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    • 30. 发明授权
    • Gold electroplating process
    • 金电镀工艺
    • US4238300A
    • 1980-12-09
    • US42456
    • 1979-05-25
    • Kei Yoshida
    • Kei Yoshida
    • C25D3/48
    • C25D3/48
    • Electrolytic deposition of gold results in the formation of undesirable reducible gold III species in the electroplating bath which interfere with the current efficiency and make the prediction of gold thickness based on applied current impossible. Addition of a small quantity of hypophosphorous acid to the plating bath when the current efficiency has dropped below a certain minimum, chemically reduces accumulated gold III species and scavenges dissolved oxygen. Thus, the current efficiency is restored to about 100%. The hypophosphorous acid treatment is particularly advantageous in a phosphate buffered bath because no foreign ions are introduced into the solution.
    • 金的电解沉积导致在电镀槽中形成不期望的可还原的金III物质,其干扰电流效率,并且基于施加的电流不可能预测金的厚度。 当电流效率降至某一最低值以下时,向电镀液中加入少量次磷酸,化学降低积存的金III物质和清除溶解氧。 因此,目前的效率恢复到100%左右。 次磷酸处理在磷酸盐缓冲浴中是特别有利的,因为没有外来离子被引入溶液中。