专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US08078438B2 Method for simulating thermal resistance value of thermal test die 有权
标题翻译：模拟热测试模具热阻值的方法
公开(公告)号：US08078438B2
公开(公告)日：2011-12-13
申请号：US12027153
申请日：2008-02-06
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： G06G7/56
CPC分类号： G06F17/5009 , G06F2217/80
摘要： A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation.
摘要翻译：提供了一种用于模拟热测试模具的热阻值的方法，以估计加热块的热阻值与热测试模具的热阻值之间的关系，并且找出加热块的尺寸匹配热测试模具的实际热情况。另外，在通过加热块测试之后，可以通过验证加热块的热阻的瞬态响应与热测试模具的热阻的稳态响应的关系是否可以提高测试结果的可靠性在设定偏差的范围内。

22. 发明申请

US20090006048A1 METHOD FOR SIMULATING THERMAL RESISTANCE VALUE OF THERMAL TEST DIE 有权
标题翻译：模拟热测试热电阻值的方法
公开(公告)号：US20090006048A1
公开(公告)日：2009-01-01
申请号：US12027153
申请日：2008-02-06
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： G06F17/11
CPC分类号： G06F17/5009 , G06F2217/80
摘要： A method for simulating a thermal resistance value of a thermal test die is provided to estimate a relationship between the thermal resistance value of a heating block and the thermal resistance value of the thermal test die, and to find out a size of the heating block that matches an actual thermal situation of the thermal test die. In addition, after being tested by the heating block, the reliability of the testing result may be improved by verifying whether the relationship of a transient response of thermal resistance of the heating block and a steady-state response of thermal resistance of the thermal test die is within a range of a setting variation.
摘要翻译：提供了一种用于模拟热测试模具的热阻值的方法，以估计加热块的热阻值与热测试模具的热阻值之间的关系，并且找出加热块的尺寸匹配热测试模具的实际热情况。另外，在通过加热块测试之后，可以通过验证加热块的热阻的瞬态响应与热测试模具的热阻的稳态响应的关系是否可以提高测试结果的可靠性在设定偏差的范围内。

23. 发明申请

US20070236887A1 Heatsink module of heat-generating electronic elements on circuit board 审中-公开
标题翻译：电路板上发热电子元件的散热模块
公开(公告)号：US20070236887A1
公开(公告)日：2007-10-11
申请号：US11400314
申请日：2006-04-10
申请人： Yi-Lun Cheng , Chun-Lung Lin , Frank Wang
发明人： Yi-Lun Cheng , Chun-Lung Lin , Frank Wang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , H01L23/4006 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module of heat-generating electronic elements on a circuit board is provided. The heatsink module is used to conduct and dissipate the heat generated by heat-generating electronic elements. The heatsink module includes a heat-conducting substrate contacting the heat-generating electronic elements. The heat-conducting substrate is locked on the heat-generating electronic element by a spring fastening. With die elastic force, the spring fastening can continuously press the heat-conducting substrate, such that the heat is conducted from the heat-generating electronic element to the heat-conducting substrate efficiently. Also, a heat pipe is disposed in the heat-conducting substrate, thus shortening the path between the heat pipe and the heat-generating electronic element for conducting heat, and increasing the contact area and improving the heat dissipation.
摘要翻译：提供了一种在电路板上产生电子元件的散热模块。散热模块用于传导和散发由发热电子元件产生的热量。散热器模块包括与发热电子元件接触的导热基板。导热基板通过弹簧固定件锁定在发热电子元件上。利用模具弹性力，弹簧紧固件可以连续地按压导热基板，使得热量从发热电子元件有效地传导到导热基板。此外，在导热基板上设置有热管，因此缩短了热管与用于传导热量的发热电子元件之间的路径，并且增加了接触面积并提高了散热。

