人： Yuji Hara , Tatsuhiko Yamazaki , Hayao Ohzu , Toshiaki Minami
发明人： Yuji Hara , Tatsuhiko Yamazaki , Hayao Ohzu , Toshiaki Minami
IPC分类号： B41J2/485 , G06F3/153 , G06T11/40 , G09G5/24 , G09G5/36 , G09G5/393 , G06F15/00
CPC分类号： G06T11/40
摘要： A minimum coordinate value at least in one direction of a parameter data group including a start point and an end point of a stroke is detected and outline coordinates are generated from the parameter data group by an outline coordinate generator and a minimum coordinate detector. An outline data generator stores range data indicative of a painting range into a predetermined address in an outline buffer on the basis of the outline coordinates and the minimum coordinate value or the maximum coordinate value. An address generator generates a drawing start address and an end address in a bit map memory in accordance with a value based on the minimum coordinate value and the predetermined address and with the range data. A painter paints by writing the same value into all data between the drawing start address and end address in the bit map memory, thereby generating a character pattern at a high speed by a buffer memory of a small capacity.
摘要翻译：检测包括笔画的开始点和结束点的参数数据组的至少一个方向上的最小坐标值，并且通过轮廓坐标生成器和最小坐标检测器从参数数据组生成轮廓坐标。轮廓数据发生器基于轮廓坐标和最小坐标值或最大坐标值，将指示绘制范围的范围数据存储在轮廓缓冲器中的预定地址中。地址生成器根据基于最小坐标值和预定地址以及范围数据的值，生成位图存储器中的绘图起始地址和结束地址。通过向位图存储器中的绘图起始地址和结束地址之间的所有数据写入相同的值来绘画，通过小容量的缓冲存储器高速地生成字符图形。

30. 发明授权

US5468998A Resin molded type semiconductor device having a conductor film 失效
公开(公告)号：US5468998A
公开(公告)日：1995-11-21
申请号：US293559
申请日：1994-08-22
申请人： Yuji Hara , Satoru Ito , Tatsuro Toya
发明人： Yuji Hara , Satoru Ito , Tatsuro Toya
IPC分类号： H01L23/29 , H01L23/31 , H01L23/58 , H01L29/34 , H01L23/48 , H01L27/02 , H01L29/40
CPC分类号： H01L23/3171 , H01L23/291 , H01L23/585 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/181
摘要： A resin molded type semiconductor device has a metallic guard ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the guard ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the guard ring.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式