专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明授权

US06465878B2 Compliant microelectronic assemblies 有权
标题翻译：符合微电子组件
公开(公告)号：US06465878B2
公开(公告)日：2002-10-15
申请号：US09777782
申请日：2001-02-06
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23495
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A microelectronic assembly includes a microelectronic element having a first surface including a central region and a peripheral region surrounding the central region, the microelectronic element including a plurality of contacts disposed in the central region. The microelectronic assembly also includes a compliant layer over the peripheral region of the first surface, the compliant layer having a bottom surface facing toward the first surface of the microelectronic element, a top surface facing upwardly away from the microelectronic element and one or more edge surfaces extending between the top and bottom surfaces. A plurality of flexible bond ribbons are disposed over the compliant layer so that the bond ribbons extend over the top surface and one or more of the edge surfaces and the bond ribbons electrically connect the contacts to conductive terminals overlying the top surface of the compliant layer.
摘要翻译：微电子组件包括具有包括中心区域和围绕中心区域的周边区域的第一表面的微电子元件，微电子元件包括设置在中心区域中的多个触点。微电子组件还包括在第一表面的周边区域上的柔顺层，柔顺层具有面向微电子元件的第一表面的底表面，面向上远离微电子元件的顶表面和一个或多个边缘表面在顶部和底部表面之间延伸。多个柔性接合带设置在柔性层上方，使得接合带在顶表面上延伸，并且一个或多个边缘表面和接合带将触头电连接到覆盖顺应层的顶表面的导电端子。

22. 发明授权

US5966587A Methods of making semiconductor assemblies with reinforced peripheral regions 失效
标题翻译：制造具有增强外围区域的半导体组件的方法
公开(公告)号：US5966587A
公开(公告)日：1999-10-12
申请号：US020613
申请日：1998-02-09
申请人： Konstantine Karavakis , Joseph Fjelstad
发明人： Konstantine Karavakis , Joseph Fjelstad
IPC分类号： H01L23/00 , H01L23/31 , H01L23/485 , H01L23/498 , G01R31/26 , H01L21/44 , H01L21/48 , H01L21/50 , H01L21/66
CPC分类号： H01L24/05 , H01L23/3157 , H01L23/49827 , H01L23/562 , H01L2224/04042 , H01L2224/05599 , H01L2224/45144 , H01L2224/48091 , H01L2224/4824 , H01L2224/48599 , H01L2224/73215 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14
摘要： A method of forming a microelectronic assembly having an element with contacts on a front surface thereof, an interposer with a plurality of connecting terminals in a connecting terminal region and bonding terminals in a bonding terminal region electrically connected to the connecting terminals includes the steps of juxtaposing the interposer with the microelectronic element so that the connecting terminals and bonding terminals of the interposer face away from the front surface of the element and so that the bonding terminal region is adjacent to the contacts of the microelectronic element; and connecting at least some of the contacts with at least some of the bonding terminals by a plurality of flexible leads while supporting the bonding terminals against the vertical movement to facilitate the connection.
摘要翻译：一种形成具有在其表面上具有触点的元件的微电子组件的方法，在连接端子区域中具有多个连接端子的插入件以及与连接端子电连接的接合端子区域中的接合端子包括并置的步骤所述插入器与所述微电子元件相连，使得所述插入器的所述连接端子和所述接合端子远离所述元件的前表面，并且所述接合端子区域与所述微电子元件的所述触点相邻; 以及通过多个柔性引线将至少一些所述接合端与至少一些所述接合端子连接，同时支撑所述接合端子以抵抗所述垂直运动以便于所述连接。

23. 发明申请

US20150334826A1 EMBEDDED TRACES 有权
标题翻译：嵌入式轨迹
公开(公告)号：US20150334826A1
公开(公告)日：2015-11-19
申请号：US14281631
申请日：2014-05-19
申请人： Konstantine Karavakis , Kenneth S. Bahl , Steve Carney
发明人： Konstantine Karavakis , Kenneth S. Bahl , Steve Carney
IPC分类号： H05K1/03 , H05K3/40 , H05K3/08 , H05K3/10 , H05K1/09 , H05K1/11
CPC分类号： H05K1/0306 , H05K1/09 , H05K1/115 , H05K3/0041 , H05K3/08 , H05K3/107 , H05K3/185 , H05K3/4038 , H05K2201/017 , H05K2201/0236 , H05K2201/0376 , H05K2203/025 , H05K2203/0716 , H05K2203/107
摘要： A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material.
摘要翻译：印刷电路板包括层叠基板。层压基板包括抵抗金属电镀的催化材料，除了催化材料的表面被烧蚀之外。金属痕迹形成在层压基板内的痕迹通道内。通道延伸到催化材料的表面之下。

