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21. 发明申请

US20070161360A1 Communication semiconductor integrated circuit device and a wireless communication system 失效
标题翻译：通信半导体集成电路器件和无线通信系统
公开(公告)号：US20070161360A1
公开(公告)日：2007-07-12
申请号：US11727217
申请日：2007-03-26
申请人： Toshiya Uozumi , Yasuyuki Kimura , Hirotaka Osawa , Satoru Yamamoto , Robert Henshaw
发明人： Toshiya Uozumi , Yasuyuki Kimura , Hirotaka Osawa , Satoru Yamamoto , Robert Henshaw
IPC分类号： H04B7/00
CPC分类号： H04B1/04 , H03C3/0925 , H03C3/0933 , H03D7/165 , H03D2200/0047 , H03J1/005 , H03L7/1976
摘要： In a communication semiconductor integrated circuit device using offset PLL architectures and including an oscillator circuit and a frequency divider circuit generating an intermediate frequency signal, the oscillator circuit includes an oscillator, a programmable frequency divider which frequency-divides the oscillation signal in accordance with frequency division information, a phase comparator detecting a phase difference between an output signal of the programmable frequency divider and a reference signal, and a frequency control unit for outputting a signal indicative of the phase difference and controlling the oscillation frequency of the oscillator, wherein a frequency division ratio generator circuit generates an integer part I and a fraction part F/G based on band information concerning the use frequency band and mode information along with channel information and for producing the frequency division ratio information to thereby give it to the programmable frequency divider.
摘要翻译：在使用偏移PLL结构并且包括产生中频信号的振荡电路和分频器电路的通信半导体集成电路器件中，振荡器电路包括振荡器，可编程分频器，其根据频率分频振荡信号信息，检测可编程分频器的输出信号和参考信号之间的相位差的相位比较器，以及用于输出指示相位差并控制振荡器的振荡频率的信号的频率控制单元，其中分频基于与使用频带和模式信息相关的频带信息以及频道信息生成整数部分I和分数部分F / G，并产生分频比信息，从而将其分配给可编程分频器。

22. 发明申请

US20060283285A1 Operation mechanism 审中-公开
标题翻译：操作机制
公开(公告)号：US20060283285A1
公开(公告)日：2006-12-21
申请号：US10572475
申请日：2005-06-07
申请人： Hiroyuki Yabashi , Satoru Yamamoto
发明人： Hiroyuki Yabashi , Satoru Yamamoto
IPC分类号： G05G1/10
CPC分类号： H01H3/08 , H01H2003/026 , H01H2003/085 , Y10T74/2084
摘要： An operation unit includes a shaft-side operation member 6 attached to the above-mentioned operating shaft 3, an auxiliary operation member 7 which is fitted into and engaged with the above-mentioned shaft-side operation member 6 via an engagement means 7a for releasing engagement between the shaft-side operation member and the auxiliary operation member when shocked, and which constitutes the single operation unit together with the shaft-side operation member, and a boundary portion 8 disposed between the above-mentioned operation members with being exposed to outside the above-mentioned front panel when the above-mentioned shaft-side operation member 6 is attached to the above-mentioned operating shaft 3 while being combined with the above-mentioned auxiliary operation member 7.
摘要翻译：操作单元包括安装在上述操作轴3上的轴侧操作构件6，辅助操作构件7，其经由接合装置7a装配并与上述轴侧操作构件6接合，在轴侧操作构件和辅助操作构件之间的冲击时释放接合，并且与轴侧操作构件一起构成单个操作单元，以及设置在上述操作构件之间的边界部分8，其暴露于当上述轴侧操作构件6与上述辅助操作构件7组合时，将上述轴侧操作构件6安装到上述操作轴3上时，位于上述前面板外侧。

