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21. 发明授权

US08066356B2 Thermal inkjet print head 失效
标题翻译：热喷墨打印头
公开(公告)号：US08066356B2
公开(公告)日：2011-11-29
申请号：US12209775
申请日：2008-09-12
申请人： Moon-chul Lee , Yong-seop Yoon , Yong-won Jeong , Dong-sik Shim , Sung-joon Park , Jong-seok Kim
发明人： Moon-chul Lee , Yong-seop Yoon , Yong-won Jeong , Dong-sik Shim , Sung-joon Park , Jong-seok Kim
IPC分类号： B41J2/05 , B41J2/04
CPC分类号： B41J2/1404 , B41J2/14129 , B41J2/17563 , B41J2002/14403
摘要： A thermal inkjet printhead is provided including a substrate, and a chamber layer, which is stacked on the substrate. The chamber layer includes an ink chamber that is filled with ink supplied from an ink feed hole. The printhead includes a heater inside the ink chamber that heats the ink, an island, which is formed on the substrate at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, including a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.
摘要翻译：提供一种热喷墨打印头，包括基板和层叠在基板上的室层。室层包括填充有从供墨孔供应的油墨的油墨室。打印头包括在油墨室内加热油墨的加热器，在油墨室的墨水入口处形成在基板上的岛和层叠在室层上的喷嘴层，其包括用于喷墨。相对于喷嘴的中心，墨水室和彼此面对的岛的壁是对称的。

22. 发明授权

US07926165B2 Micro antenna and method of manufacturing the same 失效
标题翻译：微天线及其制造方法
公开(公告)号：US07926165B2
公开(公告)日：2011-04-19
申请号：US11712526
申请日：2007-03-01
申请人： Young-tack Hong , Moon-chul Lee , In-sang Song , Sang-wook Kwon , Chang-won Jung , Eun-seok Park
发明人： Young-tack Hong , Moon-chul Lee , In-sang Song , Sang-wook Kwon , Chang-won Jung , Eun-seok Park
IPC分类号： H01P11/00 , H01Q13/00 , H01Q17/00 , H01Q1/36 , H05K3/36 , H01K3/10
CPC分类号： H01Q1/2283 , H01F17/0033 , H01F41/041 , H01Q1/362 , Y10T29/49016 , Y10T29/49018 , Y10T29/49126 , Y10T29/49165
摘要： A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.
摘要翻译：提供一种制造微型天线的方法。该方法包括：形成穿过第一基板的多个孔，用导电材料填充多个孔中的每个孔，以形成多个垂直导电部分，在第一基板的两个不同表面的每一个上形成多个水平导电部件其中，每个水平导电部分电连接到相应的垂直导电部分，将其上形成有垂直导电部分和水平导电部分的第一基板接合到第二基板，并且将第一基板去除露出形成在第二基板上的3D微型天线的整体结构，并且包括彼此连接的垂直导电部分和水平导电部件。

23. 发明授权

US07862150B2 Inkhead printhead configured to overcome impaired print quality due to nozzle blockage, printing method using the same, and method of manufacturing the inkjet printhead 有权
标题翻译：喷墨头打印头被配置为克服由于喷嘴堵塞而导致的打印质量受损，使用其的打印方法以及制造喷墨打印头的方法
公开(公告)号：US07862150B2
公开(公告)日：2011-01-04
申请号：US11859885
申请日：2007-09-24
申请人： Moon-chul Lee , Myong-jong Kwon , Yong-seop Yoon , Jin-wook Lee , Yong-won Jeong , Donk-sik Shim
发明人： Moon-chul Lee , Myong-jong Kwon , Yong-seop Yoon , Jin-wook Lee , Yong-won Jeong , Donk-sik Shim
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1404 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1639 , B41J2/2139 , B41J2/515
摘要： The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers.
摘要翻译：喷墨打印头包括具有形成为供墨的供墨孔的基板，层叠在基板上的室层，并且在其间形成有供墨孔的多个主墨室和在其间形成的多个补偿墨室，相互面对的主墨室; 以及层叠在所述室层上的喷嘴层，并且包括对应于所述主油墨室的多个主喷嘴和对应于所述补偿油墨室的多个补偿喷嘴。

24. 发明授权

US07545017B2 Wafer level package for surface acoustic wave device and fabrication method thereof 有权
标题翻译：用于表面声波器件的晶片级封装及其制造方法
公开(公告)号：US07545017B2
公开(公告)日：2009-06-09
申请号：US11447969
申请日：2006-06-07
申请人： Moon-chul Lee , Jun-sik Hwang , Ji-hyuk Lim , Woon-bae Kim
发明人： Moon-chul Lee , Jun-sik Hwang , Ji-hyuk Lim , Woon-bae Kim
IPC分类号： H01L29/84
CPC分类号： H03H9/1092 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H01L2924/00014
摘要： A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.
摘要翻译：一种用于表面声波（SAW）器件的晶片级封装及其制造方法。 SAW器件晶片级封装包括SAW器件，其中SAW元件形成在器件晶片的顶表面上，盖晶片与SAW器件的顶表面结合并具有穿透盖晶片的通孔，以及用于填充通孔的一部分的导电构件。通孔具有第一通孔部分和第二通孔部分，第一通孔部分具有从盖子晶片的底表面到一定深度的逐渐变小的直径，并且第二通孔部分具有从第一通孔部分直到盖晶片的顶表面。

