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    • 21. 发明授权
    • Method of fabricating three dimensional gate structure using oxygen diffusion
    • 使用氧气扩散制造三维栅极结构的方法
    • US06960509B1
    • 2005-11-01
    • US10883182
    • 2004-06-30
    • Sang-In HanKurt W. EisenbeiserBing Lu
    • Sang-In HanKurt W. EisenbeiserBing Lu
    • H01L21/316H01L21/336H01L21/338H01L21/84H01L29/786
    • H01L29/785H01L21/31662H01L29/66818
    • The present invention provides a method of fabricating a silicon fin useful in preparing FinFET type semiconductor structures. The method is particularly useful for creating fins with a width and smoothness appropriate for sub-50 nm type gates. The method begins with a silicon fin prepared by lithographic means from an SOI type structure such that the fin is larger in dimension, particularly width, than is desired in the final fin. If desired the silicon fin can include a nitride cap. A conformal diffusion layer, such as of silicon dioxide, is then deposited onto the fin and silicon dioxide substrate. A PECVD deposition using TEOS gas is one method to deposit the diffusion layer. The coated fin is then heated and exposed to oxygen. The oxygen diffuses through the diffusion layer and converts a portion of the silicon material to silicon dioxide. This oxidation continues until a desired amount of silicon material is converted to SiO2 such that the remaining silicon has the desired dimensions. The silicon fin is then exposed through wet etching steps that remove the silicon dioxide coating.
    • 本发明提供一种制造用于制备FinFET型半导体结构的硅鳍的方法。 该方法对于产生适合于50nm以下类型的门的宽度和平滑度的翅片特别有用。 该方法从由SOI型结构的光刻装置制备的硅片开始,使得翅片的尺寸更大,特别是在最终鳍片中所需的宽度。 如果需要,硅翅片可以包括氮化物盖。 然后将诸如二氧化硅的共形扩散层沉积到翅片和二氧化硅衬底上。 使用TEOS气体的PECVD沉积是沉积扩散层的一种方法。 然后将涂覆的翅片加热并暴露于氧气。 氧扩散通过扩散层并将一部分硅材料转化为二氧化硅。 该氧化继续进行,直到所需量的硅材料转化为SiO 2,使得剩余的硅具有所需的尺寸。 然后通过去除二氧化硅涂层的湿蚀刻步骤将硅片暴露。
    • 24. 发明申请
    • MOLDED REFLECTIVE STRUCTURES FOR LIGHT-EMITTING DIODES
    • 用于发光二极管的模制反射结构
    • US20120262925A1
    • 2012-10-18
    • US13086862
    • 2011-04-14
    • Bing Lu
    • Bing Lu
    • F21V7/06F21V7/22F21V7/00
    • H01L33/60H01L33/486H01L33/501H01L33/507H01L2224/48095H01L2224/48247H01L2224/48257
    • The present disclosure is directed to a molded reflective structure for a light source, which may be a light-emitting diode (“LED”). The structure includes a reflector which defines a cavity therein. The cavity is surrounded by at least one reflective side wall, and has a greatest dimension of less than about 50 mm. The at least one reflective side wall further has an initial reflectance at 460 nm of greater than about 85% and an initial whiteness index of greater than about 80. The reflector is made from a thermoplastic polymer composition that contains a material such that the at least one reflective side wall absorbs light in the ultraviolet and violet region of the electromagnetic spectrum and re-emits light in the blue region.
    • 本公开涉及一种用于光源的模制反射结构,其可以是发光二极管(LED)。 该结构包括在其中限定空腔的反射器。 空腔被至少一个反射侧壁包围,并且具有小于约50mm的最大尺寸。 所述至少一个反射侧壁还具有大于约85%的460nm处的初始反射率和大于约80的初始白度指数。所述反射器由热塑性聚合物组合物制成,所述热塑性聚合物组合物含有至少 一个反射侧壁吸收电磁光谱的紫外线和紫色区域的光,并在蓝色区域再发光。