专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20170178992A1 ELECTRONIC COMPONENT PACKAGE 审中-公开
公开(公告)号：US20170178992A1
公开(公告)日：2017-06-22
申请号：US15205483
申请日：2016-07-08
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Won JEONG , Ji Hoon KIM , Sun Ho KIM , Shang Hoon SEO , Seung Yeop KOOK , Christian ROMERO
IPC分类号： H01L23/31 , H01L23/00 , H01L23/48
CPC分类号： H01L23/3157 , H01L23/295 , H01L23/3135 , H01L23/481 , H01L23/552 , H01L23/562 , H01L24/10 , H01L24/20 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2225/00 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/1432 , H01L2924/14335 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H01L2924/3512
摘要： An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having a component disposition region defined by an inner wall of the frame surrounding the electronic component, and an encapsulant filling at least a portion of the component disposition region. A portion of the inner wall of the frame forms a protrusion protruding toward the electronic component.

22. 发明申请

US20170125318A1 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20170125318A1
公开(公告)日：2017-05-04
申请号：US15192634
申请日：2016-06-24
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kyoung Moo HARR , Ji Hoon KIM , Kyung Seob OH , Sun Ho KIM
IPC分类号： H01L23/31 , H01L21/56 , H01L23/00 , H01L23/29 , H01L23/48
CPC分类号： H01L24/16 , H01L23/3128 , H01L23/3677 , H01L23/481 , H01L23/49827 , H01L23/552 , H01L24/19 , H01L24/20 , H01L29/0657 , H01L2224/04105 , H01L2224/12105 , H01L2924/3025 , H01L2924/3512
摘要： An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.

23. 发明申请

US20150153870A1 TOUCHSCREEN DEVICE AND METHOD OF SENSING TOUCH 审中-公开
标题翻译：触摸屏设备和感应触摸方法
公开(公告)号：US20150153870A1
公开(公告)日：2015-06-04
申请号：US14164644
申请日：2014-01-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyun Suk LEE , Ji Hoon KIM , Na Rae PARK
IPC分类号： G06F3/044
CPC分类号： G06F3/044 , G06F3/0416
摘要： There are provided a touchscreen device and a method of sensing a touch. The touchscreen device includes: a subtraction unit, for all sensing signals acquired from a plurality of electrodes, obtaining differences in levels between the sensing signals acquired from two adjacent electrodes; a region determination unit determining touched regions and untouched regions based on difference signals generated in the subtraction unit; an average unit calculating an average of levels of the sensing signals generated in the plurality of electrodes determined as the untouched regions to generate a noise estimation signal; and a noise removal unit subtracting a level of the noise estimation signal from the levels of the sensing signals.
摘要翻译：提供了触摸屏设备和感测触摸的方法。触摸屏设备包括：减法单元，用于从多个电极获取的所有感测信号，获得从两个相邻电极获取的感测信号之间的电平差; 区域确定单元，基于在减法单元中生成的差异信号来确定触摸区域和未触摸区域; 平均单元，计算在被确定为未触摸区域的多个电极中产生的感测信号的电平的平均值，以产生噪声估计信号; 以及噪声去除单元，从感测信号的电平中减去噪声估计信号的电平。

24. 发明申请

US20150042367A1 THICKNESS MEASUREMENT DEVICE AND METHOD FOR MEASURING THICKNESS 审中-公开
标题翻译：厚度测量装置和测量厚度的方法
公开(公告)号：US20150042367A1
公开(公告)日：2015-02-12
申请号：US14331168
申请日：2014-07-14
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ji Hoon KIM , Sung Yeol Park
IPC分类号： G01B7/06
CPC分类号： G01B7/06
摘要： Disclosed herein are a thickness measurement device and a method for measuring a thickness. The thickness measurement device includes: a four-terminal probe including a first probe through a fourth probe which are in contact with a metal film; a contact pressure controlling unit each controlling the first probe through the fourth probe so that the metal film and the first probe through the fourth probe have the same contact pressure; a current supplying unit supplying a current to the four-terminal probe; a voltage measuring unit measuring a voltage across the four-terminal probe; and a thickness calculating unit calculating a thickness of the metal film using a current value supplied from the current supplying unit and a voltage value measured by the voltage measuring unit.
摘要翻译：这里公开了厚度测量装置和厚度测量方法。厚度测量装置包括：四端子探针，其包括与金属膜接触的通过第四探针的第一探针; 接触压力控制单元，其每个通过第四探针控制第一探针，使得金属膜和通过第四探针的第一探针具有相同的接触压力; 电流供给单元，向四端子探头供给电流; 测量四端子探头两端的电压的电压测量单元; 以及厚度计算单元，使用从电流供给单元提供的电流值和由电压测量单元测量的电压值来计算金属膜的厚度。

25. 发明申请

US20140354569A1 MOBILE PHONE CAPABLE OF SEPARATING SCREEN AND CONTROLLING METHOD THEREOF 审中-公开
标题翻译：可分离屏幕的移动电话及其控制方法
公开(公告)号：US20140354569A1
公开(公告)日：2014-12-04
申请号：US14291961
申请日：2014-05-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Yoon Seok OH , Dae Gil YOON , Ji Hoon KIM , Sang Hyun SIM
IPC分类号： G06F3/0488 , G06F3/041
CPC分类号： G06F3/04886 , G06F3/04883 , G06F2203/04803
摘要： Embodiments of the invention provide a mobile phone configured to separate a screen. The mobile phone includes a touch screen configured to display an execution screen of a predetermined application thereon and further configured to sense a touch input by a gesture of a user. The mobile phone further includes a touch input processor configured to measure an X-axis line value and a Y-axis line value of a touch region by the touch input and further configured to determine whether the touch input is an input for separating the screen. Further, the mobile phone includes a controller configured to determine a separation axis of the screen and further configured to separate the screen into one or more regions based on the separation axis when the touch input is determined as the input for separating the screen.
摘要翻译：本发明的实施例提供一种被配置为分离屏幕的移动电话。移动电话包括被配置为在其上显示预定应用的执行屏幕的触摸屏，并且还被配置为通过用户的手势来感测触摸输入。移动电话还包括触摸输入处理器，其被配置为通过触摸输入来测量触摸区域的X轴线值和Y轴线值，并且还被配置为确定触摸输入是否是用于分离屏幕的输入。此外，移动电话包括控制器，其被配置为确定屏幕的分离轴，并且还被配置为当触摸输入被确定为用于分离屏幕的输入时，基于分离轴将屏幕分离成一个或多个区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式