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21. 发明授权

US06486540B2 Three-dimensional semiconductor device and method of manufacturing the same 有权
标题翻译：三维半导体器件及其制造方法
公开(公告)号：US06486540B2
公开(公告)日：2002-11-26
申请号：US09829945
申请日：2001-04-11
申请人： Naoji Senba , Takao Yamazaki , Yuzo Shimada
发明人： Naoji Senba , Takao Yamazaki , Yuzo Shimada
IPC分类号： H01L2302
CPC分类号： H01L23/34 , H01L25/0652 , H01L2924/0002 , H01L2924/00
摘要： A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surface of the cylindrical heat sink, and the CPU is connected to an upper heat sink.
摘要翻译：三维半导体器件包括圆柱形散热器，其中CPU设置在圆柱形散热器的内底表面的大致中心上，半导体芯片分别安装在圆柱形散热器的外周表面和圆柱形散热器，CPU连接到上部散热器。

22. 发明授权

US5389923A Sampling rate converter 失效
标题翻译：采样率转换器
公开(公告)号：US5389923A
公开(公告)日：1995-02-14
申请号：US35228
申请日：1993-03-22
申请人： Eiji Iwata , Takao Yamazaki
发明人： Eiji Iwata , Takao Yamazaki
IPC分类号： H03H17/00 , H03H17/02 , H03H17/06 , H04N7/01 , H03M7/00
CPC分类号： H03H17/0685 , H04N7/0102
摘要： In a sampling rate converter for converting a sampling frequency L of a digital signal to a sampling frequency M (L:M conversion) or for converting a sampling frequency M of a digital signal to a sampling frequency L (M:L conversion), the same filter coefficients are utilized and a constant predetermined DC gain is maintained for both conversions. An over-sampler multiplies the sampling frequency L or M by M or L, respectively, during the L:M conversion and the M:L conversion, respectively. A filter, which receives the output of the over-sampler, restricts the frequency band of the output. A CPU supplies filter coefficients to the filter and performs such functions as quantizing the filter coefficients, arranging the quantized filter coefficients into a three-dimensional array including rows and columns, determining a ratio between a total sum of values of the rows and columns of the array of quantized filter coefficients, and correcting each of the quantized filter coefficients in response to the determined ratio so as to maintain the predetermined DC gain. A down-sampler receives the output of the filter for multiplying the rate converted frequencies by 1/L or 1/M during the L:M conversion or the M:L conversion, respectively.
摘要翻译：在用于将数字信号的采样频率L转换为采样频率M（L：M转换）或用于将数字信号的采样频率M转换为采样频率L（M：L转换））的采样率转换器中，使用相同的滤波器系数，并且为两个转换维持恒定的预定DC增益。分别在L：M转换和M：L转换期间，过采样器将采样频率L或M分别乘以M或L。接收过采样器的输出的滤波器限制输出的频带。 CPU向滤波器提供滤波器系数，并执行量化滤波器系数的功能，将量化的滤波器系数布置成包括行和列的三维阵列，确定行和列的值的总和之间的比率量化滤波器系数阵列，并且响应于所确定的比率校正每个量化滤波器系数，以便维持预定的DC增益。下采样器接收滤波器的输出，分别在L：M转换或M：L转换期间将速率转换频率乘以1 / L或1 / M。

23. 发明授权

US4751663A IIR digital filter 失效
标题翻译： IIR数字滤波器
公开(公告)号：US4751663A
公开(公告)日：1988-06-14
申请号：US685127
申请日：1984-12-21
申请人： Takao Yamazaki
发明人： Takao Yamazaki
IPC分类号： H03H17/04 , G06F7/38
CPC分类号： H03H17/04
摘要： In an IIR digital filter, the same polynomial is multiplied to both the denominator and the numerator of the system function for the IIR digital filter so as to eliminate the first order term from the denominator of the system function. Thereby, an IIR digital filter for a high-speed signal can be attained using an operation element of relatively low speed and small power consumption.
摘要翻译：在IIR数字滤波器中，相同的多项式与IIR数字滤波器的系统函数的分母和分子相乘，从而从系统函数的分母中消除一阶项。因此，可以使用相对低速度和小功耗的操作元件来获得用于高速信号的IIR数字滤波器。

