专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20120020026A1 MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION 有权
标题翻译：具有后组装平面化的微电子元件
公开(公告)号：US20120020026A1
公开(公告)日：2012-01-26
申请号：US12842587
申请日：2010-07-23
申请人： Vage Oganesian , Belgacem Haba , Craig Mitchell , Ilyas Mohammed , Piyush Savalia
发明人： Vage Oganesian , Belgacem Haba , Craig Mitchell , Ilyas Mohammed , Piyush Savalia
IPC分类号： H05K7/20 , H05K7/02 , H05K13/00
CPC分类号： H01L21/76819 , H01L21/76877 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/97 , H01L25/105 , H01L25/117 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/24227 , H01L2224/24247 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01L2224/97 , H01L2225/1023 , H01L2225/1029 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15331 , H01L2924/157 , H01L2924/15788 , H01L2924/18161 , Y10T29/49002 , H01L2224/81 , H01L2924/00 , H01L2224/83
摘要： A microelectronic unit includes a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can include a microelectronic element having a bottom surface adjacent the inner surface, a top surface remote from the bottom surface, and a plurality of contacts at the top surface. The microelectronic element can include terminals electrically connected with the contacts of the microelectronic element. The microelectronic unit can include a dielectric region contacting at least the top surface of the microelectronic element. The dielectric region can have a planar surface located coplanar with or above the front surface of the carrier structure. The terminals can be exposed at the surface of the dielectric region for interconnection with an external element.
摘要翻译：微电子单元包括具有前表面，远离前表面的后表面和在前表面具有开口的凹部和位于载体结构的前表面下方的内表面的载体结构。微电子单元可以包括具有邻近内表面的底表面，远离底表面的顶表面和在顶表面处的多个触点的微电子元件。微电子元件可以包括与微电子元件的触点电连接的端子。微电子单元可以包括至少与微电子元件的顶表面接触的电介质区域。电介质区域可以具有与载体结构的前表面共面或平行的平面。端子可以暴露在电介质区域的表面以与外部元件互连。

22. 发明申请

US20100116464A1 REVERSIBLE FLOW ELECTROHYDRODYNAMIC FLUID ACCELERATOR 失效
标题翻译：可逆流动电动液体加速器
公开(公告)号：US20100116464A1
公开(公告)日：2010-05-13
申请号：US12615909
申请日：2009-11-10
申请人： Nels Jewell-Larsen , Kenneth A. Honer , Matt Schwiebert , Hongyu Ran , Piyush Savalia , Yan Zhang
发明人： Nels Jewell-Larsen , Kenneth A. Honer , Matt Schwiebert , Hongyu Ran , Piyush Savalia , Yan Zhang
IPC分类号： F28F13/00 , H01J27/00 , F28F13/16
CPC分类号： H02N11/006 , F04B19/006 , F28F2250/08 , G06F1/203
摘要： Reversible flow may be provided in certain EHD device configurations that selectively energize corona discharge electrodes arranged to motivate flows in generally opposing directions. In some embodiments, a first set of one or more corona discharge electrodes is positioned, relative to a first array of collector electrode surfaces, to when energized, motivate flow in a first direction, while second set of one or more corona discharge electrodes is positioned, relative to a second array of collector electrode surfaces, to when energized, motivate flow in a second direction that opposes the first. In some embodiments, the first and second arrays of collector electrode surfaces are opposing surfaces of individual collector electrodes. In some embodiments, the first and second arrays of collector electrode surfaces are opposing surfaces of respective collector electrodes.
摘要翻译：可以在某些EHD器件配置中提供可逆流动，其选择性地激励布置成在大致相反的方向上激励流动的电晕放电电极。在一些实施例中，相对于集电极表面的第一阵列，第一组一个或多个电晕放电电极被定位成当被激励时，在第一方向上激励流动，同时定位第二组一个或多个电晕放电电极相对于集电极表面的第二阵列，当被激励时，在与第一方向相反的第二方向上激励流动。在一些实施例中，集电极表面的第一和第二阵列是各个集电极的相对表面。在一些实施例中，集电极表面的第一和第二阵列是各个集电极的相对表面。