25. 发明申请

US20090047605A1 METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE USING PHOTOLITHOGRAPHY PROCESS AND METHOD OF MANUFACTURING INKJET PRINTHEAD USING THE METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE 有权
标题翻译：使用光刻方法制造感光环氧结构的方法和使用制造光敏环氧结构的方法制造喷墨印刷方法
公开(公告)号：US20090047605A1
公开(公告)日：2009-02-19
申请号：US11968809
申请日：2008-01-03
申请人： Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
发明人： Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
IPC分类号： G03F7/22 , G03F7/26
CPC分类号： G03F7/203 , B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2002/14475
摘要： Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.
摘要翻译：提供了使用光刻工艺制造光敏环氧树脂结构的方法，以及使用制造光敏环氧树脂结构的方法制造喷墨打印头的方法。制造感光环氧树脂结构的方法包括形成由光敏环氧树脂形成的环氧树脂材料层; 通过进行第一曝光操作在环氧树脂材料层中形成第一曝光图案; 通过进行第二曝光操作在所述环氧树脂材料层的未曝光部分中形成第二曝光图案; 以及显影环氧材料层，其中在第一曝光操作中使用的第一UV能量的量与在第二曝光操作中使用的第二UV能量的量不同。

26. 发明授权

US07408434B2 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package 有权
标题翻译：嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
公开(公告)号：US07408434B2
公开(公告)日：2008-08-05
申请号：US11400637
申请日：2006-04-10
申请人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
发明人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
IPC分类号： H01F5/00 , H01L23/02
CPC分类号： H01F17/0006 , H01F41/041 , H01F2017/0046 , H01L27/08 , Y10T29/4902 , Y10T29/4906 , Y10T29/49064 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165
摘要： An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
摘要翻译：嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到线圈电极。电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

27. 发明授权

US07172916B2 Method and apparatus for vacuum-mounting a micro electro mechanical system on a substrate 失效
标题翻译：将微机电系统真空安装在基板上的方法和装置
公开(公告)号：US07172916B2
公开(公告)日：2007-02-06
申请号：US10701552
申请日：2003-11-06
申请人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
发明人： Kyu-dong Jung , Chan-Bong Jun , Hyung Choi , Seok-jin Kang , Seog-woo Hong , Seok-whan Chung , Moon-chul Lee , Eun-sung Lee
IPC分类号： H01L21/00
CPC分类号： B81C1/00285
摘要： A method and apparatus for vacuum-mounting at least one micro electro mechanical system (MEMS) on a substrate includes a gas injecting section for injecting an inert gas into a vacuum chamber; a substrate aligning section for aligning a semiconductor substrate and a cover, the cover having a cavity formed therein and a getter attached to an interior surface of the cavity; a bonding section for bonding the semiconductor substrate and the cover together; and a controlling section for controlling the substrate aligning section to align the semiconductor and the cover, for controlling the gas injecting section to inject the inert gas into the vacuum chamber, and for controlling the bonding section to bond the semiconductor substrate and the cover together after the inert gas is injected.
摘要翻译：用于真空安装至少一个微机电系统（MEMS）在基板上的方法和装置包括用于将惰性气体注入真空室的气体注入部分; 用于对准半导体衬底和盖的衬底对准部分，所述盖具有形成在其中的空腔和附着到腔的内表面的吸气剂; 用于将半导体衬底和盖结合在一起的接合部分; 以及控制部分，用于控制衬底对准部分以对准半导体和盖子，用于控制气体注入部分以将惰性气体注入真空室中，并且用于控制接合部分将半导体衬底和盖子结合在一起，之后注入惰性气体。

