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21. 发明申请

US20060029786A1 Gypsum boards having glass fiber reinforcement with tacky compliant interface therebetween 有权
标题翻译：具有玻璃纤维增强的石膏板，其间具有粘性兼容的界面
公开(公告)号：US20060029786A1
公开(公告)日：2006-02-09
申请号：US10910183
申请日：2004-08-03
申请人： Lance Wang , Thomas Grassl , Robert Hamilton
发明人： Lance Wang , Thomas Grassl , Robert Hamilton
IPC分类号： D04H3/00
CPC分类号： D04H1/72 , D04H1/4218 , Y10T428/249924 , Y10T428/249926 , Y10T428/249932
摘要： A bond is created during gypsum board cure between a gypsum matrix and a tacky coating applied onto a glass fiber. The tacky coating is comprised of a polymer composed of methacrylic acid and dimethyldiallyammonium chloride. The polymer is dissolved in an acidic aqueous solution and is roller coated onto the glass fibers. The chopped glass fibers may also be placed in such an acidic solution, which is made alkaline by the addition of alkali, thereby precipitating the polymer out of solution as a tacky composition that produces a tacky coating on the glass fibers. The glass fibers with the tacky bond coating are incorporated in an alkaline gypsum slurry to form a gypsum board having a first and second facer sheet. The tacky coating on the glass fibers bonded to the gypsum matrix result in compliant load transfer between the gypsum matrix and the glass fibers, yielding improved flexure strength and nail pullout resistance.
摘要翻译：在石膏基质和应用于玻璃纤维的粘性涂层之间的石膏板固化期间产生粘结。粘性涂层由甲基丙烯酸和二甲基二烯丙基氯化铵组成的聚合物组成。将聚合物溶解在酸性水溶液中并辊涂在玻璃纤维上。切碎的玻璃纤维也可以放置在这样的酸性溶液中，其通过加入碱而变成碱性，从而将聚合物从溶液中沉淀出来，作为在玻璃纤维上产生粘性涂层的粘性组合物。将具有粘性粘合剂涂层的玻璃纤维掺入碱性石膏浆料中以形成具有第一和第二面板的石膏板。结合到石膏基质上的玻璃纤维上的粘性涂层导致石膏基质和玻璃纤维之间的顺应载荷转移，产生改善的挠曲强度和脱毛抗力。

22. 发明授权

US06721196B1 Semiconductor memory chip module 有权
标题翻译：半导体存储芯片模块
公开(公告)号：US06721196B1
公开(公告)日：2004-04-13
申请号：US09926791
申请日：2002-03-22
申请人： Thomas Grassl
发明人： Thomas Grassl
IPC分类号： G11C506
CPC分类号： H01L25/18 , G06K19/073 , G06K19/077 , H01L25/0657 , H01L2924/0002 , H01L2924/00
摘要： In a semiconductor memory chip module (2′) for a smart card, a nonvolatile memory chip (EEPROM) (4) and a volatile memory chip (SRAM) (6) are stacked and coupled directly by vertical chip interconnections (16). The rapid-access volatile memory permits fast execution of programs. Permanent and safe storage of data is effected by reloading the data to the nonvolatile memory. A chip (8) with decoder circuits can be contained in a further level. Likewise integrated into a chip is a buffer capacitor (20) which is constantly recharged to a constant supply voltage during operation.
摘要翻译：在用于智能卡的半导体存储器芯片模块（2'）中，非易失性存储器芯片（EEPROM）（4）和易失性存储器芯片（SRAM）（6）被堆叠并通过垂直芯片互连（16）直接耦合。快速访问易失性存储器允许程序的快速执行。通过将数据重新加载到非易失性存储器来实现数据的永久和安全的存储。具有解码器电路的芯片（8）可以进一步包含在其中。类似地集成在芯片中的是缓冲电容器（20），其在操作期间不断地被充电到恒定的电源电压。

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