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21. 发明申请

US20080009087A1 Miniature optical element for wireless bonding in an electronic instrument 有权
标题翻译：微型光学元件，用于电子仪器中的无线键合
公开(公告)号：US20080009087A1
公开(公告)日：2008-01-10
申请号：US11896708
申请日：2007-09-05
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： H01L21/00
CPC分类号： H01L27/14683 , H01L21/76898 , H01L23/481 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L31/18 , H01L33/382 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01013 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/16195 , H01L2924/3025 , H01L2933/0016 , Y10S257/911 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
摘要翻译：一种制造光学元件的方法，包括以下步骤：在具有光学部分和电连接到光学部分的电极的半导体元件中形成通孔; 以及形成从其上形成有所述光学部分的所述半导体元件的第一表面延伸穿过所述通孔的内壁表面到与所述第一表面相对的第二表面的导电层。

22. 发明申请

US20060292769A1 MULTILAYERED STRUCTURE FORMING METHOD 审中-公开
标题翻译：多层结构形成方法
公开(公告)号：US20060292769A1
公开(公告)日：2006-12-28
申请号：US11425762
申请日：2006-06-22
申请人： Kenji Wada , Tsuyoshi Shintate
发明人： Kenji Wada , Tsuyoshi Shintate
IPC分类号： H01L21/338
CPC分类号： H05K3/4664 , B41M3/006 , B41M3/008 , H05K3/125 , H05K3/4647 , H05K2201/09781 , H05K2201/09881 , H05K2203/013 , H05K2203/1476
摘要： A multilayered structure forming method includes disposing a dummy post on a first insulating pattern as a first inkjet process, disposing a second insulating pattern on the first insulating pattern as a second inkjet process so as to allow the second insulating pattern to surround a side surface of the dummy post, and disposing a first conductive pattern on the second insulating pattern a third inkjet process so as to connect the first conductive pattern to the dummy post. In this method, the first inkjet process includes a process for ejecting a functional liquid containing a first conductive material having high adhesiveness to the first conductive pattern onto the first insulating pattern.
摘要翻译：多层结构形成方法包括将第一绝缘图案上的虚拟柱设置为第一喷墨处理，将第二绝缘图案设置在第一绝缘图案上作为第二喷墨处理，以使第二绝缘图案包围第二绝缘图案的侧表面所述虚拟柱，并且在所述第二绝缘图案上设置第一导电图案以进行第三喷墨处理，以将所述第一导电图案连接到所述虚拟柱。在该方法中，第一喷墨处理包括将含有第一导电图案的具有高粘附性的第一导电材料的功能液喷射到第一绝缘图案上的处理。

23. 发明申请

US20060240664A1 Method of manufacturing multi-layered substrate 审中-公开
标题翻译：制造多层基板的方法
公开(公告)号：US20060240664A1
公开(公告)日：2006-10-26
申请号：US11396255
申请日：2006-03-31
申请人： Kenji Wada , Haruki Ito , Hideo Imai
发明人： Kenji Wada , Haruki Ito , Hideo Imai
IPC分类号： H01L21/4763
CPC分类号： H05K1/185 , H01L23/5389 , H01L24/24 , H01L24/82 , H01L2224/16225 , H01L2224/24011 , H01L2224/24137 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/73204 , H01L2224/76155 , H01L2224/82102 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K3/125 , H05K3/4664 , H05K2203/013 , H01L2924/00
摘要： A method of manufacturing a multi-layered substrate includes providing an electronic component on a surface of a substrate so that a terminal of the electronic component faces upward. The method also includes providing a first insulation pattern on the surface so as to fill a step generated due to a thickness of the electronic component.
摘要翻译：制造多层基板的方法包括在基板的表面上设置电子部件，使得电子部件的端子朝向上方。该方法还包括在表面上提供第一绝缘图案，以便填充由于电子部件的厚度而产生的台阶。