23. 发明授权

US09099479B2 Carrier structures for microelectronic elements 有权
标题翻译：微电子元件的载体结构
公开(公告)号：US09099479B2
公开(公告)日：2015-08-04
申请号：US13618514
申请日：2012-09-14
申请人： Vage Oganesian , Belgacem Haba , Craig Mitchell , Ilyas Mohammed , Piyush Savalia
发明人： Vage Oganesian , Belgacem Haba , Craig Mitchell , Ilyas Mohammed , Piyush Savalia
IPC分类号： H05K1/18 , H01L23/538 , H01L23/00 , H01L25/10 , H01L25/00 , H01L25/16 , H01L23/13 , H01L23/31 , H01L23/498
CPC分类号： H01L21/76819 , H01L21/76877 , H01L23/13 , H01L23/3128 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/18 , H01L24/19 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/97 , H01L25/105 , H01L25/117 , H01L25/16 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/16235 , H01L2224/24227 , H01L2224/24247 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01L2224/97 , H01L2225/1023 , H01L2225/1029 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/1058 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01061 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15156 , H01L2924/15165 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/15331 , H01L2924/157 , H01L2924/15788 , H01L2924/18161 , Y10T29/49002 , H01L2224/81 , H01L2924/00 , H01L2224/83
摘要： A microelectronic unit can include a carrier structure having a front surface, a rear surface remote from the front surface, and a recess having an opening at the front surface and an inner surface located below the front surface of the carrier structure. The microelectronic unit can also include a microelectronic element having a top surface adjacent the inner surface, a bottom surface remote from the top surface, and a plurality of contacts at the top surface. The microelectronic unit can also include terminals electrically connected with the contacts of the microelectronic element. The terminals can be electrically insulated from the carrier structure. The microelectronic unit can also include a dielectric region contacting at least the bottom surface of the microelectronic element. The dielectric region can define a planar surface located coplanar with or above the front surface of the carrier structure.
摘要翻译：微电子单元可以包括具有前表面，远离前表面的后表面和在前表面具有开口的凹部和位于载体结构的前表面下方的内表面的载体结构。微电子单元还可以包括具有邻近内表面的顶表面，远离顶表面的底表面和在顶表面处的多个触点的微电子元件。微电子单元还可以包括与微电子元件的触点电连接的端子。端子可以与载体结构电绝缘。微电子单元还可以包括至少与微电子元件的底表面接触的电介质区域。电介质区域可以限定与载体结构的前表面共面或平行的平面。

24. 发明授权

US08975751B2 Vias in porous substrates 有权
标题翻译：多孔基材中的通孔
公开(公告)号：US08975751B2
公开(公告)日：2015-03-10
申请号：US13092495
申请日：2011-04-22
申请人： Ilyas Mohammed , Belgacem Haba , Cyprian Uzoh , Piyush Savalia
发明人： Ilyas Mohammed , Belgacem Haba , Cyprian Uzoh , Piyush Savalia
IPC分类号： H01L23/52 , H01L21/768 , H01L21/48 , H01L23/14 , H01L23/15 , H01L23/48 , H01L23/498
CPC分类号： H01L21/76877 , H01L21/486 , H01L21/76837 , H01L21/76898 , H01L23/147 , H01L23/15 , H01L23/481 , H01L23/49827 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
摘要： A microelectronic unit can include a substrate having front and rear surfaces and active semiconductor devices therein, the substrate having a plurality of openings arranged in a symmetric or asymmetric distribution across an area of the rear surface, first and second conductive vias connected to first and second pads exposed at the front surface, pluralities of first and second conductive interconnects extending within respective ones of the openings, and first and second conductive contacts exposed for interconnection with an external element. The plurality of first conductive interconnects can be separated from the plurality of second conductive interconnects by at least one of the plurality of openings, the at least one opening at least partially filled with an insulating material. The distribution of the openings can include at least m openings spaced apart in a first direction and n openings spaced apart in a second direction transverse to the first direction.
摘要翻译：微电子单元可以包括其中具有前表面和后表面的基板和其中的有源半导体器件，所述基板具有布置成在后表面的区域上的对称或不对称分布的多个开口，连接到第一和第二导电通孔的第一和第二导电通孔在前表面暴露的焊盘，在相应的一个开口内延伸的多个第一和第二导电互连，以及暴露以与外部元件互连的第一和第二导电触点。多个第一导电互连可以通过所述多个开口中的至少一个与所述多个第二导电互连部分开，所述至少一个开口至少部分地填充有绝缘材料。开口的分布可以包括在第一方向上间隔开的至少m个开口和在横向于第一方向的第二方向上间隔开的n个开口。