28. 发明授权

US07169684B2 Device having inductors and capacitors and a fabrication method thereof 失效
标题翻译：具有电感器和电容器的装置及其制造方法
公开(公告)号：US07169684B2
公开(公告)日：2007-01-30
申请号：US10373735
申请日：2003-02-27
申请人： Moon-chul Lee , In-sang Song , Young-tack Hong , Sung-hye Jeong , Jeong-yoo Hong
发明人： Moon-chul Lee , In-sang Song , Young-tack Hong , Sung-hye Jeong , Jeong-yoo Hong
IPC分类号： H01L21/30
CPC分类号： H01L27/016 , H01L23/5223 , H01L23/5227 , H01L27/0744 , H01L28/10 , H01L28/40 , H01L2924/0002 , H03H7/00 , H03H7/0115 , H03H2001/0078 , H03H2001/0085 , H05K1/16 , H05K1/162 , H05K1/165 , H05K2201/1006 , H05K2201/10545 , Y10S438/977 , H01L2924/00
摘要： An LC device having a substrate, a support layer having upper and lower sides formed on the substrate, inductors formed on either the upper or lower side of the support layer, and capacitors formed in the opposite side of the support layer. The support layer may be formed of a low-k dielectric material, and a connection portion may be provided to connect the inductors and capacitors in the support layer. The inductors and capacitors are disposed in a stacked structure on the upper and lower sides of the low-k dielectric support layer on the substrate, so that space efficiency may be maximized on the substrate. The low-k dielectric support layer provides support between the inductors and capacitors so that substrate loss is minimized and a Q factor of the inductors is enhanced.
摘要翻译：具有衬底的LC器件，在衬底上形成有上下侧的支撑层，形成在支撑层的上侧或下侧的电感器以及形成在支撑层的相对侧的电容器。支撑层可以由低k介电材料形成，并且可以提供连接部分来连接支撑层中的电感器和电容器。电感器和电容器以堆叠的结构设置在衬底上的低k电介质支撑层的上侧和下侧，使得在衬底上空间效率最大化。低k电介质支撑层提供电感器和电容器之间的支撑，使得衬底损耗最小化并且电感器的Q因数增强。

29. 发明申请

US20060273444A1 Packaging chip and packaging method thereof 失效
标题翻译：包装芯片及其包装方法
公开(公告)号：US20060273444A1
公开(公告)日：2006-12-07
申请号：US11390220
申请日：2006-03-28
申请人： Kyu-dong Jung , Woon-bae Kim , In-sang Song , Moon-chul Lee , Jun-sik Hwang , Suk-jin Ham
发明人： Kyu-dong Jung , Woon-bae Kim , In-sang Song , Moon-chul Lee , Jun-sik Hwang , Suk-jin Ham
IPC分类号： H01L23/48
CPC分类号： H01L23/055 , H01L23/04 , H01L27/14618 , H01L2224/16
摘要： A packaging chip in which a circuit module is packaged and a method of packaging a circuit module are provided. The packaging chip includes a base wafer; a circuit module on the base wafer; a packaging wafer having a cavity and combined with the base wafer so that the circuit module fits inside the cavity; a connecting electrode connecting upper and lower surfaces of the cavity; and a seed layer between the connecting electrode and the packaging wafer. The method includes etching a lower surface of the packaging wafer to form a cavity, stacking a metal layer in an area of the lower surface, combining the base wafer with the packaging wafer, polishing the packaging wafer, forming a viahole through the packaging wafer, stacking a seed layer on the packaging wafer, plating the inside of the viahole, removing the seed layer and forming an electrode.
摘要翻译：提供电路模块封装的封装芯片和封装电路模块的方法。包装芯片包括基底晶片; 基底晶片上的电路模块; 封装晶片，其具有空腔并与所述基底晶片组合，使得所述电路模块装配在所述腔内; 连接所述空腔的上表面和下表面的连接电极; 以及连接电极和封装晶片之间的晶种层。该方法包括蚀刻封装晶片的下表面以形成空腔，在下表面的区域中堆叠金属层，将基底晶片与封装晶片组合，抛光封装晶片，通过封装晶片形成通孔，将种子层堆叠在包装晶片上，电镀通孔内部，去除种子层并形成电极。

30. 发明授权

US08057013B2 Ink-jet printhead and manufacturing method thereof 有权
标题翻译：喷墨打印头及其制造方法
公开(公告)号：US08057013B2
公开(公告)日：2011-11-15
申请号：US11830112
申请日：2007-07-30
申请人： Myong-jong Kwon , Sung-joon Park , Moon-chul Lee
发明人： Myong-jong Kwon , Sung-joon Park , Moon-chul Lee
IPC分类号： B41J2/135
CPC分类号： B41J2/1603 , B41J2/1606 , B41J2/1628 , B41J2/1631 , B41J2/1639 , B41J2/1645
摘要： An inkjet printhead and a method of manufacturing the printhead. The inkjet printhead includes a substrate through which an ink supply passage is formed, a chamber plate stacked on the substrate having an ink chamber filled with ink supplied through the ink supply passage and heating resistors to heat the ink formed in the ink chamber, a nozzle plate formed on the chamber plate and through which a plurality of nozzles through which ink is ejected are formed, and a water repellent layer formed on the nozzle plate, wherein portions of a covalent bond formed by reaction between the material forming the nozzle plate and a hydrolysis material used to form the water repellent layer are discontinuously formed.
摘要翻译：喷墨打印头和制造打印头的方法。喷墨打印头包括形成油墨供给通道的基板，在基板上堆叠有一个油墨室的室板，其中填充有通过供墨通道供应的油墨和加热电阻器以加热形成在油墨室中的油墨，喷嘴形成在所述室板上的板，并且形成有多个喷嘴，通过所述多个喷嘴喷射油墨，以及形成在所述喷嘴板上的防水层，其中通过形成所述喷嘴板的材料与所述喷嘴板之间的反应形成的共价键的部分用于形成防水层的水解材料不连续地形成。

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