24. 发明授权

US07033935B2 Semiconductor device and method for manufacturing the same 失效
公开(公告)号：US07033935B2
公开(公告)日：2006-04-25
申请号：US10721331
申请日：2003-11-26
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： H01L21/44 , H01L21/4763
CPC分类号： H01L24/10 , H01L23/481 , H01L24/13 , H01L24/48 , H01L25/0657 , H01L2223/54453 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2224/16145 , H01L2224/16225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/85399 , H01L2225/06506 , H01L2225/06513 , H01L2225/06541 , H01L2225/06582 , H01L2225/06586 , H01L2225/06596 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： The invention simplifies the manufacturing processes and increases the yield. A semiconductor wafer equipped with a plurality of semiconductor chip forming sections is prepared. An electrical characteristic examination is conducted for each of the semiconductor chip forming sections to determine good product sections or bad product sections. At least another segmented semiconductor chip is electrically connected to each of the semiconductor chip forming sections that are determined to be good product sections.

25. 发明授权

US06962865B2 Semiconductor device, method of fabricating the same, stack-type semiconductor device, circuit board and electronic instrument 有权
标题翻译：半导体器件及其制造方法，堆叠型半导体器件，电路板和电子仪器
公开(公告)号：US06962865B2
公开(公告)日：2005-11-08
申请号：US10768168
申请日：2004-02-02
申请人： Terunao Hanaoka , Kenji Wada
发明人： Terunao Hanaoka , Kenji Wada
IPC分类号： H01L23/52 , H01L21/3205 , H01L21/60 , H01L21/768 , H01L23/12 , H01L23/31 , H01L23/48 , H01L25/065 , H01L25/07 , H01L25/18 , H01L21/4763
CPC分类号： H01L24/13 , H01L21/76898 , H01L23/3107 , H01L23/481 , H01L24/11 , H01L24/16 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/0231 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2224/13155 , H01L2224/1319 , H01L2224/16237 , H01L2225/06513 , H01L2225/06541 , H01L2225/06586 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013
摘要： A method of fabricating a semiconductor device including: a first step of forming a through hole in a semiconductor element having electrodes on a first surface; and a second step of forming a conductive layer which is electrically connected to the electrodes and is provided from the first surface through an inner wall of the through hole to a second surface of the semiconductor element which is opposite to the first surface. The conductive layer is formed to have connecting portions on the first and second surfaces so that a distance between at least two electrodes among the electrodes is different from a distance between the connecting portions on at least one of the first and second surfaces, in the second step.
摘要翻译：一种制造半导体器件的方法，包括：在第一表面上具有电极的半导体元件中形成通孔的第一步骤; 以及第二步骤，形成电连接到所述电极的导电层，并且从所述第一表面通过所述通孔的内壁设置到所述半导体元件的与所述第一表面相对的第二表面。导电层形成为在第一和第二表面上具有连接部分，使得电极中的至少两个电极之间的距离不同于第一和第二表面中的至少一个上的连接部分之间的距离，第二步。

26. 发明申请

US20050118984A1 Receiving, displaying, and recording apparatus 审中-公开
标题翻译：接收，显示和记录设备
公开(公告)号：US20050118984A1
公开(公告)日：2005-06-02
申请号：US10929761
申请日：2004-08-31
申请人： Hitoshi Akiyama , Kenji Wada
发明人： Hitoshi Akiyama , Kenji Wada
IPC分类号： H04B1/16 , H04H20/59 , H04H20/76 , H04H60/13 , H04M11/04 , H04N5/44
CPC分类号： H04H60/13 , H04H20/59 , H04H20/76 , H04M11/04 , H04N21/4263 , H04N21/4334 , H04N21/44008 , H04N21/814 , H04N21/8146
摘要： When an emergency broadcast is made, the emergency broadcast channel must be forcedly switch-selected. If an emergency broadcast is detected while a recorder is recording a received signal, the received signal output to the recorder is forcedly switched to the emergency broadcast channel; and the channel originally intended to be recorded becomes unrecordable. To avoid this recording of the emergency broadcast, a plurality of receiving systems are each formed of a tuner, demodulator, demultiplexer, and decoder. When an emergency broadcast is detected, the receiving system receiving a signal for recording continues the tuning and demodulation as before; and another receiving system tunes in to the emergency broadcast channel for displaying the channel.
摘要翻译：当进行紧急广播时，紧急广播频道必须被强制切换。如果在记录器记录接收到的信号时检测到紧急广播，则输出到记录器的接收信号被强制切换到紧急广播信道; 并且最初要被记录的通道变得不可记录。为了避免紧急广播的这种记录，多个接收系统各自由调谐器，解调器，解复用器和解码器形成。当检测到紧急广播时，接收用于记录的信号的接收系统如前所述继续进行调谐和解调; 另一个接收系统调谐到紧急广播频道以显示频道。

