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21. 发明授权

US5783220A Resin sealing and molding apparatus for sealing electronic parts 失效
标题翻译：用于密封电子零件的树脂密封和成型装置
公开(公告)号：US5783220A
公开(公告)日：1998-07-21
申请号：US738095
申请日：1996-10-25
申请人： Michio Osada , Keiji Maeda
发明人： Michio Osada , Keiji Maeda
IPC分类号： B08B7/00 , B29C33/72 , B29C45/02 , B29C45/14 , B29C45/26 , H01L21/56 , B29C45/17
CPC分类号： B29C33/72 , B08B7/0057 , B29L2031/3425
摘要： A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.
摘要翻译：一种用于电子部件的树脂密封和模制装置包括用于去除附着在或积聚在模具表面上的模具表面污染物的清洁UV施加机构。紫外线施加机构被安装成自由地往复运动到缩回位置，其不阻止向每个树脂成型单元部分供应未密封的引线框架和树脂片剂的操作以及用于取出密封的引线框架的操作以及关闭的展开或操作位置到每个树脂模塑单元中的模具表面。使用这种UV应用机制，特别是与抽吸装置结合使用，模具表面污染物，如a; 通过加热产生的树脂材料中含有的脱模剂或粘附于或积聚在各树脂成型单元的模具表面上的挥发性气体被有效且可靠地除去。

22. 发明授权

US08611372B2 Data transfer system and method 有权
标题翻译：数据传输系统及方法
公开(公告)号：US08611372B2
公开(公告)日：2013-12-17
申请号：US13097691
申请日：2011-04-29
申请人： Keiji Maeda
发明人： Keiji Maeda
IPC分类号： H04L12/28 , H04J1/16
CPC分类号： H04L12/4608 , H04L12/462
摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.
摘要翻译：传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包，将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

23. 发明申请

US20070072346A1 Method of resin-seal-molding electronic component and apparatus therefor 审中-公开
标题翻译：树脂密封成型电子部件的方法及其装置
公开(公告)号：US20070072346A1
公开(公告)日：2007-03-29
申请号：US11520584
申请日：2006-09-14
申请人： Keiji Maeda
发明人： Keiji Maeda
IPC分类号： H01L21/00
CPC分类号： H01L21/565 , H01L21/67126 , H01L2924/0002 , H01L2924/00
摘要： A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. At a mold face (PL face) of the molds, a substrate supply-set surface having a flat shape without a step is provided. A pot block is joined with and separated from a side position of the mold intersecting perpendicularly with the mold face (PL face) of the molds. In a state where the mold face and the pot block are joined, a molten resin material in the pot block is injected into a cavity. The overall structure of the mold for resin-seal-molding an electronic component mounted on the substrate is simplified. Additionally, when resin-seal-molding the electronic component, a problem of variation in the thicknesses of the substrates is solved. Thus, resin flash formation on the substrate surface is prevented.
摘要翻译：用于树脂密封成型电子部件的模具由第一模具和第二模具构成。在模具的模具面（PL面）上设置没有台阶的平坦形状的基板供给台面。罐模块与模具的与模具的模具面（PL面）垂直相交的侧面位置连接并分离。在模具面和盆料块接合的状态下，将罐体中的熔融树脂材料注入空腔。用于树脂密封成型安装在基板上的电子部件的模具的整体结构简化。此外，当树脂密封成型电子部件时，解决了基板的厚度变化的问题。因此，防止在基板表面上形成树脂。

