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    • 21. 发明申请
    • Chalcogenide Devices Exhibiting Stable Operation from the As-Fabricated State
    • 从制造国展示稳定运行的硫族化物装置
    • US20100321991A1
    • 2010-12-23
    • US12871975
    • 2010-08-31
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • G11C11/00
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and chalcogenide memory device having less stringent requirements for formation, improved thermal stability and/or faster operation. The chalcogenide materials include materials comprising Ge, Sb and Te in which the Ge and/or Te content is lean relative to the commonly used Ge2Sb2Te5 chalcogenide composition. Electrical devices containing the instant chalcogenide materials show a rapid convergence of the set resistance during cycles of setting and resetting the device from its as-fabricated state, thus leading to a reduced or eliminated need to subject the device to post-fabrication electrical formation prior to end-use operation. Improved thermal stability is manifested in terms of prolonged stability of the resistance of the device at elevated temperatures, which leads to an inhibition of thermally induced setting of the reset state in the device. Significant improvements in the 10 year data retention temperature are demonstrated. Faster device operation is achieved through an increased speed of crystallization, which acts to shorten the time required to transform the chalcogenide material from its reset state to its set state in an electrical memory device.
    • 一种硫族化物材料和硫族化物记忆装置,其对形成,改进的热稳定性和/或更快的操作要求不太严格。 硫属化物材料包括Ge,Sb和Te的材料,其中Ge和/或Te含量相对于通常使用的Ge 2 Sb 2 Te 5硫族化物组合物是稀的。 包含瞬时硫族化物材料的电气装置显示设定循环期间的设定电阻的快速收敛以及将器件从其制造状态复位,从而导致减少或消除了将器件置于后制造电形成之前 最终使用操作。 改进的热稳定性表现在器件在升高的温度下的电阻的延长的稳定性,这导致抑制器件中复位状态的热诱导设置。 展示了10年数据保存温度的显着改进。 通过提高结晶速度实现更快的器件操作,其用于缩短将硫族化物材料从其复位状态转换到其在电存储器件中的设定状态所需的时间。
    • 22. 发明申请
    • Method of restoring variable resistance memory device
    • 可变电阻存储器件的恢复方法
    • US20090109737A1
    • 2009-04-30
    • US11981343
    • 2007-10-31
    • Sergey A. Kostylev
    • Sergey A. Kostylev
    • G11C11/00G11C7/00
    • G11C13/0069G11C13/0004G11C13/0033G11C16/3431G11C2013/0073
    • Methods of programming a phase-change memory device that remedy device failure. The methods includes applying a sequence of two or more electrical energy pulses to the device, where the sequence of pulses includes positive polarity pulses and negative polarity pulses. In one method, two or more pulses of an initial polarity are applied and are followed by one or more pulses having opposite polarity. In another method, pulses of an initial polarity are repeatedly applied until the device fails and one or more pulses of opposite polarity are subsequently applied to restore the device to its initial performance. The pulses may be set pulses, reset pulses, or pulses that produce programmed states having a resistance intermediate between the set resistance and reset resistance of the device.
    • 编程改变设备故障的相变存储器件的方法。 所述方法包括将两个或多个电能脉冲的序列应用于该装置,其中脉冲序列包括正极性脉冲和负极性脉冲。 在一种方法中,施加初始极性的两个或更多个脉冲,并且后跟一个或多个具有相反极性的脉冲。 在另一种方法中,重复施加初始极性的脉冲,直到器件发生故障,并且随后施加相反极性的一个或多个脉冲以将器件恢复到初始性能。 脉冲可以是产生编程状态的脉冲,复位脉冲或脉冲,其具有位于设备的设定电阻和复位电阻之间的电阻。
    • 23. 发明授权
    • Chalcogenide devices and materials having reduced germanium or telluruim content
    • 硫族化物装置和具有降低的锗或碲化物含量的材料
    • US07525117B2
    • 2009-04-28
    • US11301211
    • 2005-12-12
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • Sergey A. KostylevTyler LowreyGuy WickerWolodymyr Czubatyj
    • H01L29/02
    • H01L45/06H01L45/1233H01L45/144H01L45/1625
    • A chalcogenide material and memory device exhibiting fast operation over an extended range of reset state resistances. Electrical devices containing the chalcogenide materials permit rapid transformations from the reset state to the set state for reset and set states having a high resistance ratio. The devices provide for high resistance contrast of memory states while preserving fast operational speeds. The chalcogenide materials include Ge, Sb and Te where the Ge and/or Te content is lean relative to Ge2Sb2Te5. In one embodiment, the concentration of Ge is between 11% and 22%, the concentration of Sb is between 22% and 65%, and the concentration of Te is between 28% and 55%. In a preferred embodiment, the concentration of Ge is between 15% and 18%, the concentration of Sb is between 32% and 35%, and the concentration of Te is between 48% and 51%.
    • 在扩展的复位状态电阻范围内呈现快速操作的硫族化物材料和存储器件。 含有硫族化物材料的电气装置允许从复位状态到设定状态的快速转换以及具有高电阻比的设定状态。 这些器件提供高电阻对比度的存储器状态,同时保持快速的操作速度。 硫族化物材料包括Ge,Sb和Te,其中Ge和/或Te含量相对于Ge 2 Sb 2 Te 5是贫的。 在一个实施方案中,Ge的浓度为11%至22%,Sb的浓度为22%至65%,Te的浓度为28%至55%。 在优选的实施方案中,Ge的浓度为15%至18%,Sb的浓度为32%至35%,Te的浓度为48%至51%。