27. 发明授权

US06787692B2 Solar cell substrate, thin-film solar cell, and multi-junction thin-film solar cell 有权
标题翻译：太阳能电池基板，薄膜太阳能电池和多结薄膜太阳能电池
公开(公告)号：US06787692B2
公开(公告)日：2004-09-07
申请号：US09984905
申请日：2001-10-31
申请人： Kenji Wada , Yoshiyuki Nasuno , Michio Kondo , Akihisa Matsuda
发明人： Kenji Wada , Yoshiyuki Nasuno , Michio Kondo , Akihisa Matsuda
IPC分类号： H01L31052
CPC分类号： H01L31/076 , H01L31/02366 , H01L31/056 , H01L31/077 , H01L31/182 , H01L31/1884 , Y02E10/52 , Y02E10/546 , Y02E10/548 , Y02P70/521 , Y10T428/26
摘要： A solar cell substrate has irregularities on a surface which is in contact with a photo-electric conversion layer, and light is incident on the side of the irregularities. The height of the irregularities is set so that the root mean square height is in a range of 15 nm to 600 nm, and tan &thgr; is in a range of 0.10 to 0.30, where &thgr; is the angle of incline of the surface of the irregularities with respect to an average line of the irregularities. Light incident on the irregularities is scattered at the interface. This increases the optical path length and thus the quantity of light absorbed in the photo-electric conversion layer, resulting in improved efficiency. Additionally, the photo-electric conversion layer can be made thinner reducing deposit time and manufacturing cost. Further, collision of crystals is not incurred, thus preventing deterioration of photo-electric conversion efficiency which is caused by defects.
摘要翻译：太阳能电池基板在与光电转换层接触的表面上具有不规则性，并且光入射到不规则部分的一侧。凹凸的高度被设定为使得均方根高度在15nm至600nm的范围内，并且tanθ在0.10至0.30的范围内，其中θ是不规则部分的表面的倾斜角相对于平均线的违规行为。光线不规则的事件分散在界面处。这增加了光路长度，从而增加了光电转换层中吸收的光量，从而提高了效率。另外，可以使光电转换层更薄，减少沉积时间和制造成本。此外，不会发生晶体碰撞，从而防止由缺陷引起的光电转换效率的劣化。

28. 发明授权

US06287723B1 Alkaline secondary battery having an anode comprising a non ionic polymer binder 失效
标题翻译：具有包含非离子聚合物粘合剂的阳极的碱性二次电池
公开(公告)号：US06287723B1
公开(公告)日：2001-09-11
申请号：US09124896
申请日：1998-07-30
申请人： Koichiro Maeda , Toshihiro Inoue , Kenji Wada , Hidekazu Haneda , Haruhisa Yamamoto
发明人： Koichiro Maeda , Toshihiro Inoue , Kenji Wada , Hidekazu Haneda , Haruhisa Yamamoto
IPC分类号： H01M604
CPC分类号： H01M4/621 , H01M10/24
摘要： An alkaline secondary battery comprising an electrolyte such as aqueous solution of potassium hydroxide, at least one cathode electrode, at least one anode electrode having an anode active material layer, and a separator such as non-woven fabric between the anode electrode and the cathode electrode, in which the anode active material layer containing an anode active material such as a hydridable alloy or a cadmium alloy, and an anode binder which includes a nonionic polymer produced by emulsion polymerization of a nonionic monomer in the presence of a nonionic surfactant, and in which the electrolyte essentially surrounds the cathode electrode and the anode electrode.
摘要翻译：一种碱性二次电池，包括电解质如氢氧化钾水溶液，至少一个阴极电极，至少一个具有负极活性物质层的阳极电极和在阳极电极和阴极电极之间的诸如无纺布之类的隔膜，其中含有负极活性物质如可合金或镉合金的负极活性物质层和包含非离子聚合物的非极性聚合物的阳极粘合剂，其通过在非离子表面活性剂的存在下通过非离子单体的乳液聚合制备，电解质基本上围绕阴极电极和阳极电极。