23. 发明申请

US20060088323A1 Design support program and design support method 审中-公开
标题翻译：设计支持方案和设计支持方法
公开(公告)号：US20060088323A1
公开(公告)日：2006-04-27
申请号：US11258499
申请日：2005-10-25
申请人： Akira Morisawa , Atsushi Chaki , Satoru Yamamoto , Masahiro Serizawa , Hideyuki Ikegami , Akiko Kanno , Toru Ono
发明人： Akira Morisawa , Atsushi Chaki , Satoru Yamamoto , Masahiro Serizawa , Hideyuki Ikegami , Akiko Kanno , Toru Ono
IPC分类号： G03G15/00
CPC分类号： G03G15/5012 , G03G2215/00548
摘要： A design support method which enables the verification of processing operation of software which controls a sheet conveying mechanism by displaying the process, in which a virtual sheet is conveyed, on a display portion, comprising a first procedure of setting failure occurrence conditions of a virtual device beforehand, a second procedure of judging whether the failure occurrence conditions set in the first procedure are satisfied, and a third procedure of generating a failure of a virtual device when it is judged in the second procedure that the failure occurrence conditions are satisfied.
摘要翻译：一种设计支持方法，其能够通过显示在显示部分上显示虚拟纸张的处理来控制纸张传送机构的软件的处理操作的验证，该显示部分包括设置虚拟设备的故障发生条件的第一过程预先确定是否满足在第一过程中设置的故障发生条件是否满足的第二过程，以及当在第二过程中判断满足故障发生条件时，产生虚拟设备的故障的第三过程。

24. 发明申请

US20060086616A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20060086616A1
公开(公告)日：2006-04-27
申请号：US11245490
申请日：2005-10-07
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Shinya Morisawa , Junji Kunisawa , Kunihito Ide , Hidenao Suzuki , Emanuel Cooper , Philippe Vereecken , Brett Baker-O' Neal , Hariklia Deligianni
IPC分类号： C25D21/12 , C25B15/00
CPC分类号： C25D5/22 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/005 , C25D17/12 , C25D21/12 , H01L21/2885 , H01L21/7684 , H01L21/76849 , H01L21/76877
摘要： A plating apparatus can securely carry out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.
摘要翻译：电镀装置可以可靠地进行基板的平坦化镀以形成具有平坦表面的镀膜而不使用昂贵的机构，并且不对基板施加额外的电镀。电镀装置包括：基板支架; 具有用于水密密封基板的周边部分的密封部件的阴极部分和用于向基板供给电流的阴极电极; 设置在面向所述基板的表面的位置的阳极; 设置在所述阳极和所述基板的表面之间的多孔构件; 恒定电压控制部分，用于以恒定值控制在所述阴极和所述阳极之间施加的电压; 以及电流监视部分，用于监视在阴极和阳极之间流动的电流，并将检测信号反馈到恒压控制部分。

25. 发明申请

US20060014513A1 Communication semiconductor integrated circuit device and a wireless communication system 有权
公开(公告)号：US20060014513A1
公开(公告)日：2006-01-19
申请号：US11181876
申请日：2005-07-15
申请人： Toshiya Uozumi , Yasuyuki Kimura , Hirotaka Osawa , Satoru Yamamoto , Robert Henshaw
发明人： Toshiya Uozumi , Yasuyuki Kimura , Hirotaka Osawa , Satoru Yamamoto , Robert Henshaw
IPC分类号： H04B1/26
CPC分类号： H04B1/04 , H03C3/0925 , H03C3/0933 , H03D7/165 , H03D2200/0047 , H03J1/005 , H03L7/1976
摘要： In a communication semiconductor integrated circuit device using offset PLL architectures and including an oscillator circuit and a frequency divider circuit generating an intermediate frequency signal, the oscillator circuit includes an oscillator, a programmable frequency divider which frequency-divides the oscillation signal in accordance with frequency division information, a phase comparator detecting a phase difference between an output signal of the programmable frequency divider and a reference signal, and a frequency control unit for outputting a signal indicative of the phase difference and controlling the oscillation frequency of the oscillator, wherein a frequency division ratio generator circuit generates an integer part I and a fraction part F/G based on band information concerning the use frequency band and mode information along with channel information and for producing the frequency division ratio information to thereby give it to the programmable frequency divider.