24. 发明申请

US20070069421A1 Method of resin-seal-molding electronic component and apparatus therefor 审中-公开
标题翻译：树脂密封成型电子部件的方法及其装置
公开(公告)号：US20070069421A1
公开(公告)日：2007-03-29
申请号：US11521448
申请日：2006-09-15
申请人： Keiji Maeda
发明人： Keiji Maeda
IPC分类号： B29C45/14
CPC分类号： H01L21/565 , B29C45/02 , B29C45/14655 , B29C45/44 , H01L2924/0002 , H01L2924/00
摘要： A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. A molding face (PL) of the molds has a substrate supply-set surface, which has a flat shape without a step. A pot block is joined with and separated from a side position of the mold perpendicular to the mold face (PL). In a state where the mold face and the pot block are joined, a molten resin material in the pot block is injected into a cavity. Further, a mold-opening is performed where the second mold is separated away from the one mold in a state where the resin-seal-molded substrate is fixed to a mold surface of the one mold. According to the present method, the overall structure of the mold for resin-seal-molding an electronic component can be simplified.
摘要翻译：用于树脂密封成型电子部件的模具由第一模具和第二模具构成。模具的成型面（PL）具有基板供给台面，其平面形状没有台阶。罐模块与模具的垂直于模具面（PL）的侧面位置连接并分离。在模具面和盆料块接合的状态下，将罐体中的熔融树脂材料注入空腔。此外，在树脂密封成型基板被固定到一个模具的模具表面的状态下，执行模具打开，其中第二模具与一个模具分离。根据本方法，可以简化用于树脂密封成型电子部件的模具的整体结构。

25. 发明申请

US20060189710A1 Aqueous ink 审中-公开
标题翻译：水性油墨
公开(公告)号：US20060189710A1
公开(公告)日：2006-08-24
申请号：US10565555
申请日：2004-07-22
申请人： Katsuhiro Hayashi , Keiji Maeda , Akihiro Gotoh , Yoshio Mori
发明人： Katsuhiro Hayashi , Keiji Maeda , Akihiro Gotoh , Yoshio Mori
IPC分类号： C03C17/00
CPC分类号： C09D11/03 , C09D11/16 , C09D11/18
摘要： The present invention relates to an aqueous ink containing a dispersant composed of a crosslinked copolymer which is excellent in dispersibility of a colorant such as a pigment and is capable of stably maintaining the dispersed state in an aqueous medium for a long period of time. Specifically, it is an aqueous ink containing a dispersant, a colorant, and an aqueous medium, the dispersant being composed of a crosslinked copolymer containing (A) a crosslinkable monomer, (B) an aromatic group-containing monomer, and (C) an ionic monomer as essential constituting components.
摘要翻译：本发明涉及一种水性油墨，其含有由着色剂如颜料的分散性优异的交联共聚物组成的分散体，能够长时间稳定地维持水性介质中的分散状态。具体地说，它是含有分散剂，着色剂和水性介质的水性油墨，该分散剂由含有（A）可交联单体，（B）含芳香族基团的单体的交联共聚物和（C）离子单体作为必要的组成成分。

26. 发明授权

US06904049B1 Data transfer system and method for transferring data packets over an ATM link 有权
标题翻译：用于通过ATM链路传输数据包的数据传输系统和方法
公开(公告)号：US06904049B1
公开(公告)日：2005-06-07
申请号：US09558598
申请日：2000-04-26
申请人： Keiji Maeda
发明人： Keiji Maeda
IPC分类号： G06F13/38 , H04L12/46 , H04L12/66 , H04L12/951 , H04L12/953 , H04L12/56
CPC分类号： H04L12/4608 , H04L12/462
摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.
摘要翻译：传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包，将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

27. 发明申请

US20110233821A1 COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR 审中-公开
标题翻译：电子元器件及其设备的压缩树脂密封和成型方法
公开(公告)号：US20110233821A1
公开(公告)日：2011-09-29
申请号：US13121554
申请日：2009-09-25
申请人： Kazuhiko Bandoh , Keiji Maeda , Kunihiko Fujiwara , Noritoshi Nakano
发明人： Kazuhiko Bandoh , Keiji Maeda , Kunihiko Fujiwara , Noritoshi Nakano
IPC分类号： B29C45/14 , B29C47/88
CPC分类号： B29C43/34 , B29C43/18 , B29C43/36 , B29C48/06 , B29C48/08 , B29C48/9135 , B29C2043/3444 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A compression resin sealing apparatus includes cooling means (64, 104) for each of an upper die (6) and a lower die (10). A gate nozzle (15) including cooling means (154a) is provided in the upper die (6). A cavity (106) for mounting a single substrate is provided in the lower die (10). In this apparatus, a liquid thermosetting resin material (R) in a required amount is supplied into the cavity (106) through the gate nozzle (15). Then, a substrate is supplied between the upper die (6) and the lower die (10), and the upper die (6) and the lower die (10) are clamped to each other. As a result, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106). That is, compression resin molding is performed. Here, a temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).
摘要翻译：压缩树脂密封装置包括用于上模（6）和下模（10）中的每一个的冷却装置（64,104）。在上模具（6）中设有包括冷却装置（154a）的浇口（15）。用于安装单个基板的空腔（106）设置在下模具（10）中。在该装置中，通过浇口（15）向所述空腔（106）供给所需量的液态热固性树脂材料（R）。然后，在上模（6）和下模（10）之间提供基板，并且上模（6）和下模（10）彼此夹紧。结果，将基板上的电子部件浸渍在空腔（106）中的液体热固性树脂材料（R）中。也就是说，进行压缩树脂成型。这里，液态热固性树脂材料（R）的温度由栅极喷嘴（15）和冷却装置（154a，64,104）控制。