25. 发明授权

US08796135B2 Microelectronic elements with rear contacts connected with via first or via middle structures 有权
标题翻译：具有后触点的微电子元件通过第一或中间结构连接
公开(公告)号：US08796135B2
公开(公告)日：2014-08-05
申请号：US12842651
申请日：2010-07-23
申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Piyush Savalia
发明人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Piyush Savalia
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/16 , H01L25/0657 , H01L2224/02372 , H01L2224/02375 , H01L2224/02377 , H01L2224/0401 , H01L2224/05548 , H01L2224/06166 , H01L2224/06181 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/81801 , H01L2224/8182 , H01L2224/8185 , H01L2224/94 , H01L2924/014 , H01L2924/00014 , H01L2224/03 , H01L2224/81
摘要： A microelectronic unit includes a microelectronic element, e.g., an integrated circuit chip, having a semiconductor region of monocrystalline form. The semiconductor region has a front surface extending in a first direction, an active circuit element adjacent the front surface, a rear surface remote from the front surface, and a conductive via which extends towards the rear surface. The conductive via can be insulated from the semiconductor region by an inorganic dielectric layer. An opening can extend from the rear surface partially through a thickness of the semiconductor region, with the opening and the conductive via having respective widths in the first direction. The width of the opening may be greater than the width of the conductive via where the opening meets the conductive via. A rear contact can be electrically connected to the conductive via and exposed at the rear surface for electrical connection with an external circuit element, such as another like microelectronic unit, a microelectronic package, or a circuit panel.
摘要翻译：微电子单元包括具有单晶形式的半导体区域的微电子元件，例如集成电路芯片。半导体区域具有在第一方向上延伸的前表面，邻近前表面的有源电路元件，远离前表面的后表面和朝向后表面延伸的导电通孔。导电通孔可以通过无机介电层与半导体区域绝缘。开口可以从后表面部分地延伸穿过半导体区域的厚度，其中开口和导电通孔在第一方向上具有相应的宽度。开口的宽度可以大于导电通孔的宽度，其中开口与导电通孔相接。后触点可以电连接到导电通孔并在后表面暴露以与外部电路元件（例如另一个类似的微电子单元，微电子封装或电路板）电连接。

26. 发明授权

US08791575B2 Microelectronic elements having metallic pads overlying vias 有权
标题翻译：具有覆盖通孔的金属焊盘的微电子元件
公开(公告)号：US08791575B2
公开(公告)日：2014-07-29
申请号：US12842717
申请日：2010-07-23
申请人： Vage Oganesian , Ilyas Mohammed , Craig Mitchell , Belgacem Haba , Piyush Savalia
发明人： Vage Oganesian , Ilyas Mohammed , Craig Mitchell , Belgacem Haba , Piyush Savalia
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/3114 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L2224/0401 , H01L2224/0557 , H01L2224/05571 , H01L2224/06181 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/1329 , H01L2224/133 , H01L2224/16146 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/00014 , H01L2924/0002 , H01L2924/01029 , H01L2924/01322 , H01L2924/07811 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/00012 , H01L2224/03 , H01L2924/00 , H01L2924/014 , H01L2224/05552
摘要： A microelectronic unit, an interconnection substrate, and a method of fabricating a microelectronic unit are disclosed. A microelectronic unit can include a semiconductor element having a plurality of active semiconductor devices therein, the semiconductor element having a first opening extending from a rear surface partially through the semiconductor element towards a front surface and at least one second opening, and a dielectric region overlying a surface of the semiconductor element in the first opening. The microelectronic unit can include at least one conductive interconnect electrically connected to a respective conductive via and extending away therefrom within the aperture. In a particular embodiment, at least one conductive interconnect can extend within the first opening and at least one second opening, the conductive interconnect being electrically connected with a conductive pad having a top surface exposed at the front surface of the semiconductor element.
摘要翻译：公开了微电子单元，互连基板和制造微电子单元的方法。微电子单元可以包括其中具有多个有源半导体器件的半导体元件，该半导体元件具有从后表面部分延伸穿过半导体元件朝向前表面和至少一个第二开口的第一开口，以及覆盖第一开口中的半导体元件的表面。微电子单元可以包括电连接到相应的导电通孔并在孔内从其延伸的至少一个导电互连。在特定实施例中，至少一个导电互连可以在第一开口内和至少一个第二开口内延伸，导电互连件与具有暴露在半导体元件的前表面处的顶表面的导电焊盘电连接。