24. 发明申请

US20110095441A1 MICROELECTRONIC ASSEMBLIES HAVING COMPLIANT LAYERS 有权
标题翻译：具有合适层的微电子组件
公开(公告)号：US20110095441A1
公开(公告)日：2011-04-28
申请号：US12974744
申请日：2010-12-21
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23/48
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A compliant semiconductor chip package assembly includes a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.
摘要翻译：兼容的半导体芯片封装组件包括具有多个芯片触点的半导体芯片和具有顶表面，底表面和倾斜周边边缘的柔性层，由此柔性层的底表面覆盖在半导体芯片的表面上。组件还包括连接到半导体芯片的芯片触点的多个导电迹线，迹线沿倾斜边缘延伸到柔性层的顶表面。组件可以包括覆盖半导体芯片的导电端子，其中柔性层将导电端子支撑在半导体芯片上。导电迹线具有与半导体芯片的触点电连接的第一端和与导电端子电连接的第二端。导电端子可相对于半导体芯片移动。

25. 发明申请

US20050237074A1 STRUCTURES FOR TESTING CIRCUITS AND METHODS FOR FABRICATING THE STRUCTURES 失效
标题翻译：用于测试电路的结构和用于制作结构的方法
公开(公告)号：US20050237074A1
公开(公告)日：2005-10-27
申请号：US11169987
申请日：2005-06-28
申请人： Konstantine Karavakis , Tom Nguyen
发明人： Konstantine Karavakis , Tom Nguyen
IPC分类号： G01R1/04 , G01R31/02
CPC分类号： G01R1/0483
摘要： One embodiment of the present invention is a structure useful for testing circuits that includes: (a) a flexible substrate having contactors on a first side and pads on a second side; (b) a rigid substrate having vias aligned with the pads on the second side of the flexible substrate; (c) an adhesive layer comprised of a compliant adhesive material having vias aligned with the pads on the second side of the flexible substrate; the adhesive layer being affixed to the flexible substrate and the rigid substrate; (d) a card; (e) electrical connectors that are retained in the vias of the rigid substrate and the adhesive layer, which electrical connectors have first and second retractable ends, wherein the first retractable ends contact pads on the substrate, and the second retractable ends contact pads on the card; and (f) a clamp that is adapted to fit over the substrate and the adhesive layer, the clamp having an opening to provide access to the contactors, wherein the clamp is connected to the card.
摘要翻译：本发明的一个实施例是用于测试电路的结构，其包括：（a）柔性基板，其具有在第一侧上的接触器和在第二侧上的焊盘; （b）刚性基板，其具有与柔性基板的第二侧上的焊盘对准的通孔; （c）由柔性粘合剂材料组成的粘合剂层，其具有与柔性基材的第二侧上的焊盘对准的通孔; 所述粘合剂层固定在所述柔性基板和所述刚性基板上; （d）卡; （e）电连接器，其保持在刚性基板和粘合剂层的通孔中，该电连接器具有第一和第二可缩回端，其中第一可缩回端接触基板上的焊盘，而第二可缩回端接触焊盘卡; 和（f）适于装配在所述基底和所述粘合剂层上的夹具，所述夹具具有开口以提供对所述接触器的通路，其中所述夹具连接到所述卡。

26. 发明授权

US06847107B2 Image forming apparatus with improved transfer efficiency 有权
标题翻译：具有柔性层的微电子组件
公开(公告)号：US06847107B2
公开(公告)日：2005-01-25
申请号：US10219902
申请日：2002-08-15
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23/498 , H01L23/48 , H01L23/02
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： By causing the movement of charge from a toner to a latent image carrier, the amount of charge of the toner is lowered to an amount of charge suitable for facilitating the transfer of toner so as to improve the transfer efficiency. For this, an image forming apparatus includes a latent image carrier and a developing means for forming a negatively chargeable toner layer composed of two stories or less on a toner carrier by a toner layer thickness regulating member. An electrostatic latent image on the latent image carrier is developed with the toner to form a visible image and the visible image is transferred to a transfer medium. Further, the work function (Φopc) of the surface of the latent image carrier is set to be larger than the work function (Φt) of the toner.
摘要翻译：微电子组件包括具有包括中心区域和围绕中心区域的周边区域的第一表面的微电子元件，微电子元件包括设置在中心区域中的多个触点。微电子组件还包括覆盖第一表面的周边区域的顺应性层，柔顺层具有面向微电子元件的第一表面的底表面，面向上远离微电子元件的第一表面的顶表面和一个或更多的边缘表面在顺应层的顶表面和底表面之间延伸。多个柔性接合带设置在柔性层上方，使得接合带在顶表面上延伸，并且一个或多个边缘表面和接合带将触头电连接到覆盖顺应层的顶表面的导电端子。

