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    • 23. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20140014951A1
    • 2014-01-16
    • US13979478
    • 2012-01-05
    • Shingo KawashimaYukinobu NakataAtsuhito MuraiShinya Tanaka
    • Shingo KawashimaYukinobu NakataAtsuhito MuraiShinya Tanaka
    • H01L29/786
    • H01L29/78693H01L29/247H01L29/41733H01L29/78606H01L29/78609H01L29/78633H01L29/7869H01L29/78696
    • A semiconductor device (100A) according to the present invention includes: an oxide semiconductor layer (4) having a first contact region (4a) and a second contact region (4b) and a channel region (4c) located between the first contact region (4a) and the second contact region (4b); a source electrode (5) formed on the oxide semiconductor layer (4) so as to be in contact with the first contact region (4a); and a drain electrode (6) formed on the oxide semiconductor layer (4) so as to be in contact with the second contact region (4b). All side faces of the oxide semiconductor layer (4) are located over the gate electrode (2); a width of the source electrode (5) is greater than a width of the oxide semiconductor layer (4); and a width of the drain electrode (6) is greater than a width of the oxide semiconductor layer (4).
    • 根据本发明的半导体器件(100A)包括:具有第一接触区域(4a)和第二接触区域(4b)的氧化物半导体层(4)和位于第一接触区域之间的沟道区域(4c) 4a)和第二接触区域(4b); 形成在所述氧化物半导体层(4)上以与所述第一接触区域(4a)接触的源电极(5); 以及形成在所述氧化物半导体层(4)上以与所述第二接触区域(4b)接触的漏电极(6)。 氧化物半导体层(4)的所有侧面都位于栅电极(2)的上方。 源电极(5)的宽度大于氧化物半导体层(4)的宽度; 并且所述漏电极(6)的宽度大于所述氧化物半导体层(4)的宽度。
    • 26. 发明申请
    • SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCTION THEREOF
    • 半导体器件及其制造方法
    • US20130153904A1
    • 2013-06-20
    • US13819352
    • 2011-08-26
    • Jun NishimuraYukinobu NakataYoshihito Hara
    • Jun NishimuraYukinobu NakataYoshihito Hara
    • H01L27/04H01L21/82
    • H01L27/04G02F1/133345G02F1/136213G02F1/136227G02F1/1368H01L21/82H01L27/1225H01L27/1255
    • A semiconductor device (1000) includes a thin film transistor having a gate line (3a), source and drain lines (13as, 13ad), and an island-like oxide semiconductor layer (7), and a capacitor element (105) having a first electrode (3b) formed from the same conductive film as the gate line (3s), a second electrode (13b) formed from the same conductive film as the source line (13as), and a dielectric layer positioned between the first electrode and the second electrode. A gate insulating film (5) has a layered structure including a first insulating layer (5A) containing an oxide and a second insulating layer (5B) disposed on the side closer to the gate electrode closer than the first insulating film and having a higher dielectric constant than the first insulating film, the layered structure being in contact with the oxide semiconductor layer (7). The dielectric layer includes the second insulating film (5B) but does not include the first insulating film (5A). Accordingly, the deterioration of the oxide semiconductor layer due to oxygen deficiency can be suppressed without reducing the capacitance value of the capacitor element).
    • 半导体器件(1000)包括具有栅极线(3a),源极和漏极线(13as,13ad)和岛状氧化物半导体层(7)的薄膜晶体管,以及电容器元件(105),其具有 由与栅极线(3s)相同的导电膜形成的第一电极(3b),由与源极线(13as)相同的导电膜形成的第二电极(13b)以及位于第一电极 第二电极。 栅极绝缘膜(5)具有层叠结构,该层叠结构具有包含氧化物的第一绝缘层(5A)和位于比第一绝缘膜更靠近栅电极的一侧的第二绝缘层(5B),并且具有较高的电介质 与第一绝缘膜恒定,层状结构与氧化物半导体层(7)接触。 电介质层包括第二绝缘膜(5B),但不包括第一绝缘膜(5A)。 因此,可以抑制氧缺陷导致的氧化物半导体层的劣化,而不会降低电容器元件的电容值)。