27. 发明授权

US08697569B2 Non-lithographic formation of three-dimensional conductive elements 有权
标题翻译：三维导电元件的非平版印刷法
公开(公告)号：US08697569B2
公开(公告)日：2014-04-15
申请号：US12842669
申请日：2010-07-23
申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Piyush Savalia
发明人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Piyush Savalia
IPC分类号： H01L21/4763 , H01L23/48 , H01L21/70
CPC分类号： H01L21/76879 , H01L21/76802 , H01L21/76898 , H01L23/481 , H01L23/4985 , H01L23/5226 , H01L24/06 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A method of forming a conductive element on a substrate and the resulting assembly are provided. The method includes forming a groove in a sacrificial layer overlying a dielectric region disposed on a substrate. The groove preferably extends along a sloped surface of the substrate. The sacrificial layer is preferably removed by a non-photolithographic method, such as ablating with a laser, mechanical milling, or sandblasting. A conductive element is formed in the groove. The grooves may be formed. The grooves and conductive elements may be formed along any surface of the substrate, including within trenches and vias formed therein, and may connect to conductive pads on the front and/or rear surface of the substrate. The conductive elements are preferably formed by plating and may or may not conform to the surface of the substrate.
摘要翻译：提供了在基板上形成导电元件的方法和所得到的组件。该方法包括在覆盖设置在基板上的电介质区域上的牺牲层中形成凹槽。槽优选地沿着衬底的倾斜表面延伸。牺牲层优选通过非光刻方法去除，例如用激光烧蚀，机械研磨或喷砂。在沟槽中形成导电元件。可以形成凹槽。凹槽和导电元件可以沿着衬底的任何表面形成，包括在其中形成的沟槽和通孔内，并且可以连接到衬底的前表面和/或后表面上的导电焊盘。导电元件优选通过电镀形成，并且可以或可以不与基板的表面一致。

28. 发明授权

US08637968B2 Stacked microelectronic assembly having interposer connecting active chips 有权
标题翻译：具有插入器的堆叠的微电子组件连接有源芯片
公开(公告)号：US08637968B2
公开(公告)日：2014-01-28
申请号：US12958866
申请日：2010-12-02
申请人： Belgacem Haba , Vage Oganesian , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
发明人： Belgacem Haba , Vage Oganesian , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
IPC分类号： H01L23/48 , H01L23/02 , H01L29/40
CPC分类号： H01L25/0657 , H01L21/486 , H01L21/76898 , H01L23/36 , H01L23/481 , H01L23/49822 , H01L23/49827 , H01L25/16 , H01L2224/16225 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06572 , H01L2924/15311
摘要： A microelectronic assembly can include first and second microelectronic elements each embodying active semiconductor devices adjacent a front surface thereof, and having an electrically conductive pad exposed at the respective front surface. An interposer of material having a CTE less than 10 ppm/° C. has first and second surfaces attached to the front surfaces of the respective first and second microelectronic elements, the interposer having a second conductive element extending within an opening in the interposer. First and second conductive elements extend within openings extending from the rear surface of a respective microelectronic element of the first and second microelectronic elements towards the front surface of the respective microelectronic element. In one example, one or more of the first or second conductive elements extends through the respective first or second pad, and the conductive elements contact the exposed portions of the second conductive element to provide electrical connection therewith.
摘要翻译：微电子组件可以包括第一和第二微电子元件，每个微电子元件各自体现邻近其前表面的有源半导体器件，并且具有在相应的前表面处暴露的导电焊盘。具有小于10ppm /℃的CTE的材料的插入件具有附接到相应的第一和第二微电子元件的前表面的第一和第二表面，所述插入件具有在插入器的开口内延伸的第二导电元件。第一和第二导电元件在从第一和第二微电子元件的相应微电子元件的后表面朝向相应微电子元件的前表面延伸的开口内延伸。在一个示例中，第一或第二导电元件中的一个或多个延伸穿过相应的第一或第二焊盘，并且导电元件接触第二导电元件的暴露部分以提供与其的电连接。