27. 发明授权

US06211572B1 Semiconductor chip package with fan-in leads 失效
标题翻译：半导体芯片封装带扇入式引线
公开(公告)号：US06211572B1
公开(公告)日：2001-04-03
申请号：US08739303
申请日：1996-10-29
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L2348
CPC分类号： H01L21/78 , H01L23/3114 , H01L23/4951 , H01L23/498 , H01L24/05 , H01L24/13 , H01L24/20 , H01L2224/02313 , H01L2224/02331 , H01L2224/0235 , H01L2224/0236 , H01L2224/02377 , H01L2224/024 , H01L2224/0401 , H01L2224/05548 , H01L2224/05572 , H01L2224/13008 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/45124 , H01L2924/0001 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/351 , H01L2924/00 , H01L2224/48 , H01L2224/05552
摘要： A compliant semiconductor chip package with fan-in leads and a method for manufacturing the same. The package, or “assembly”, contains a multiplicity of bond ribbons connected between the contacts of a semiconductor chip and corresponding terminals on a top surface of a compliant layer. The compliant layer provides stress relief to the bond ribbons encountered during handling or affixing the assembly to an external substrate. The chip package also contains a dielectric layer adjacent to at least one end of the bond ribbons. The dielectric layer relieves mechanical stresses associated with the thermal mismatch of assembly and substrate materials during thermal cycling. The assembly can be manufactured without the need for any bond wiring tools since the bond ribbons are patterned and formed during a standard photolithographic stage within the manufacturing process. The manufacturing process is also amenable to simultaneous assembly of a multiplicity of undiced chips on a wafer or simultaneous assembly of diced chips in a processing boat.
摘要翻译：具有扇入引线的兼容半导体芯片封装及其制造方法。封装或“组件”包含连接在半导体芯片的触头和柔性层的顶表面上的相应端子之间的多个粘结带。柔性层为处理或将组件固定到外部基底时遇到的粘结带提供应力消除。芯片封装还包含与粘结带的至少一端相邻的电介质层。在热循环期间，电介质层减轻与组装和衬底材料的热失配相关的机械应力。可以在不需要任何接合线路工具的情况下制造组件，因为在制造过程中的标准光刻阶段期间，图案化和形成结合带。制造过程还适于在晶片上同时组装多个未切割的芯片或在处理舟中同时组装切割的芯片。

28. 发明授权

US07872344B2 Microelectronic assemblies having compliant layers 有权
标题翻译：具有柔性层的微电子组件
公开(公告)号：US07872344B2
公开(公告)日：2011-01-18
申请号：US11474199
申请日：2006-06-23
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A compliant semiconductor chip package assembly includes a a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.
摘要翻译：兼容的半导体芯片封装组件包括具有多个芯片触点的半导体芯片和具有顶表面，底表面和倾斜周边边缘的柔性层，由此柔性层的底表面覆盖在半导体芯片的表面上。组件还包括连接到半导体芯片的芯片触点的多个导电迹线，迹线沿倾斜边缘延伸到柔性层的顶表面。组件可以包括覆盖半导体芯片的导电端子，其中柔性层将导电端子支撑在半导体芯片上。导电迹线具有与半导体芯片的触点电连接的第一端和与导电端子电连接的第二端。导电端子可相对于半导体芯片移动。

29. 发明授权

US07408260B2 Microelectronic assemblies having compliant layers 有权
标题翻译：具有柔性层的微电子组件
公开(公告)号：US07408260B2
公开(公告)日：2008-08-05
申请号：US11487263
申请日：2006-07-14
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L29/40 , H01L23/48
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.
摘要翻译：微电子组件包括微电子元件，例如具有第一表面和在第一表面可接触的触点的半导体芯片或晶片的微电子元件，覆盖微电子元件的第一表面的柔性层和覆盖柔顺层的导电突起并远离微电子元件的第一表面，其中导电突起与微电子元件的触点电互连。导电突起可相对于所述微电子元件移动。

30. 发明申请

US20060261476A1 Microelectronic assemblies having compliant layers 有权
标题翻译：具有柔性层的微电子组件
公开(公告)号：US20060261476A1
公开(公告)日：2006-11-23
申请号：US11487263
申请日：2006-07-14
申请人： Joseph Fjelstad , Konstantine Karavakis
发明人： Joseph Fjelstad , Konstantine Karavakis
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/3114 , H01L23/3121 , H01L23/4951 , H01L23/498 , H01L23/525 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/72 , H01L24/82 , H01L24/94 , H01L2224/0231 , H01L2224/02311 , H01L2224/02313 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/16 , H01L2224/24011 , H01L2224/24226 , H01L2224/24227 , H01L2224/274 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48624 , H01L2224/48724 , H01L2224/85424 , H01L2924/00011 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/351 , H01L2924/00014 , H01L2224/48824 , H01L2924/00 , H01L2924/01004
摘要： A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.
摘要翻译：微电子组件包括微电子元件，例如具有第一表面和在第一表面可接触的触点的半导体芯片或晶片的微电子元件，覆盖微电子元件的第一表面的柔性层和覆盖柔顺层的导电突起并远离微电子元件的第一表面，其中导电突起与微电子元件的触点电互连。导电突起可相对于所述微电子元件移动。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式