26. 发明申请

US20060014510A1 Semiconductor integrated circuit for wireless communication 失效
标题翻译：半导体集成电路用于无线通信
公开(公告)号：US20060014510A1
公开(公告)日：2006-01-19
申请号：US11178511
申请日：2005-07-12
申请人： Satoru Yamamoto , Kazuhisa Okada
发明人： Satoru Yamamoto , Kazuhisa Okada
IPC分类号： H04B7/00
CPC分类号： H03L7/099 , H03J1/005 , H03J2200/10 , H03L7/087 , H03L7/10 , H03L7/193 , H03L7/199
摘要： A semiconductor integrated circuit with a PLL (Phase Locked Loop) built therein is used in a semiconductor integrated circuit for wireless communication. The PLL circuit generates an oscillation signal having a predetermined frequency, which is combined with a receive signal or a transmit signal for wireless communication. The PLL circuit includes a VCO capable of switching an oscillation frequency band, a variable divider, a loop filter and a phase comparator. An oscillation frequency of the VCO is controlled according to the difference in phase between a signal obtained by dividing the output of the VCO and a reference signal, and a discrimination circuit makes a decision as to a lead or delay of the phase of an output of the variable divider with respect to a reference signal having a predetermined frequency. An auto band selection circuit generates a signal for selecting a frequency band for the VCO.
摘要翻译：在其中内置PLL（锁相环）的半导体集成电路用于无线通信的半导体集成电路中。 PLL电路产生具有与用于无线通信的接收信号或发送信号组合的预定频率的振荡信号。 PLL电路包括能够切换振荡频带的VCO，可变分频器，环路滤波器和相位比较器。 VCO的振荡频率根据通过对VCO的输出进行分频而得到的信号与基准信号之间的相位差进行控制，判别电路判断为输出的相位的导通或延迟相对于具有预定频率的参考信号的可变分频器。自动频带选择电路产生用于选择VCO的频带的信号。

27. 发明授权

US06985679B2 Image forming apparatus with cleaning operation for special sheets 有权
标题翻译：具有清洁作业的图像形成装置
公开(公告)号：US06985679B2
公开(公告)日：2006-01-10
申请号：US10357360
申请日：2003-02-04
申请人： Shokyo Koh , Eiichi Motoyama , Mitsuhiko Sato , Takashi Fujimori , Hidenori Sunada , Hideyuki Ikegami , Satoru Yamamoto
发明人： Shokyo Koh , Eiichi Motoyama , Mitsuhiko Sato , Takashi Fujimori , Hidenori Sunada , Hideyuki Ikegami , Satoru Yamamoto
IPC分类号： G03G15/00
CPC分类号： G03G15/166 , G03G15/168 , G03G15/6594 , G03G2215/00523 , G03G2215/1657 , G03G2215/1661
摘要： An image forming apparatus including an image forming unit for forming an image on a recording sheet including a special sheet, and a controller for allowing the image forming unit to carry out an image forming sequence which forms an image on the recording sheet, wherein the controller allows the image forming unit to control a cleaning operation of the image forming unit in response to image formation on the special sheet by the image forming unit.
摘要翻译：一种图像形成装置，包括：图像形成单元，用于在包括特殊纸张的记录纸上形成图像;以及控制器，用于允许图像形成单元执行在记录纸上形成图像的图像形成顺序，其中控制器允许图像形成单元响应于由图像形成单元在特殊纸张上的图像形成来控制图像形成单元的清洁操作。

28. 发明申请

US20050241946A1 Plating apparatus and plating method 失效
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050241946A1
公开(公告)日：2005-11-03
申请号：US11016924
申请日：2004-12-21
申请人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
发明人： Mizuki Nagai , Hiroyuki Kanda , Keiichi Kurashina , Satoru Yamamoto , Ryoichi Kimizuka , Hariklia Deligianni , Brett Baker , Keith Kwietniak , Panayotis Andricacos , Philippe Vereecken
IPC分类号： C25D3/38 , C25D5/00 , C25D5/02 , C25D5/08 , C25D5/18 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/768
CPC分类号： C25D3/38 , C25D5/02 , C25D5/18 , C25D7/123 , C25D17/001 , C25D17/007 , C25D17/008 , H01L21/2885 , H01L21/76877
摘要： A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
摘要翻译：电镀方法能够机械地和电化学地优先在诸如沟槽和通孔的精细互连凹槽中沉积镀膜，并将镀膜沉积到更平坦的表面上。电镀方法包括：设置具有导电层面向阳极的细微互连凹槽的衬底; 在基板和阳极之间设置多孔构件; 在基板和阳极之间填充电镀液; 并且重复保持导电层和多孔构件彼此接触并相对于彼此移动导电层和多孔构件的过程，使导电层和阳极之间的电流通过，同时保持导电相对于多孔构件的静止层，以及停止在导电层和阳极之间的电流的供给的处理。

