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21. 发明授权

US07800138B2 Semiconductor device including thermally dissipating dummy pads 有权
标题翻译：包括散热假垫的半导体装置
公开(公告)号：US07800138B2
公开(公告)日：2010-09-21
申请号：US12136608
申请日：2008-06-10
申请人： Joong-Hyun Baek , Sung-Jun Im
发明人： Joong-Hyun Baek , Sung-Jun Im
IPC分类号： H01L27/10 , H01L29/74 , H01L23/02 , H01L23/053 , H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/58 , H01L21/338
CPC分类号： H01L23/522 , H01L23/367 , H01L23/3735 , H01L23/585 , H01L25/0657 , H01L2224/05001 , H01L2224/05009 , H01L2224/05124 , H01L2224/05147 , H01L2224/05568 , H01L2224/0557 , H01L2224/16 , H01L2224/73253 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/15311 , Y10S438/926 , H01L2224/05599
摘要： A semiconductor device capable of improving the efficiency of dispersing heat via a dummy pad. The semiconductor device may be included in a semiconductor package, stack module, card, or system. Also disclosed is a method of manufacturing the semiconductor device. In the semiconductor device, a semiconductor substrate has a first surface and a second surface opposite to the first surface, and at least one conductive pad is arranged on a predetermined region of the first surface. At least one dummy pad is arranged on the first or second surface, and is not electrically coupled to the at least one conductive pad. The dummy pad or pads may be used to disperse heat. Accordingly, it is possible to increase the efficiency of dispersing heat of a semiconductor device, thereby improving the yield of semiconductor devices.
摘要翻译：一种半导体器件，能够提高通过虚拟焊盘分散热的效率。半导体器件可以包括在半导体封装，堆叠模块，卡或系统中。还公开了一种制造半导体器件的方法。在半导体器件中，半导体衬底具有与第一表面相对的第一表面和第二表面，并且至少一个导电焊盘被布置在第一表面的预定区域上。至少一个虚拟焊盘布置在第一或第二表面上，并且不电耦合到至少一个导电焊盘。虚拟垫或垫可用于分散热量。因此，可以提高半导体器件的分散效率，从而提高半导体器件的产量。

22. 发明授权

US08524539B2 Method of manufacturing semiconductor package 有权
标题翻译：制造半导体封装的方法
公开(公告)号：US08524539B2
公开(公告)日：2013-09-03
申请号：US13210607
申请日：2011-08-16
申请人： Hee-Jin Lee , Joong-Hyun Baek
发明人： Hee-Jin Lee , Joong-Hyun Baek
IPC分类号： H01L21/00
CPC分类号： H01L23/4334 , H01L23/3128 , H01L23/3192 , H01L23/3677 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/02166 , H01L2224/0346 , H01L2224/03462 , H01L2224/04042 , H01L2224/05548 , H01L2224/05571 , H01L2224/05647 , H01L2224/0603 , H01L2224/06102 , H01L2224/0615 , H01L2224/06155 , H01L2224/06156 , H01L2224/06519 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48647 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/06589 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1434 , H01L2924/1443 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： Provided are a semiconductor package of a semiconductor chip, a semiconductor module, an electronic system, and methods of manufacturing the same. The method includes mounting a semiconductor chip on a package substrate, forming a molding member on the semiconductor chip, forming via holes penetrating the molding member to expose a portion of a top surface of the semiconductor chip, the via holes being arranged in a lattice shape in a plan view, and forming thermally conductive via plugs in the via holes.
摘要翻译：提供半导体芯片，半导体模块，电子系统的半导体封装及其制造方法。该方法包括将半导体芯片安装在封装基板上，在半导体芯片上形成模制构件，形成穿过模制构件的通孔以暴露半导体芯片的顶表面的一部分，通孔布置成格子状并且在通孔中通过塞子形成热传导。

23. 发明申请

US20130168842A1 INTEGRATED CIRCUIT PACKAGES HAVING REDISTRIBUTION STRUCTURES 有权
标题翻译：具有重新分配结构的集成电路封装
公开(公告)号：US20130168842A1
公开(公告)日：2013-07-04
申请号：US13610077
申请日：2012-09-11
申请人： Chul PARK , Sun-Won Kang , Kil-Soo Kim , Joong-Hyun Baek
发明人： Chul PARK , Sun-Won Kang , Kil-Soo Kim , Joong-Hyun Baek
IPC分类号： H01L23/48
CPC分类号： H01L23/4951 , H01L23/49531 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/48145 , H01L2224/48147 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/4911 , H01L2224/49175 , H01L2225/06506 , H01L2225/06527 , H01L2225/06562 , H01L2924/00014 , H01L2924/19107 , H01L2224/45099 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor package includes a semiconductor chip stack disposed between first and second leads near first and second sides of the package and including a plurality of semiconductor chips, and a redistribution structure disposed on the semiconductor chip stack. At least one semiconductor chip of the semiconductor chip stack includes a plurality of first chip pads disposed near or closer to a third side of the package. The redistribution structure includes a first redistribution pad disposed near or closer to the first side and electrically connected to the first lead, a second redistribution pad disposed near or closer to the second side and electrically connected to the second lead, and a third redistribution pad disposed near or closer to the third side and electrically connected to a first one of the first chip pads and the first redistribution pad.
摘要翻译：半导体封装包括设置在封装的第一和第二侧附近的第一和第二引线之间的半导体芯片堆叠，并且包括多个半导体芯片以及设置在半导体芯片堆叠上的再分配结构。半导体芯片堆叠的至少一个半导体芯片包括设置在封装的第三侧附近或更接近第三侧的多个第一芯片焊盘。再分配结构包括设置在第一侧附近或更靠近第一侧并且电连接到第一引线的第一再分配焊盘，设置在第二侧附近或更靠近第二侧并与第二引线电连接的第二再分配焊盘，以及布置靠近或更靠近第三侧并且电连接到第一芯片焊盘和第一再分布焊盘中的第一芯片焊盘。

