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21. 发明授权

US08350285B2 Semiconductor light-emitting device and method for manufacturing same 有权
公开(公告)号：US08350285B2
公开(公告)日：2013-01-08
申请号：US12710829
申请日：2010-02-23
申请人： Yoshiaki Sugizaki , Akihiro Kojima , Susumu Obata
发明人： Yoshiaki Sugizaki , Akihiro Kojima , Susumu Obata
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L25/048 , H01L33/0079 , H01L33/0095 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： A semiconductor light-emitting device of the invention includes: a semiconductor layer including a light-emitting layer and having a first major surface and a second major surface opposite to the first major surface; a phosphor layer facing to the first major surface; an interconnect layer provided on the second major surface side and including a conductor and an insulator; and a light-blocking member provided on a side surface of the semiconductor layer and being opaque to light emitted from the light-emitting layer.

22. 发明授权

US07714236B2 Electric component 有权
标题翻译：电气部件
公开(公告)号：US07714236B2
公开(公告)日：2010-05-11
申请号：US12177238
申请日：2008-07-22
申请人： Michinobu Inoue , Susumu Obata
发明人： Michinobu Inoue , Susumu Obata
IPC分类号： H01L23/28
CPC分类号： H01G5/18 , B81B7/0041 , B81C1/00476 , B81C2203/0136 , B81C2203/0145 , H01H59/0009 , H01L23/057 , H01L2924/0002 , H01L2924/00
摘要： An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space.
摘要翻译：电气部件包括基板，设置在基板上的功能元件，设置在基板上以一定距离覆盖功能元件的第一密封体，第一密封体包括与形成在第一密封件主体和基底，以及设置在第一密封体上并构造成闭塞多个孔的第二密封体。这里，第一密封体和基板之间的边界在使内部空间变窄的方向上弯曲。

23. 发明申请

US20090025976A1 ELECTRIC COMPONENT 有权
标题翻译：电气部件
公开(公告)号：US20090025976A1
公开(公告)日：2009-01-29
申请号：US12177238
申请日：2008-07-22
申请人： Michinobu INOUE , Susumu Obata
发明人： Michinobu INOUE , Susumu Obata
IPC分类号： H01L23/02 , H01L23/08 , H01L23/28
CPC分类号： H01G5/18 , B81B7/0041 , B81C1/00476 , B81C2203/0136 , B81C2203/0145 , H01H59/0009 , H01L23/057 , H01L2924/0002 , H01L2924/00
摘要： An electric component includes a substrate, a function element provided on the substrate, a first sealing body provided on the substrate to cover the function element at a certain distance, the first sealing body including multiple apertures communicating with an internal space formed between the first sealing body and the substrate, and a second sealing body provided on the first sealing body and configured to occlude the multiple apertures. Here, a boundary between the first sealing body and the substrate is curved in a direction to narrow the internal space.
摘要翻译：电气部件包括基板，设置在基板上的功能元件，设置在基板上以一定距离覆盖功能元件的第一密封体，第一密封体包括与形成在第一密封件主体和基底，以及设置在第一密封体上并构造成闭塞多个孔的第二密封体。这里，第一密封体和基板之间的边界在使内部空间变窄的方向上弯曲。

24. 发明授权

US08476741B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08476741B2
公开(公告)日：2013-07-02
申请号：US13009212
申请日：2011-01-19
申请人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
发明人： Susumu Obata , Takahiro Sogou , Yusaku Asano , Takeshi Miyagi
IPC分类号： H01L23/58 , H01L21/31 , H01L21/4763
CPC分类号： H01L29/84 , H01L2224/11
摘要： According to one embodiment, a semiconductor device includes: a substrate; an organic insulating film provided on the substrate; an inorganic insulating film formed thinner than the organic insulating film on the organic insulating film; a hollow sealing structure that is formed on the inorganic insulating film, and seals a MEMS element in an inside while ensuring a space between the hollow sealing structure itself and the MEMS element; a through hole formed so as to penetrate the organic insulating film and the inorganic insulating film; and a conductive member that is filled into the through hole, and electrically connects the MEMS element and an electrode formed by being filled into the through hole.
摘要翻译：根据一个实施例，半导体器件包括：衬底; 设置在基板上的有机绝缘膜; 无机绝缘膜比有机绝缘膜上的有机绝缘膜薄; 形成在无机绝缘膜上的中空密封结构，并且在确保空心密封结构本身和MEMS元件之间的空间的同时将MEMS元件密封在内部; 形成为穿透有机绝缘膜和无机绝缘膜的通孔; 以及填充到通孔中的导电构件，并且将MEMS元件和由填充形成的电极电连接到通孔中。