24. 发明授权

US07277293B2 Heat sink conduction apparatus 有权
标题翻译：散热片传导装置
公开(公告)号：US07277293B2
公开(公告)日：2007-10-02
申请号：US11103308
申请日：2005-04-11
申请人： Chih-Kai Yang , Frank Wang , Yi-Lun Cheng
发明人： Chih-Kai Yang , Frank Wang , Yi-Lun Cheng
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink conduction apparatus is disclosed. The heat sink conduction apparatus is utilized in the heat sink assembly of an electronic device to thermal conduct with a heat source component. The apparatus comprises a thermal pad and a clip. The side of the thermal pad, where is connected with the heat source component, has at least one buckle pillar and one screw pillar. The clip includes a pair of spring plates and a pair of beams; each of the spring plate corresponding to each of the buckle pillar has a buckle and corresponding to each of the screw pillar has a screwed hole. The thermal pad supported a clip by the buckle pillar and the screw pillar, via the connection of the clip with the buckle pillar and the screw pillar, the heat source component can be fixed and make the surface of the heat source component to connect with the thermal pad in heat conductive manner.
摘要翻译：公开了散热器导电装置。散热器导电装置用于电子装置的散热器组件中以与热源组件进行热传导。该装置包括热垫和夹子。散热垫的与热源部件连接的一侧具有至少一个带扣柱和一个螺柱。夹子包括一对弹簧板和一对梁; 每个与每个带扣相对应的弹簧板具有带扣，并且对应于每个螺柱具有螺纹孔。散热垫通过带扣柱和螺柱支撑夹子，通过夹子与带扣柱和螺柱的连接，可以固定热源部件，使热源部件的表面与散热垫采用导热方式。

25. 发明申请

US20060227509A1 Heat sink conduction apparatus 有权
标题翻译：散热片传导装置
公开(公告)号：US20060227509A1
公开(公告)日：2006-10-12
申请号：US11103308
申请日：2005-04-11
申请人： Chih-Kai Yang , Frank Wang , Yi-Lun Cheng
发明人： Chih-Kai Yang , Frank Wang , Yi-Lun Cheng
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink conduction apparatus is disclosed. The heat sink conduction apparatus is utilized in the heat sink assembly of an electronic device to thermal conduct with a heat source component. The apparatus comprises a thermal pad and a clip. The side of the thermal pad, where is connected with the heat source component, has at least one buckle pillar and one screw pillar. The clip includes a pair of spring plates and a pair of beams; each of the spring plate corresponding to each of the buckle pillar has a buckle and corresponding to each of the screw pillar has a screwed hole. The thermal pad supported a clip by the buckle pillar and the screw pillar, via the connection of the clip with the buckle pillar and the screw pillar, the heat source component can be fixed and make the surface of the heat source component to connect with the thermal pad in heat conductive manner.
摘要翻译：公开了散热器导电装置。散热器导电装置用于电子装置的散热器组件中以与热源组件进行热传导。该装置包括热垫和夹子。散热垫的与热源部件连接的一侧具有至少一个带扣柱和一个螺柱。夹子包括一对弹簧板和一对梁; 每个与每个带扣相对应的弹簧板具有带扣，并且对应于每个螺柱具有螺纹孔。散热垫通过带扣柱和螺柱支撑夹子，通过夹子与带扣柱和螺柱的连接，可以固定热源部件，使热源部件的表面与散热垫采用导热方式。

26. 发明授权

US07212404B2 Integrated heat sink device 有权
标题翻译：集成散热装置
公开(公告)号：US07212404B2
公开(公告)日：2007-05-01
申请号：US11108688
申请日：2005-04-19
申请人： Frank Wang , Yi-Lun Cheng , Chih-Kai Yang
发明人： Frank Wang , Yi-Lun Cheng , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated heat sink device comprises a thermal module and a fan module; wherein the thermal module further comprises a first heat conduction module, a fin set, and a second heat conduction module; wherein the fan module, its vent connects with the fin set in an air-tight manner in order to form a heat-dissipating channel; and the first and second heat conduction modules are with different angles of heat connected surfaces so that the invention of the integrated heat sink device can dissipate the heat generated by heat-generating elements with different angles of radiation surface.
摘要翻译：提供了一种集成散热装置，其用于散发由不同的辐射表面角度（例如，CPU和显示芯片）的发热元件产生的热量，其辐射面为180°和90°）。集成散热装置包括热模块和风扇模块; 其中所述热模块还包括第一热传导模块，散热片组和第二热传导模块; 其中所述风扇模块的通风口与所述翅片组以气密方式连接，以形成散热通道; 并且第一和第二热传导模块具有不同的热连接表面的角度，使得集成散热装置的发明可以以不同的辐射角度散发由发热元件产生的热量。

27. 发明授权

US07274572B2 Supporting plate 有权
标题翻译：支撑板
公开(公告)号：US07274572B2
公开(公告)日：2007-09-25
申请号：US11114374
申请日：2005-04-26
申请人： Frank Wang , Yi-Lun Cheng , Chih-Kai Yang
发明人： Frank Wang , Yi-Lun Cheng , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H05K7/20154
摘要： A supporting plate includes a metal plate and is utilized to support a heat sink module in an electronic device. The heat sink module has a thermal pad, and the electronic device has a first heat generating element and a second heat generating element. In addition, the heat sink module is contacted to the first heat generating element for conducting heat generated by the first heat generating element to the thermal pad. Moreover, the metal plate has a first concave portion and a second concave portion. The first concave portion is contacted to the thermal pad, and the second concave portion is contacted to the second heat generating element for conducting heat generated by the second heat generating element to the heat sink.
摘要翻译：支撑板包括金属板，并用于支撑电子设备中的散热器模块。散热器模块具有热垫，电子设备具有第一发热元件和第二发热元件。此外，散热模块与第一发热元件接触，用于将由第一发热元件产生的热量传导到热垫。此外，金属板具有第一凹部和第二凹部。第一凹部与热垫接触，第二凹部与第二发热体接触，将第二发热体产生的热量导向散热片。