28. 发明授权

US07760662B2 Data transfer system and method 失效
标题翻译：数据传输系统及方法
公开(公告)号：US07760662B2
公开(公告)日：2010-07-20
申请号：US12343755
申请日：2008-12-24
申请人： Keiji Maeda
发明人： Keiji Maeda
IPC分类号： H04L12/56 , H04J1/16
CPC分类号： H04L12/4608 , H04L12/462
摘要： A transmission source bridge collects packets sent from nodes connected to a serial bus in accordance the IEEE1394 Standards, into one packet in an order they are to be transmitted and then sends them onto an ATM network, so that a transmission destination bridge receives this packet and divides it into a plurality of smaller packets and transfers them, in the order they were sent, to nodes connected to the serial bus in accordance with the IEEE1394 Standards.
摘要翻译：传输源网桥将根据IEEE1394标准连接到串行总线的节点发送的数据包按照要发送的顺序收集到一个数据包中，然后将其发送到ATM网络上，从而传输目的地网桥接收该数据包，将其分成多个较小的分组，并按照它们发送的顺序将它们按照IEEE1394标准传输到连接到串行总线的节点。

29. 发明授权

US07084186B2 Crosslinkable resin compositions 失效
公开(公告)号：US07084186B2
公开(公告)日：2006-08-01
申请号：US09883406
申请日：2001-06-19
申请人： Eiichi Okazaki , Hideo Matsuzaki , Keiji Maeda , Kuniniko Mizotani
发明人： Eiichi Okazaki , Hideo Matsuzaki , Keiji Maeda , Kuniniko Mizotani
IPC分类号： C08F2/46
CPC分类号： C08F8/30
摘要： Crosslinkable resin compositions that are cured easily by irradiation with active energy beams and particularly cured quickly with ultraviolet ray are provided, which comprises a polymer containing a maleimido group and an ethylenically unsaturated group. The composition may be an aqueous composition. They provide cured films which are excellent in durability, free from coloring and odors, and also excellent in abrasion resistance, adhesion to substrates, surface smoothness, and chemical resistance.

30. 发明授权

US06773247B1 Die used for resin-sealing and molding an electronic component 失效
标题翻译：用于树脂密封和模制电子部件的模具
公开(公告)号：US06773247B1
公开(公告)日：2004-08-10
申请号：US09705237
申请日：2000-11-02
申请人： Michio Osada , Keiji Maeda , Yoshihisa Kawamoto , Yoshiji Shimizu , Toshiyuki Nishimura , Susumu Yamahara
发明人： Michio Osada , Keiji Maeda , Yoshihisa Kawamoto , Yoshiji Shimizu , Toshiyuki Nishimura , Susumu Yamahara
IPC分类号： B29C7072
CPC分类号： H01L21/565 , H01L2224/48091 , H01L2924/01078 , H01L2924/01322 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.
摘要翻译：用于模塑具有树脂的电子部件的模具包括固定的顶模和可移动的底模，并且至少具有与镍 - 钨合金电镀的熔融树脂材料接触的表面。这种电镀可以提供优于硬铬电镀的树脂成型体等的脱离性，以允许顶针有效地从模具中弹出和释放树脂模制体。

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