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    • 21. 发明申请
    • LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREOF
    • 发光元件及其制造方法
    • US20070215881A1
    • 2007-09-20
    • US11680354
    • 2007-02-28
    • Yoshiaki YAMAMOTOYoshiharu HIRAKATAJunichiro SAKATAHiroki OHARA
    • Yoshiaki YAMAMOTOYoshiharu HIRAKATAJunichiro SAKATAHiroki OHARA
    • H01L33/00
    • H01L27/156H01L33/30H01L33/62H01L2924/0002H01L2924/00
    • It is an object of the present invention to provide a new light-emitting element and manufacturing method thereof in which actively diffusing a material into a film formation layer is utilized where an interface state and interdiffusion between a compound semiconductor substrate and a film formation layer formed thereover are not considered to be problematic. According to one feature of the present invention, unevenness is formed over the surface of a compound semiconductor substrate through chemical treatment, a compound semiconductor layer is formed over the surface of the compound semiconductor substrate having unevenness, atoms of the compound semiconductor substrate are diffused into the compound semiconductor layer through heat treatment, a first conductive layer is formed over the compound semiconductor substrate, and a second conductive layer is formed over the compound semiconductor layer.
    • 本发明的一个目的是提供一种新的发光元件及其制造方法,其中在形成层间的化合物半导体衬底和成膜层之间的界面状态和相互扩散之间,使材料活性地扩散到成膜层中 这不是有问题的。 根据本发明的一个特征,通过化学处理在化合物半导体衬底的表面上形成凹凸,在具有凹凸的化合物半导体衬底的表面上形成化合物半导体层,化合物半导体衬底的原子扩散到 通过热处理的化合物半导体层,在化合物半导体衬底上形成第一导电层,并且在化合物半导体层上形成第二导电层。