28. 发明申请

US20060232933A1 Integrated heat sink device 有权
标题翻译：集成散热装置
公开(公告)号：US20060232933A1
公开(公告)日：2006-10-19
申请号：US11108688
申请日：2005-04-19
申请人： Frank Wang , Yi-Lun Cheng , Chih-Kai Yang
发明人： Frank Wang , Yi-Lun Cheng , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An integrated heat sink device, which is utilized to dissipate the heat generated by heat-generating elements with different angles of radiation surface (for instance, CPU and display chip are with radiation surfaces at 180° and 90°), is provided. The integrated heat sink device comprises a thermal module and a fan module; wherein the thermal module further comprises a first heat conduction module, a fin set, and a second heat conduction module; wherein the fan module, its vent connects with the fin set in an air-tight manner in order to form a heat-dissipating channel; and the first and second heat conduction modules are with different angles of heat connected surfaces so that the invention of the integrated heat sink device can dissipate the heat generated by heat-generating elements with different angles of radiation surface.
摘要翻译：提供了一种集成散热装置，其用于散发由不同的辐射表面角度（例如，CPU和显示芯片）的发热元件产生的热量，其辐射面为180°和90°）。集成散热器装置包括热模块和风扇模块; 其中所述热模块还包括第一热传导模块，散热片组和第二热传导模块; 其中所述风扇模块的通风口与所述翅片组以气密方式连接，以形成散热通道; 并且第一和第二热传导模块具有不同的热连接表面的角度，使得集成散热装置的发明可以以不同的辐射角度散发由发热元件产生的热量。

29. 发明申请

US20060082968A1 Fool-proof device on heatsink thermal module for the notebook computer 有权
标题翻译：用于笔记本电脑散热器散热模块的防潮设备
公开(公告)号：US20060082968A1
公开(公告)日：2006-04-20
申请号：US11140085
申请日：2005-05-27
申请人： Yi-Lun Cheng , Chih-Kai Yang
发明人： Yi-Lun Cheng , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , Y10T29/49002 , Y10T29/4913 , H01L2924/00
摘要： A fool-proof device on the heatsink thermal module for the notebook computer is provided. With an interference member installed on one side of the case of the heatsink thermal module, when installing the heatsink thermal module, the interference member and a predetermined recognition area on the printed circuit board (PCB) can provide a fool-proof function to avoid assembling error of two modules with different standard but similar in appearance in the assembling process.
摘要翻译：提供了笔记本电脑散热器散热模块上的傻瓜装置。在安装散热器散热模块壳体一侧的干扰构件的情况下，当安装散热器散热模块时，干扰构件和印刷电路板（PCB）上的预定识别区域可以提供愚蠢功能，以避免组装在组装过程中两个不同标准但外观相似的模块的误差。

30. 发明授权

US07248474B2 Fool-proof device on heatsink thermal module for the notebook computer 有权
标题翻译：用于笔记本电脑散热器散热模块的防潮设备
公开(公告)号：US07248474B2
公开(公告)日：2007-07-24
申请号：US11140085
申请日：2005-05-27
申请人： Yi-Lun Cheng , Chih-Kai Yang
发明人： Yi-Lun Cheng , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , Y10T29/49002 , Y10T29/4913 , H01L2924/00
摘要： A fool-proof device on the heatsink thermal module for the notebook computer is provided. With an interference member installed on one side of the case of the heatsink thermal module, when installing the heatsink thermal module, the interference member and a predetermined recognition area on the printed circuit board (PCB) can provide a fool-proof function to avoid assembling error of two modules with different standard but similar in appearance in the assembling process.
摘要翻译：提供了笔记本电脑散热器散热模块上的傻瓜装置。在安装散热器散热模块壳体一侧的干扰构件的情况下，当安装散热器散热模块时，干扰构件和印刷电路板（PCB）上的预定识别区域可以提供愚蠢功能，以避免组装在组装过程中两个不同标准但外观相似的模块的误差。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式