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    • 23. 发明授权
    • Complementary differential amplifier in which direct current
amplification gain can be set arbitrarily and semiconductor memory
divice using the same
    • 可以任意设置直流放大增益的互补差分放大器和使用相同的半导体存储器件
    • US5696726A
    • 1997-12-09
    • US787334
    • 1997-01-27
    • Yasuhiko Tsukikawa
    • Yasuhiko Tsukikawa
    • G11C11/409G11C7/06G11C11/407G11C7/00H03F3/45
    • G11C7/062
    • P channel MOS transistors P11 and P12 have their gates cross-connected to their drains. P channel MOS transistors P13 and P14 each having its gate and its drain diode-connected to each other are respectively connected in parallel to transistors P11 and P12. N channel MOS transistors N15 and N16 drive transistors P11 to P14 with current values corresponding to input signals IN and /IN. If transistors P11-P14 have the same gate length, transistors P11 and P12 have the same gate width, and transistors P13 and P14 have the same gate width, the DC amplification factor of an internal differential amplifying circuit 1100 of a first stage can be set to a desired value by the ratio of a gate width of P13 to a gate width of P11. Internal outputs from nodes to which the drains of P11 and P12 are respectively connected are input to an internal differential amplifying circuit 1200 of the following stage.
    • P沟道MOS晶体管P11和P12的栅极与其漏极交叉连接。 分别与栅极和漏极二极管相连的P沟道MOS晶体管P13和P14分别与晶体管P11和P12并联连接。 N沟道MOS晶体管N15和N16驱动具有对应于输入信号IN和/ IN的电流值的晶体管P11至P14。 如果晶体管P11-P14具有相同的栅极长度,则晶体管P11和P12具有相同的栅极宽度,并且晶体管P13和P14具有相同的栅极宽度,可以设置第一级的内部差分放大电路1100的DC放大系数 通过P13的栅极宽度与P11的栅极宽度的比率达到期望值。 分别连接到P11和P12的漏极的节点的内部输出被输入到后级的内部差分放大电路1200。
    • 28. 发明授权
    • Semiconductor memory device with shortened connection length among memory block, data buffer and data bus
    • 具有缩短存储块,数据缓冲器和数据总线之间连接长度的半导体存储器件
    • US06787859B2
    • 2004-09-07
    • US10223319
    • 2002-08-20
    • Takashi ItouMasaki ShimodaYasuhiko Tsukikawa
    • Takashi ItouMasaki ShimodaYasuhiko Tsukikawa
    • H01L2994
    • G11C5/025G11C7/18
    • There is provided a semiconductor memory device including eight memory blocks 20a to 20h, first data bus 22a, and second data bus 22b. The eight memory blocks are arranged at respective eight of the total nine areas 11 to 19 defined in a three rows by three columns matrix except for a center area 19. A first data bus 22a linearly extends between memory blocks in the first and second row of the matrix. A second data bus 22b linearly extends between memory blocks in the second and third row of the matrix. The eight memory blocks includes a first group of the four memory blocks arranged adjacent the first data bus and connected to the first data bus and a second group of the four memory blocks arranged adjacent the second data bus and connected to the second data bus.
    • 提供了包括八个存储块20a至20h,第一数据总线22a和第二数据总线22b的半导体存储器件。 八个存储块被布置在除了中心区域19之外以三行×三列矩阵定义的总共九个区域11至19中的相应八个。第一数据总线22a在第一和第二行中的存储块之间线性地延伸 矩阵。 第二数据总线22b在矩阵的第二和第三行中的存储块之间线性地延伸。 八个存储器块包括与第一数据总线相邻布置并连接到第一数据总线的四个存储器块的第一组以及与第二数据总线相邻布置并连接到第二数据总线的四个存储器块的第二组。