25. 发明授权

US08436464B2 Hollow sealing structure and manufacturing method for hollow sealing structure 有权
标题翻译：中空密封结构的空心密封结构和制造方法
公开(公告)号：US08436464B2
公开(公告)日：2013-05-07
申请号：US13041562
申请日：2011-03-07
申请人： Susumu Obata , Tatsuya Ohguro
发明人： Susumu Obata , Tatsuya Ohguro
IPC分类号： H01L23/12
CPC分类号： B81C1/00293 , B81C2203/0136 , H01L21/565 , H01L23/315 , H01L2924/0002 , H01L2924/00
摘要： A manufacturing method for a hollow sealing structure, includes, a process for filling a recessed portion in a principal surface of a substrate with a first sacrificial layer, a process for forming a functional element portion on the principal surface of the substrate, a process for forming a second sacrificial layer on the functional element portion so as to be connected to a part of the first sacrificial layer, a process for forming a covering portion over respective surfaces of the first and second sacrificial layers, a process for circulating a fluid for sacrificial layer removal through an opening in the covering portion in contact with the first sacrificial layer, thereby removing the first and second sacrificial layers, and a process for closing the opening.
摘要翻译：一种中空密封结构体的制造方法，其特征在于，包括：利用第一牺牲层填充基板的主面的凹部的工序，在所述基板的主面上形成功能元件部的工序，在所述功能元件部分上形成第二牺牲层，以便连接到所述第一牺牲层的一部分;在所述第一和第二牺牲层的各个表面上形成覆盖部分的工艺，通过与第一牺牲层接触的覆盖部分中的开口去除层，从而去除第一和第二牺牲层以及关闭开口的过程。

26. 发明申请

US20110291148A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20110291148A1
公开(公告)日：2011-12-01
申请号：US12881428
申请日：2010-09-14
申请人： Yoshiaki Sugizaki , Susumu Obata
发明人： Yoshiaki Sugizaki , Susumu Obata
IPC分类号： H01L33/48 , H01L33/00
CPC分类号： H01L33/486 , H01L33/0079 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2224/16 , H05K3/3436 , H05K2201/10106
摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar, a resin layer and a conductive material. The conductive material is provided on a surface of the resin layer between the first metal pillar and the second metal pillar, and electrically connects the first metal pillar and the second metal pillar.
摘要翻译：根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱，树脂层和导电材料。导电材料设置在第一金属柱和第二金属柱之间的树脂层的表面上，并且电连接第一金属柱和第二金属柱。

27. 发明授权

US08866179B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08866179B2
公开(公告)日：2014-10-21
申请号：US12881428
申请日：2010-09-14
申请人： Yoshiaki Sugizaki , Susumu Obata
发明人： Yoshiaki Sugizaki , Susumu Obata
IPC分类号： H01L33/44 , H01L33/62 , H01L33/48 , H01L33/00 , H05K3/34 , H01L33/54
CPC分类号： H01L33/486 , H01L33/0079 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2224/16 , H05K3/3436 , H05K2201/10106
摘要： According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnection layer, a second interconnection layer, a first metal pillar, a second metal pillar, a resin layer and a conductive material. The conductive material is provided on a surface of the resin layer between the first metal pillar and the second metal pillar, and electrically connects the first metal pillar and the second metal pillar.
摘要翻译：根据一个实施例，半导体发光器件包括半导体层，第一电极，第二电极，绝缘层，第一互连层，第二互连层，第一金属柱，第二金属柱，树脂层和导电材料。导电材料设置在第一金属柱和第二金属柱之间的树脂层的表面上，并且电连接第一金属柱和第二金属柱。

28. 发明授权

US07972884B2 Micromechanical device and method of manufacturing micromechanical device 有权
标题翻译：微机械装置及其制造方法
公开(公告)号：US07972884B2
公开(公告)日：2011-07-05
申请号：US12399348
申请日：2009-03-06
申请人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
发明人： Susumu Obata , Michinobu Inoue , Takeshi Miyagi
IPC分类号： H01L21/00
CPC分类号： B81B3/0078 , B81B2201/016 , B81B2203/0109 , H01H1/50 , H01H3/60 , H01H59/0009 , Y10T29/49002
摘要： An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
摘要翻译：本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体，具有位于其间的中空部分的微机械。

29. 发明申请

US20110073889A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20110073889A1
公开(公告)日：2011-03-31
申请号：US12710829
申请日：2010-02-23
申请人： Yoshiaki Sugizaki , Akihiro Kojima , Susumu Obata
发明人： Yoshiaki Sugizaki , Akihiro Kojima , Susumu Obata
IPC分类号： H01L33/00
CPC分类号： H01L33/387 , H01L25/048 , H01L33/0079 , H01L33/0095 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/50 , H01L33/505 , H01L33/52 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： A semiconductor light-emitting device of the invention includes: a semiconductor layer including a light-emitting layer and having a first major surface and a second major surface opposite to the first major surface; a phosphor layer facing to the first major surface; an interconnect layer provided on the second major surface side and including a conductor and an insulator; and a light-blocking member provided on a side surface of the semiconductor layer and being opaque to light emitted from the light-emitting layer.
摘要翻译：本发明的半导体发光器件包括：包含发光层并具有与第一主表面相对的第一主表面和第二主表面的半导体层; 面向第一主表面的磷光体层; 设置在所述第二主表面侧并且包括导体和绝缘体的互连层; 以及设置在半导体层的侧表面上并且对从发光层发射的光不透明的遮光构件。

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