29. 发明申请

US20050051434A1 Method and apparatus for controlling electrolytic solution 审中-公开
标题翻译：电解液控制方法及装置
公开(公告)号：US20050051434A1
公开(公告)日：2005-03-10
申请号：US10933353
申请日：2004-09-03
申请人： Koji Mishima , Masao Hodai , Hiroyuki Kanda , Kunihito Ide , Satoru Yamamoto , Seiji Katsuoka , Masaaki Kinbara , Masaji Akahori , Sota Nakagawa
发明人： Koji Mishima , Masao Hodai , Hiroyuki Kanda , Kunihito Ide , Satoru Yamamoto , Seiji Katsuoka , Masaaki Kinbara , Masaji Akahori , Sota Nakagawa
IPC分类号： C25D21/16 , C25D21/12 , C25D21/18 , C25D21/22 , C25D21/06 , C25C7/00
CPC分类号： C25D21/12 , C25D21/22
摘要： An electrolytic solution control method can control the composition of an electrolytic solution efficiently with high precision, and can remove a partially decomposed product of an organic component from an electrolytic solution. The electrolytic solution control method includes storing an electrolytic solution containing an organic component and an inorganic component in an electrolytic solution storage tank while controlling and keeping the electrolytic solution at a predetermined composition, adjusting an inorganic component of the waste electrolytic solution after use in electrolytic processing in an electrolytic processing apparatus, and then returning the waste electrolytic solution to the electrolytic solution storage tank.
摘要翻译：电解液控制方法能够高精度地有效地控制电解液的组成，能够从电解液中除去有机成分的部分分解产物。电解液控制方法包括将电解液储存罐中含有有机成分和无机成分的电解液同时控制并保持电解液为规定的组成，在电解处理后调整废电解液的无机成分在电解处理装置中，然后将废电解液返回到电解液储罐。

30. 发明申请

US20050023149A1 Plating apparatus, plating method and substrate processing apparatus 审中-公开
标题翻译：电镀装置，电镀方法和基板处理装置
公开(公告)号：US20050023149A1
公开(公告)日：2005-02-03
申请号：US10860115
申请日：2004-06-04
申请人： Tsutomu Nakada , Junji Kunisawa , Hiroyuki Kanda , Mizuki Nagai , Satoru Yamamoto , Koji Mishima , Shinya Morisawa , Seiji Katsuoka , Natsuki Makino , Yukio Fukunaga
发明人： Tsutomu Nakada , Junji Kunisawa , Hiroyuki Kanda , Mizuki Nagai , Satoru Yamamoto , Koji Mishima , Shinya Morisawa , Seiji Katsuoka , Natsuki Makino , Yukio Fukunaga
IPC分类号： C25D5/00 , C25D7/12 , C25D17/06
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06
摘要： The present invention provides a plating apparatus which uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate. The plating apparatus includes: a substrate holder for holding a substrate; a cathode section including a seal ring for contacting a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder to seal the peripheral portion water-tightly, and a cathode for contacting the substrate to supply current to the substrate; a vertically-movable electrode head provided above the cathode section, including an anode chamber housing an anode made of an insoluble material and having a bottom opening closed with a water-permeable porous member; a plating solution injection section for injecting a plating solution between the anode and the surface, to be plated, of the substrate held by the substrate holder; a power source for applying a plating voltage between the cathode and the anode; and a gas discharge line for discharging a gas from the anode chamber.
摘要翻译：本发明提供一种电镀装置，其使用不溶性阳极，并且可以在防止由于使用不溶性阳极而产生的氧气导致基板中的缺陷的同时稳定地进行基板的电镀。电镀装置包括：用于保持基板的基板保持件; 阴极部分，包括用于接触被基板保持器保持的基板的周边部分的密封环，以密封周边部分，以及用于接触基板以向基板供应电流的阴极 ; 设置在所述阴极部分上方的可垂直移动的电极头，包括容纳由不溶性材料制成的阳极并且具有用透水性多孔构件封闭的底部开口的阳极室; 电镀溶液注入部，用于在被基板保持器保持的基板的阳极和要被电镀的表面之间注入电镀液; 用于在阴极和阳极之间施加电镀电压的电源; 以及用于从阳极室排出气体的气体排出管线。

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