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    • 23. 发明授权
    • Multilayer ceramic capacitor
    • 多层陶瓷电容器
    • US08614876B2
    • 2013-12-24
    • US13282138
    • 2011-10-26
    • Hae Suk ChungDae Bok OhEun Hye ChoiEun Hyuk ChaeKang Heon Hur
    • Hae Suk ChungDae Bok OhEun Hye ChoiEun Hyuk ChaeKang Heon Hur
    • H01G4/06
    • H01G4/232H01G4/12H01G4/30H05K3/328H05K2201/10015
    • There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius.
    • 提供了一种多层陶瓷电容器,其包括:陶瓷体,其包括层叠在所述电介质层之间的电介质层和内部电极; 以及一对外部电极,每个外部电极固定到陶瓷体的第一和第二表面,彼此面对并连接到内部电极,其中陶瓷体具有面向印刷电路板的第三表面和一对外部电极中的每一个 包括延伸到第三表面上并且具有预定长度的安装部件,通过它们安装在印刷电路板上,并且其中一对外部电极和安装部件之间的连接部分具有等于或小于 预设的角半径。
    • 26. 发明授权
    • Ceramic electronic component
    • 陶瓷电子元件
    • US08174816B2
    • 2012-05-08
    • US12648223
    • 2009-12-28
    • Dong Hwan SeoKang Heon HurDoo Young Kim
    • Dong Hwan SeoKang Heon HurDoo Young Kim
    • H01G4/00
    • H01G4/30H01G4/232
    • There is provided a ceramic electronic component including a ceramic sintered body, internal conductive layers, and external electrodes. Each of the external electrodes includes a first electrode layer, a conductive resin layer covering the first electrode layer, and a second electrode layer covering the conductive resin layer and having an extension length greater than the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof. The distance from the top or bottom surface of the ceramic sintered body to the closest layer of the internal conductive layers is greater than or equal to the length of the first electrode layer extending from one of the side surfaces of the ceramic sintered body to the portions of the top and bottom surfaces thereof.
    • 提供了包括陶瓷烧结体,内部导电层和外部电极的陶瓷电子部件。 每个外部电极包括第一电极层,覆盖第一电极层的导电树脂层和覆盖导电树脂层的第二电极层,其延伸长度大于从第一电极层之一延伸的第一电极层的长度 陶瓷烧结体的侧表面与其顶表面和底表面的部分。 从陶瓷烧结体的顶面或底面到内部导电层的最靠近的距离大于或等于从陶瓷烧结体的一个侧面延伸到第一电极层的部分的长度 的顶面和底面。
    • 27. 发明申请
    • MULTILAYER CERAMIC ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
    • 多层陶瓷电子元件及其制造方法
    • US20120099241A1
    • 2012-04-26
    • US13149246
    • 2011-05-31
    • Dong Ik ChangKang Heon HurDoo Young KimJi Hun Jeong
    • Dong Ik ChangKang Heon HurDoo Young KimJi Hun Jeong
    • H01G4/30H01G7/00
    • H01G4/012H01G4/30Y10T29/43
    • Disclosed are a multilayer ceramic electronic component and a method of manufacturing the same. There is provided a multilayer ceramic electronic component, including: a ceramic main body in which a plurality of dielectric layers having an average thickness of 1 μm or less are stacked; and inner electrode layers formed on the dielectric layers and having connectivity of 90% or more expressed by the following Equation, wherein the ratio of the thickness of the inner electrode layer to the thickness of the dielectric layer is between 0.8:1 and 1.3:1. The Equation is as follows. CONNECTIVITY = TOTAL   LENGTH   ( B )   OF   CROSS   SECTION FORMED   WITH   CONDUCTIVE   PASTE TOTAL   LENGTH   ( A )   OF   CORSS SECTION   OF   INNER   ELECTRODE The high-capacity multilayer ceramic electronic component having the excellent reliability while resisting the thermal impact cracks can be provided, by having the uniform thickness of the dielectric layers to improve the voltage-resistant characteristics while implementing the high capacitance.
    • 公开了一种多层陶瓷电子部件及其制造方法。 提供了一种多层陶瓷电子部件,其包括:层叠有平均厚度为1μm以下的多个电介质层的陶瓷主体; 以及形成在电介质层上并具有由以下等式表示的90%以上的连通性的内部电极层,其中内部电极层的厚度与电介质层的厚度之比在0.8:1至1.3:1之间 。 公式如下。 连接度= TOTAL 内置电极可以通过在实现高电容的同时提高电介质层的均匀厚度来提高耐电压特性,而提供耐热冲击裂纹具有优异可靠性的高容量多层陶瓷电子部件。