29. 发明授权

US4039355A Aluminum alloy shapes 失效
标题翻译：铝合金形状
公开(公告)号：US4039355A
公开(公告)日：1977-08-02
申请号：US550223
申请日：1975-02-18
申请人： Toshiro Takahashi , Toshihiro Nagano , Kenji Wada , Masaru Kikuchi
发明人： Toshiro Takahashi , Toshihiro Nagano , Kenji Wada , Masaru Kikuchi
IPC分类号： C22F1/05 , C22C21/02 , C22C21/06 , C22C21/08 , C22F1/00
CPC分类号： C22C21/08 , Y10T428/31935
摘要： An aluminum alloy consising essentially of 0.65 to 0.75% by weight of magnesium and 0.50 to 0.60% by weight of silicon or 0.47 to 0.57% by weight of magnesium and 0.75 to 0.85% by weight of silicon, 0.15% to 0.25% by weight of iron, less than 0.05% of an impurity selected from the group consisting of copper, manganese, zinc, chromium, and titanium and the balance aluminum, the aluminum alloy being subjected to aging treatment at a temperature below 200.degree. C for 20 to 50 minutes to obtain 0.2% proof stress larger than 11 kg/mm.sup.2, ultimate tensile strength larger than 20 kg/mm.sup.2 and elongation more than 8%. Aluminum alloy shapes are formed of the above aluminum alloy by extrusion forming of the aluminum alloy to obtain an extrusion, coating a film on the surface of the extrusion with a water-soluble paint after forming thereon a ground film, heating the extrusion at a temperature below 200.degree. C for 20 to 50 minutes to effect printing and hardening of the coated film and age hardening of the extrusion at the same time.
摘要翻译：一种铝合金基本上占0.65至0.75重量％的镁和0.50-0.60重量％的硅或0.47至0.57重量％的镁和0.75至0.85重量％的硅，0.15重量％至0.25重量％的硅，铁，小于0.05％的选自铜，锰，锌，铬和钛的杂质，余量为铝，铝合金在200℃以下进行20-50分钟的时效处理获得大于11kg / mm2的0.2％屈服应力，极限抗拉强度大于20kg / mm2，伸长率大于8％。铝合金的形状由上述铝合金形成，通过铝合金的挤出成型得到挤出，在其上成型后用水溶性涂料在挤压成形表面上涂覆膜，在该温度下加热挤出在200℃以下20〜50分钟，同时进行涂膜的印刷硬化和挤出的时效硬化。

30. 发明授权

US08877969B2 Photosensitive composition, compound for use in the photosensitive composition and pattern forming method using the photosensitive composition 有权
标题翻译：感光组合物，用于感光组合物的化合物和使用感光组合物的图案形成方法
公开(公告)号：US08877969B2
公开(公告)日：2014-11-04
申请号：US12759549
申请日：2010-04-13
申请人： Kenji Wada
发明人： Kenji Wada
IPC分类号： C07C311/48 , C07C311/51 , C07C233/91 , C07C233/92 , C07D323/00 , C07D295/033 , C07D233/64 , C07D401/04 , C07D211/58 , C07D213/82 , C07D211/46 , C07D333/46 , G03F7/038 , C07D211/22 , G03F7/039 , C07D295/26 , G03F7/004
CPC分类号： C07C311/48 , C07D211/22 , C07D211/46 , C07D211/58 , C07D213/82 , C07D233/64 , C07D295/033 , C07D295/18 , C07D295/26 , C07D323/00 , C07D333/46 , C07D401/04 , G03F7/0045 , G03F7/0046 , G03F7/0382 , G03F7/0392
摘要： A photosensitive composition comprising: (A) a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation, a pattern forming method using the photosensitive composition, and a compound capable of generating a compound having a specific structure upon irradiation with actinic rays or radiation.
摘要翻译：一种光敏组合物，其包含：（A）能够在用光化射线或辐射照射时产生具有特定结构的化合物的化合物，使用该感光性组合物的图案形成方法和能够在照射时产生具有特定结构的化合物的化合物与光化射线或辐射。

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