24. 发明授权

US08411450B2 Electronic device package, module, and electronic device 有权
标题翻译：电子设备封装，模块和电子设备
公开(公告)号：US08411450B2
公开(公告)日：2013-04-02
申请号：US12161825
申请日：2007-01-25
申请人： Takao Yamazaki , Yoshimichi Sogawa , Tomohiro Nishiyama
发明人： Takao Yamazaki , Yoshimichi Sogawa , Tomohiro Nishiyama
IPC分类号： H05K1/00 , H05K1/03 , H05K7/00 , H05K1/14 , H01L23/02 , H01L23/34
CPC分类号： H01L23/13 , H01L23/5387 , H01L23/5389 , H01L23/642 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2225/06513 , H01L2225/06524 , H01L2225/06527 , H01L2225/06551 , H01L2225/06555 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/19105 , H01L2224/0401
摘要： The present invention is directed to provide a semiconductor package and the like realizing reduced manufacturing cost and improved reliability by enhancing a ground line and/or a power supply line. A semiconductor package 50 includes: a semiconductor device 1 including a circuit face on which an external electrode is formed; an insertion substrate 2 forming a housing part in which the semiconductor device 1 is disposed; and an interposer substrate 5 including a wiring pattern 7 and whose both ends are bent along the insertion substrate 2. The insertion substrate 2 is made of a conductive material and is electrically connected to a ground line or a power supply line in the wiring pattern 7 in the interposer substrate 5.
摘要翻译：本发明旨在提供一种通过增强接地线和/或电源线来实现降低制造成本和提高可靠性的半导体封装等。半导体封装50包括：半导体器件1，其包括形成有外部电极的电路面; 形成半导体装置1的壳体部的插入基板2; 以及包括布线图案7并且其两端沿着插入基板2弯曲的插入基板5.插入基板2由导电材料制成并且电连接到布线图案7中的接地线或电源线在内插基片5中。

25. 发明授权

US08236616B2 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US08236616B2
公开(公告)日：2012-08-07
申请号：US13020410
申请日：2011-02-03
申请人： Takao Yamazaki
发明人： Takao Yamazaki
IPC分类号： H01L23/498
CPC分类号： H01L23/4985 , H01L21/6835 , H01L23/3114 , H01L23/5387 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2224/81001 , H01L2224/81011 , H01L2224/8112 , H01L2224/81191 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/8388 , H01L2224/92225 , H01L2225/1005 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/189 , H05K2201/056 , H05K2201/10515 , H05K2201/10734 , H01L2924/07025 , H01L2924/00 , H01L2924/01047 , H01L2924/0105 , H01L2924/00015 , H01L2224/0401
摘要： There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package.
摘要翻译：提供了一种廉价的半导体器件，可以堆叠商业和质量保证（检查）的芯片尺寸封装，并且具有小的共平面度值和高安装可靠性。一种半导体器件，其中柔性电路基板粘附到半导体封装的横向侧的至少一部分，并且位于半导体封装的焊球侧的柔性电路基板在内部的区域内折叠的半导体封装的边缘。

26. 发明授权

US07724820B2 Method of real time MPEG-4 texture decoding for a multiprocessor environment 有权
标题翻译：多处理器环境的实时MPEG-4纹理解码方法
公开(公告)号：US07724820B2
公开(公告)日：2010-05-25
申请号：US11167050
申请日：2005-06-23
申请人： Jeongnam Youn , Takao Yamazaki
发明人： Jeongnam Youn , Takao Yamazaki
IPC分类号： H04B1/66 , H04N7/12
CPC分类号： H04N19/436 , H04N19/105 , H04N19/11 , H04N19/176 , H04N19/20 , H04N19/423 , H04N19/44
摘要： An apparatus and method is described for performing texture-decoding within a video decoder processing a series of macroblocks within a video bit-stream. The inventive texture decoding is particularly well suited for implementation within decoders incorporating multiple processors. The method separates data independent operations from data dependent (sequential) operations wherein multiprocessing may be efficiently utilized for processing data independent macroblocks. The method preferably makes an assumption as to prediction direction within the set of data dependent operations. A prediction determination is then made and the assumption corrected if necessary with a transposition within the data independent operations operating on the macroblocks. The method reduces the computational overhead and provides for efficiently segmenting operations within a multiprocessing decoder.
摘要翻译：描述了在视频解码器内执行纹理解码的装置和方法，该视频解码器处理视频比特流内的一系列宏块。本发明的纹理解码特别适用于并入多个处理器的解码器内的实现。该方法将数据无关操作与数据相关（顺序）操作分开，其中可以有效地利用多处理来处理与数据无关的宏块。该方法优选地对数据相关操作的集合内的预测方向进行假设。然后进行预测确定，并且如果需要，则在基于宏块的数据独立操作中进行转置来校正假设。该方法减少了计算开销并且提供了在多处理解码器内的有效分段操作。

27. 发明申请

US20100025844A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 失效
标题翻译：半导体器件及其制造方法
公开(公告)号：US20100025844A1
公开(公告)日：2010-02-04
申请号：US12515437
申请日：2008-09-19
申请人： Takao Yamazaki
发明人： Takao Yamazaki
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/4985 , H01L21/6835 , H01L23/3114 , H01L23/5387 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L25/0655 , H01L25/105 , H01L25/16 , H01L25/50 , H01L2224/13099 , H01L2224/13111 , H01L2224/16225 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/73253 , H01L2224/81001 , H01L2224/81011 , H01L2224/8112 , H01L2224/81191 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/8388 , H01L2224/92225 , H01L2225/1005 , H01L2225/107 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/15311 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3511 , H05K1/189 , H05K2201/056 , H05K2201/10515 , H05K2201/10734 , H01L2924/07025 , H01L2924/00 , H01L2924/01047 , H01L2924/0105 , H01L2924/00015 , H01L2224/0401
摘要： There is provided a low-cost semiconductor device that commercial and quality-assured (inspected) chip size packages can be stacked and has a small co-planarity value and a high mounting reliability. A semiconductor device in which a flexible circuit substrate is adhered to at least a part of a lateral side of a semiconductor package, and the flexible circuit substrate, which is on a side facing solder balls of the semiconductor package, is folded at a region inside of an edge of the semiconductor package.
摘要翻译：提供了一种廉价的半导体器件，可以堆叠商业和质量保证（检查）的芯片尺寸封装，并且具有小的共平面度值和高安装可靠性。一种半导体器件，其中柔性电路基板粘附到半导体封装的横向侧的至少一部分，并且位于半导体封装的焊球侧的柔性电路基板在内部的区域内折叠的半导体封装的边缘。

