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21. 发明授权

US08603857B2 Thin film transistor fabricating method 失效
标题翻译：薄膜晶体管制造方法
公开(公告)号：US08603857B2
公开(公告)日：2013-12-10
申请号：US13308548
申请日：2011-12-01
申请人： Jian-Shihn Tsang
发明人： Jian-Shihn Tsang
IPC分类号： H01L21/34
CPC分类号： H01L29/7869
摘要： A thin film transistor fabricating method is disclosed. The thin film transistor fabricating method comprises providing a substrate; forming an oxide semiconductor layer on an upper surface of the substrate; forming a gate insulating layer on an upper surface of the oxide semiconductor layer; masking a portion of the oxide semiconductor layer with the gate insulating layer; irradiating the oxide semiconductor layer with irradiating light having photon energy less than a band gap of the oxide semiconductor layer; forming a drain region and a source region at lateral portions of the oxide semiconductor layer exposed to the irradiating light, and forming a channel region in the portion of the oxide semiconductor layer masked by the gate insulating layer; and forming a gate electrode on an upper surface of the gate insulating layer.
摘要翻译：公开了薄膜晶体管制造方法。薄膜晶体管的制造方法包括提供基板; 在所述基板的上表面上形成氧化物半导体层; 在所述氧化物半导体层的上表面上形成栅极绝缘层; 用所述栅极绝缘层掩蔽所述氧化物半导体层的一部分; 用具有小于氧化物半导体层的带隙的光子能量的照射光照射氧化物半导体层; 在暴露于所述照射光的所述氧化物半导体层的横向部分处形成漏极区域和源极区域，并且在由所述栅极绝缘层掩蔽的所述氧化物半导体层的所述部分中形成沟道区域; 以及在所述栅极绝缘层的上表面上形成栅电极。

22. 发明授权

US08384112B2 Light emitting chip 失效
标题翻译：发光芯片
公开(公告)号：US08384112B2
公开(公告)日：2013-02-26
申请号：US13283610
申请日：2011-10-28
申请人： Jian-Shihn Tsang
发明人： Jian-Shihn Tsang
IPC分类号： H01L33/00
CPC分类号： H01L33/46 , H01L33/025 , H01L33/382 , H01L33/42 , H01L2933/0016
摘要： A light emitting chip includes a substrate, a reflective layer, a light emitting structure and a first electrode having a base formed between the reflective layer and the substrate. The light emitting structure includes a first semiconductor layer, an active layer and a second semiconductor layer. The first electrode further includes a connecting section extending upwardly from the base. An electrically insulating ion region is defined in the light emitting structure and extends from an upper surface of the base to the first semiconductor layer. A receiving groove is defined in the ion region and extends upwardly from the upper surface of the base to the first semiconductor layer. The connecting section is positioned in the receiving groove and electrically connects with the first semiconductor layer.
摘要翻译：发光芯片包括基板，反射层，发光结构以及在反射层和基板之间形成有基底的第一电极。发光结构包括第一半导体层，有源层和第二半导体层。第一电极还包括从基座向上延伸的连接部分。在发光结构中限定电绝缘的离子区，并从基底的上表面延伸到第一半导体层。接收槽限定在离子区域中，并从基底的上表面向上延伸到第一半导体层。连接部位于接收槽内，与第一半导体层电连接。

23. 发明授权

US08328380B2 Light module for LCD backlight module 有权
标题翻译：用于LCD背光模块的灯模块
公开(公告)号：US08328380B2
公开(公告)日：2012-12-11
申请号：US13370318
申请日：2012-02-10
申请人： Irene Chen , Jian-Shihn Tsang
发明人： Irene Chen , Jian-Shihn Tsang
IPC分类号： G02F1/13357
CPC分类号： G02F1/133603 , H01L33/54
摘要： A light module of an LCD backlight module includes a circuit board and a plurality of light-emitting diodes (LEDs) arranged on the circuit board. Each of the LEDs has a wide far-field pattern and is without a reflector, and each of the LEDs includes at least one LED chip and a molding unit packaging the LED chip. The LED chip is electrically connected to the circuit board and is also suitable for backlighting use. When a light-emitting angle of each of the LEDs is at 120 degrees, a light intensity thereof is still more than 50% of the intensity at frontage.
摘要翻译： LCD背光模块的光模块包括布置在电路板上的电路板和多个发光二极管（LED）。每个LED具有宽的远场图案，并且没有反射器，并且每个LED包括至少一个LED芯片和封装LED芯片的模制单元。 LED芯片电连接到电路板，并且也适用于背光使用。当每个LED的发光角度为120度时，其光强度仍然大于正面强度的50％。