24. 发明授权

US08796835B2 Package on package having improved thermal characteristics 有权
标题翻译：封装的封装具有改善的热特性
公开(公告)号：US08796835B2
公开(公告)日：2014-08-05
申请号：US13153953
申请日：2011-06-06
申请人： Yoon-Hoon Kim , Joong-Hyun Baek , Eun-Seok Cho
发明人： Yoon-Hoon Kim , Joong-Hyun Baek , Eun-Seok Cho
IPC分类号： H01L23/02
CPC分类号： H01L23/367 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/07811 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor.
摘要翻译：提供了具有改进的热和电信号传输特性的封装（POP）封装（POP）。 POP可以包括第一半导体封装，大于第一半导体封装并安装在第一半导体封装上的第二半导体封装，以及粘附到第二半导体封装的第二衬底的底部并围绕第二半导体封装的一侧的热块第一个半导体封装。散热片可以是电容器。

25. 发明授权

US07626261B2 Wafer stacked package having vertical heat emission path and method of fabricating the same 有权
标题翻译：具有垂直散热路径的晶片堆叠封装及其制造方法
公开(公告)号：US07626261B2
公开(公告)日：2009-12-01
申请号：US11927457
申请日：2007-10-29
申请人： Joong-Hyun Baek , Hee-Jin Lee
发明人： Joong-Hyun Baek , Hee-Jin Lee
IPC分类号： H01L23/34
CPC分类号： H01L23/427 , H01L23/481 , H01L24/24 , H01L24/82 , H01L24/90 , H01L25/0657 , H01L2224/24145 , H01L2224/73253 , H01L2224/9202 , H01L2225/06541 , H01L2225/06589 , H01L2924/14 , H01L2924/15311
摘要： A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.
摘要翻译：提供具有垂直发热路径的晶片叠层半导体封装（WSP）及其制造方法。 WSP包括其上安装有半导体芯片的基板; 在衬底上垂直堆叠的多个半导体芯片; 在多个半导体芯片中垂直形成的冷却通孔，并密封; 形成在冷却通孔圆周上的微孔; 以及填充冷却通孔内部的冷却剂。因此，WSP降低了半导体芯片之间的温度差，并且迅速消散了堆叠的半导体芯片产生的热量。

26. 发明授权

US06498388B2 Semiconductor module with improved solder joint reliability 失效
公开(公告)号：US06498388B2
公开(公告)日：2002-12-24
申请号：US09995322
申请日：2001-11-26
申请人： Min-Ha Kim , Joong-Hyun Baek
发明人： Min-Ha Kim , Joong-Hyun Baek
IPC分类号： H01L2972
CPC分类号： H01L23/3677 , H01L25/0652 , H01L2224/16 , H01L2924/00014 , H01L2924/16152 , H01L2224/0401
摘要： Provided is a semiconductor memory module including semiconductor devices using solder balls as outer connection terminals, which reduces the deterioration of solder joint reliability (SJR) due to the difference in the thermal expansion coefficients of the module components. The memory module includes a module board, an upper heat sink, a lower heat sink and a linking means. The linking means is formed to have a structure that makes it possible to absorb contraction and expansion within the semiconductor module due to the different thermal expansion coefficients of the upper heat sink, the lower heat sink and the module board.

27. 发明授权

US08456000B2 Semiconductor module and an electronic system including the same 有权
标题翻译：半导体模块和包括其的电子系统
公开(公告)号：US08456000B2
公开(公告)日：2013-06-04
申请号：US12554173
申请日：2009-09-04
申请人： Joong-Hyun Baek
发明人： Joong-Hyun Baek
IPC分类号： H01L23/02 , H01L23/053 , H01L23/12 , H01L23/34 , H01L23/04 , H02B1/00 , H05K7/00 , H05K1/00 , H05K1/18 , H05K1/11 , H05K1/14
CPC分类号： H01L23/467 , H01L23/5385 , H01L25/18 , H01L2224/16225 , H01L2224/73253 , H01L2225/06579 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/09701 , H01L2924/15311 , H01L2924/16152 , H01L2924/16251 , H01L2924/3011 , H05K1/141 , H05K1/144 , H05K1/147 , H05K1/189 , H05K3/0061 , H05K2201/046 , H05K2201/056 , H05K2201/10159 , H05K2201/10734 , H01L2224/0401
摘要： A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module.
摘要翻译：提供了三维半导体模块和包括该三维半导体模块的电子系统。半导体模块包括模块衬底，形成在模块衬底的一部分上的逻辑器件和形成在模块衬底的另一部分上的多个存储器件，其中多个存储器件垂直于逻辑器件设置，以及其上形成有多个存储器件的模块衬底由支撑件支撑。电子系统包括半导体模块。