28. 发明授权

US07594644B2 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus 失效
标题翻译：半导体装置及其制造方法，电路基板，电子设备及半导体装置的制造装置
公开(公告)号：US07594644B2
公开(公告)日：2009-09-29
申请号：US11267328
申请日：2005-11-07
申请人： Takao Yamazaki , Hirobumi Inoue , Ichiro Hazeyama , Sakae Kitajo , Masahiro Kubo , Yoshimichi Sogawa , Hidehiko Kuroda
发明人： Takao Yamazaki , Hirobumi Inoue , Ichiro Hazeyama , Sakae Kitajo , Masahiro Kubo , Yoshimichi Sogawa , Hidehiko Kuroda
IPC分类号： B25B11/00
CPC分类号： H01L25/50 , H01L23/4985 , H01L25/105 , H01L2224/02371 , H01L2224/05001 , H01L2224/05026 , H01L2224/05571 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/73253 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01L2224/05599 , H01L2224/05099
摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.
摘要翻译：提供一种半导体器件，包括具有电路和电路的至少一个电极的半导体元件，具有至少一个电极焊盘并围绕半导体元件的柔性基板，用于将电极与电极焊盘连接的导体，以及多个在电极焊盘上的焊料凸点，其中面对半导体元件的焊料凸块的表面和柔性基板之间的至少第一部分不通过粘附固定。

29. 发明申请

US20070037882A1 Remedy for cerebral neurodegenerative diseases using ppar agonist 审中-公开
标题翻译：使用ppar激动剂治疗脑神经变性疾病
公开(公告)号：US20070037882A1
公开(公告)日：2007-02-15
申请号：US10554109
申请日：2004-04-15
申请人： Yasuhiro Kita , Takao Yamazaki , Masakazu Muramoto , Akinori Iwashita , Akira Moriguchi , Nobuya Matsuoka
发明人： Yasuhiro Kita , Takao Yamazaki , Masakazu Muramoto , Akinori Iwashita , Akira Moriguchi , Nobuya Matsuoka
IPC分类号： A61K31/22
CPC分类号： A61K31/426 , A61K31/192
摘要： In accordance with the invention, a compound with a protective action for nerve cell can be reselected by adding PPARδ agonist to a culture cell system where toxic substances such as thapsigargin, MPP+ and staurosporine are preliminarily allowed to react and reselecting a compound improving the survival rate. The compound selected by such method can be used as an active ingredient of a therapeutic agent for neurodegenerative diseases such as cerebral infarction and Parkinson's disease. Thus, the invention is very useful for research works for creating novel pharmaceutical agent.
摘要翻译：根据本发明，通过将PPARδ激动剂加入培养细胞系统中，可以重新选择具有保护神经细胞作用的化合物，其中预先允许有毒物质如毒胡萝卜素，MPP +和/或星孢菌素反应并重新选择提高存活率的化合物。通过这种方法选择的化合物可以用作神经变性疾病如脑梗死和帕金森病的治疗剂的活性成分。因此，本发明对于创造新型药剂的研究工作非常有用。

30. 发明申请

US20060055053A1 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus 失效
公开(公告)号：US20060055053A1
公开(公告)日：2006-03-16
申请号：US11267328
申请日：2005-11-07
申请人： Takao Yamazaki , Hirobumi Inoue , Ichiro Hazeyama , Sakae Kitajo , Masahiro Kubo , Yoshimichi Sogawa , Hidehiko Kuroda
发明人： Takao Yamazaki , Hirobumi Inoue , Ichiro Hazeyama , Sakae Kitajo , Masahiro Kubo , Yoshimichi Sogawa , Hidehiko Kuroda
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L23/4985 , H01L25/105 , H01L2224/02371 , H01L2224/05001 , H01L2224/05026 , H01L2224/05571 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/73253 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/3511 , H01L2224/05599 , H01L2224/05099
摘要： A semiconductor device is provided including a semiconductor element having a circuit and at least one electrode of the circuit, a flexible substrate having at least one electrode pad and surrounding the semiconductor element, a conductor for connecting the electrode with the electrode pad, and a plurality of solder bumps on the electrode pad, wherein at least a first portion between a surface facing the solder bumps of the semiconductor element and the flexible substrate is not fixed by adhesion.

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