24. 发明授权

US08269231B2 Light emitting diode module providing stable color temperature 失效
标题翻译：发光二极管模块提供稳定的色温
公开(公告)号：US08269231B2
公开(公告)日：2012-09-18
申请号：US13074021
申请日：2011-03-29
申请人： Jian-Shihn Tsang
发明人： Jian-Shihn Tsang
IPC分类号： H01L29/00 , H01L33/00 , H01L21/66 , H01L21/00
CPC分类号： H05B33/0857 , H05B33/0869
摘要： A light emitting diode module providing stable color temperature includes a plurality of light emitting diodes, at least one color sensor and a controller. The plurality of light emitting diodes can emit light with different wavelengths. The light emitting diode module providing stable color temperature includes a reflection region at the path of the light emitting from half peak angle of each light emitting diode. The color sensor detects the light having different wavelengths reflected from the reflection region. The controller adjusts driving currents of the light emitting diodes according to the luminous intensities of the light of the light emitting diodes reflected by the reflection region and detected by the color sensor.
摘要翻译：提供稳定色温的发光二极管模块包括多个发光二极管，至少一个颜色传感器和控制器。多个发光二极管可发射不同波长的光。提供稳定色温的发光二极管模块包括在每个发光二极管的半峰角发光的路径处的反射区域。颜色传感器检测从反射区域反射的具有不同波长的光。控制器根据由反射区域反射并由彩色传感器检测的发光二极管的光的发光强度来调节发光二极管的驱动电流。

25. 发明授权

US08253147B2 Light emitting chip and method for manufacturing the same 失效
标题翻译：发光芯片及其制造方法
公开(公告)号：US08253147B2
公开(公告)日：2012-08-28
申请号：US13029128
申请日：2011-02-17
申请人： Jian-Shihn Tsang
发明人： Jian-Shihn Tsang
IPC分类号： H01L33/00 , H01L33/12
CPC分类号： H01L33/007 , H01L21/0237 , H01L21/02458 , H01L21/0254 , H01L21/0262 , H01L21/02639 , H01L21/02645 , H01L21/0265 , H01L33/12
摘要： A light emitting chip includes a substrate, a buffer layer formed on the substrate and including a number of horizontally grown nitride nanostructures, a cap layer grows from a top of the nitride nanostructures, and a light emitting structure formed on the cap layer. The light emitting structure sequentially comprises a first semiconductor layer connected to the cap layer, a light emitting layer, and a second semiconductor layer.
摘要翻译：发光芯片包括衬底，形成在衬底上并包括多个水平生长的氮化物纳米结构的缓冲层，帽层从氮化物纳米结构的顶部生长，并且形成在帽层上的发光结构。发光结构依次包括连接到盖层的第一半导体层，发光层和第二半导体层。

26. 发明授权

US08222662B2 LED package structure 失效
标题翻译： LED封装结构
公开(公告)号：US08222662B2
公开(公告)日：2012-07-17
申请号：US12975232
申请日：2010-12-21
申请人： Chia-Hui Shen , Tzu-Chien Hung , Jian-Shihn Tsang
发明人： Chia-Hui Shen , Tzu-Chien Hung , Jian-Shihn Tsang
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/46 , H01L33/486 , H01L33/504 , H01L2224/16
摘要： An LED package structure includes a transparent substrate having a supporting face and a light-emergent face opposite to the supporting face, a housing disposed on the supporting face, two electrodes disposed on the housing, an LED chip disposed on the supporting face and electrically connected to the two electrodes, a reflecting layer covering the LED chip to reflect light emitted by the LED chip toward the transparent substrate, and a phosphor layer formed on the light-emergent face of the substrate. The phosphor layer includes a plurality of layers each having a specific light wavelength conversion range to generate a light with a predetermined color.
摘要翻译： LED封装结构包括具有支撑面和与支撑面相对的出光面的透明基板，设置在支撑面上的壳体，设置在壳体上的两个电极，设置在支撑面上并电连接的LED芯片向两个电极施加覆盖LED芯片以将由LED芯片发射的光反射到透明基板的反射层，以及形成在基板的发光面上的荧光体层。荧光体层包括多个具有特定光波长转换范围的层，以产生具有预定颜色的光。

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