28. 发明授权

US08344601B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08344601B2
公开(公告)日：2013-01-01
申请号：US12691156
申请日：2010-01-21
申请人： Joong-Hyun Baek , Hee-Jin Lee
发明人： Joong-Hyun Baek , Hee-Jin Lee
IPC分类号： H01J1/02
CPC分类号： H01L33/647 , G02B6/0023 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01066 , H01L2924/00014
摘要： A light emitting device with improved heat dissipation is provided. The light emitting device includes a first lead frame, a second lead frame, a light emitting element and a housing. The first lead frame includes a light emitting element mounting portion, a first heat dissipation portion extending from the light emitting element mounting portion in a first direction, and second and third heat dissipation portions extending from the light emitting element mounting portion in a second direction opposite to the first direction. The second lead frame extends in the second direction and is disposed between and spaced apart from the second and third heat dissipation portions. The light emitting element is mounted on the light emitting element mounting portion and is electrically coupled to the first and second lead frames. The housing encapsulates the first and second lead frames. The second and third heat dissipation portions have a first width and the second lead frame has a second width the same as or different from the first width.
摘要翻译：提供了具有改善的散热的发光装置。发光器件包括第一引线框架，第二引线框架，发光元件和壳体。第一引线框架包括发光元件安装部分，从第一方向从发光元件安装部分延伸的第一散热部分和从发光元件安装部分沿相反的第二方向延伸的第二和第三散热部分到第一个方向。第二引线框架沿第二方向延伸并且设置在第二和第三散热部分之间并与第二和第三散热部分间隔开。发光元件安装在发光元件安装部分上并且电耦合到第一引线框架和第二引线框架。壳体封装第一和第二引线框架。第二和第三散热部分具有第一宽度，第二引线框架具有与第一宽度相同或不同的第二宽度。

29. 发明授权

US08049329B2 Wafer stacked package waving bertical heat emission path and method of fabricating the same 有权
标题翻译：晶圆叠层包装挥发热发射路径及其制造方法
公开(公告)号：US08049329B2
公开(公告)日：2011-11-01
申请号：US12581920
申请日：2009-10-20
申请人： Joong-Hyun Baek , Hee-Jin Lee
发明人： Joong-Hyun Baek , Hee-Jin Lee
IPC分类号： H01L23/34
CPC分类号： H01L23/427 , H01L23/481 , H01L24/24 , H01L24/82 , H01L24/90 , H01L25/0657 , H01L2224/24145 , H01L2224/73253 , H01L2224/9202 , H01L2225/06541 , H01L2225/06589 , H01L2924/14 , H01L2924/15311
摘要： A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.
摘要翻译：提供具有垂直发热路径的晶片叠层半导体封装（WSP）及其制造方法。 WSP包括其上安装有半导体芯片的基板; 在衬底上垂直堆叠的多个半导体芯片; 在多个半导体芯片中垂直形成的冷却通孔，并密封; 形成在冷却通孔圆周上的微孔; 并且冷却剂填充在冷却通孔的内部。因此，WSP降低了半导体芯片之间的温度差，并且迅速消散了堆叠的半导体芯片产生的热量。

30. 发明授权

US07812445B2 Semiconductor memory module having an oblique memory chip 失效
标题翻译：具有倾斜存储芯片的半导体存储模块
公开(公告)号：US07812445B2
公开(公告)日：2010-10-12
申请号：US11740821
申请日：2007-04-26
申请人： Joong-Hyun Baek , Sun-Won Kang , Moon-Jung Kim , Hyung-Gil Baek , Hee-Jin Lee
发明人： Joong-Hyun Baek , Sun-Won Kang , Moon-Jung Kim , Hyung-Gil Baek , Hee-Jin Lee
IPC分类号： H01L23/34
CPC分类号： H01L25/16 , G11C5/04 , H01L21/563 , H01L25/0655 , H01L2224/73203 , H05K1/181 , H05K2201/09409 , H05K2201/09418 , H05K2201/10159 , Y02P70/611
摘要： Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.
摘要翻译：提供了一种半导体存储器模块，其允许形成在模块基板和安装在模块基板上的存储芯片之间的填充构件完全填充模块基板和存储器芯片之间的空间。根据本发明的实施例，半导体存储器模块包括具有安装在基板上的至少一个存储芯片的模块基板，使得其边缘对于将模块基板平分的主轴和短轴倾斜。倾斜方向允许在基板上形成的存储芯片之间的开口改善，使得填充构件可以适当地形成在模块基板和存储芯片之间，以防止填充构件未形成的空隙。

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