29. 发明授权

US08598695B2 Active chip on carrier or laminated chip having microelectronic element embedded therein 有权
标题翻译：具有嵌入其中的微电子元件的载体或层叠芯片上的有源芯片
公开(公告)号：US08598695B2
公开(公告)日：2013-12-03
申请号：US12842692
申请日：2010-07-23
申请人： Vage Oganesian , Ilyas Mohammed , Craig Mitchell , Belgacem Haba , Piyush Savalia
发明人： Vage Oganesian , Ilyas Mohammed , Craig Mitchell , Belgacem Haba , Piyush Savalia
IPC分类号： H01L23/02
CPC分类号： H01L23/5384 , H01L23/3114 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L27/14621 , H01L27/14627 , H01L27/14645 , H01L29/0657 , H01L2224/0237 , H01L2224/0401 , H01L2224/05552 , H01L2224/0557 , H01L2224/06181 , H01L2224/13024 , H01L2224/16145 , H01L2224/16225 , H01L2224/1703 , H01L2224/32145 , H01L2224/73204 , H01L2224/81805 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06544 , H01L2225/06555 , H01L2225/1058 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/18161 , H01L2224/81 , H01L2924/00012 , H01L2924/00
摘要： A structure including a first semiconductor chip with front and rear surfaces and a cavity in the rear surface. A second semiconductor chip is mounted within the cavity. The first chip may have vias extending from the cavity to the front surface and via conductors within these vias serving to connect the additional microelectronic element to the active elements of the first chip. The structure may have a volume comparable to that of the first chip alone and yet provide the functionality of a multi-chip assembly. A composite chip incorporating a body and a layer of semiconductor material mounted on a front surface of the body similarly may have a cavity extending into the body from the rear surface and may have an additional microelectronic element mounted in such cavity.
摘要翻译：一种结构，包括具有前表面和后表面的第一半导体芯片以及后表面中的空腔。第二个半导体芯片安装在腔内。第一芯片可以具有从空腔延伸到前表面的通孔，以及用于将附加的微电子元件连接到第一芯片的有源元件的这些通孔内的导体。该结构可以具有与第一芯片单独的体积相当的体积，并且提供多芯片组件的功能。安装在主体的前表面上的主体和半导体材料层的复合芯片类似地可以具有从后表面延伸到主体中的空腔，并且可以具有安装在该空腔中的附加的微电子元件。

30. 发明授权

US08411435B2 Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode 失效
标题翻译：具有作为集电极的热传递表面的电动液流体加速器
公开(公告)号：US08411435B2
公开(公告)日：2013-04-02
申请号：US12615900
申请日：2009-11-10
申请人： Nels Jewell-Larsen , Kenneth A. Honer , Matt Schwiebert , Hongyu Ran , Piyush Savalia , Yan Zhang
发明人： Nels Jewell-Larsen , Kenneth A. Honer , Matt Schwiebert , Hongyu Ran , Piyush Savalia , Yan Zhang
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H02N11/006 , F04B19/006 , F28F2250/08 , G06F1/203
摘要： In thermal management systems that employ EHD devices to motivate flow of air between ventilated boundary portions of an enclosure, it can be desirable to have some heat transfer surfaces participate in electrohydrodynamic acceleration of fluid flow while providing additional heat transfer surfaces that may not. In some embodiments, both collector electrodes and additional heat transfer surfaces are thermally coupled into a heat transfer path. Collector electrodes then contribute both to flow of cooling air and to heat transfer to the air flow so motivated. The collector electrodes and additional heat transfer surfaces may be parts of a unitary, or thermally coupled, structure that is introduced into a flow path at multiple positions therealong. In some embodiments, the collector electrodes and additional heat transfer surfaces may be proximate each other along the flow path. In some embodiments, the collector electrodes and additional heat transfer surfaces may be separate structures.
摘要翻译：在使用EHD装置来激励外壳通气边界部分之间的空气流动的热管理系统中，可能希望具有一些传热表面参与流体流动的电流动力学加速，同时提供可能不会的额外的传热表面。在一些实施例中，收集器电极和附加传热表面都热耦合到传热路径中。然后，收集器电极对冷却空气的流动进行贡献，并将热量传递给如此积极的气流。集电极和附加传热表面可以是整体或热耦合的结构的部分，其被引入到沿着多个位置的流动路径中。在一些实施例中，集电极和附加传热表面可以沿着流动路径彼此靠近。在一些实施例中，集电极和附加传热表面可以是分离的结构。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式