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21. 发明授权

US07416972B2 Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion 有权
标题翻译：制造具有降低的热膨胀的相同的低吸湿电路化子串的方法
公开(公告)号：US07416972B2
公开(公告)日：2008-08-26
申请号：US11730942
申请日：2007-04-05
申请人： Robert M. Japp , Irving Memis , Kostas I. Papathomas
发明人： Robert M. Japp , Irving Memis , Kostas I. Papathomas
IPC分类号： H01L21/4763
CPC分类号： H01L23/3735 , H01L23/145 , H01L23/3733 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2224/16225 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068
摘要： A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof.
摘要翻译：一种制造电路化基板的方法，所述电路化基板包括复合层，所述复合层包括具有低热膨胀系数的多个纤维的第一介电子层和低吸湿性树脂的第二介电子层，所述第二介电子层不包括连续或半连续纤维等作为其一部分。衬底还包括至少一个作为其一部分的导电层。

22. 发明申请

US20120012553A1 METHOD OF FORMING FIBROUS LAMINATE CHIP CARRIER STRUCTURES 审中-公开
标题翻译：形成薄片层状载体结构的方法
公开(公告)号：US20120012553A1
公开(公告)日：2012-01-19
申请号：US12837584
申请日：2010-07-16
申请人： Robert M. Japp , Kostas I. Papathomas , Cheryl Palomaki
发明人： Robert M. Japp , Kostas I. Papathomas , Cheryl Palomaki
IPC分类号： B32B38/10 , C23F1/02
CPC分类号： H05K1/0366 , B32B37/02 , B32B2309/105 , B32B2457/08 , H05K3/42 , H05K2201/0293 , H05K2201/0358 , H05K2203/063 , Y10T156/1062
摘要： A method for making a leadless chip carrier (LCC) for use in electronic packages having a core layer stripped of copper cladding, containing drilled clearance holes within, a layer of resin coated copper (RCC) placed on the upper surface of the core layer and a second layer of RCC placed on the lower surface of the core layer. The layers are laminated together with the RCC filling the clearance holes during lamination. A pattern is etched on the RCC and vias are drilled through the filled clearance holes and pre-plated with seed copper layers. The seed copper layers in the vias are then covered by a layer of copper plating to meet the requirements of the core buildup layer, and resin inhibiting conductive anodic filament (CAF) growth within the structure.
摘要翻译：一种制造用于电子封装的无引线芯片载体（LCC）的方法，所述无引线芯片载体（LCC）具有剥离铜包层的芯层，其中包含钻孔的间隙孔，放置在芯层的上表面上的树脂涂覆铜层（RCC），以及第二层RCC放置在芯层的下表面上。层压在一起，RCC在层压期间填充间隙孔。在RCC上蚀刻图案，并且通过填充的间隙孔钻出通孔并且预镀有种子铜层。然后通孔中的种子铜层被镀铜层覆盖以满足堆芯层的要求，并且在结构内树脂抑制导电阳极丝（CAF）生长。

23. 发明申请

US20110207866A1 Halogen-Free Dielectric Composition For use As Dielectric Layer In Circuitized Substrates 审中-公开
标题翻译：无卤素介电组合物用作电路基板中的介电层
公开(公告)号：US20110207866A1
公开(公告)日：2011-08-25
申请号：US12712238
申请日：2010-02-25
申请人： Robert M. Japp , Kostas I. Papathomas
发明人： Robert M. Japp , Kostas I. Papathomas
IPC分类号： C08K5/07
CPC分类号： H01L23/145 , C08K5/0008 , H01L23/49894 , H01L2924/0002 , H05K1/0326 , H05K1/0353 , H05K2201/012 , H05K2201/0129 , H05K2201/0209 , H05K2201/0239 , H01L2924/00
摘要： A dielectric composition for forming a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. The composition includes at least three resins: a halogen-free flame retardant, methyl ethyl ketone (prior to final layer formation), manganese octoate, and a coupling agent. The composition does not include a halogen or a fluoropolymer as part thereof. Dielectric layers formed from the composition are capable of withstanding the relatively high temperatures associated with lead-free solder applications. The composition may or may not include inorganic filler as part thereof.
摘要翻译：用于形成电介质层的电介质组合物，可用于诸如PCB，芯片载体等的电路化基板中。该组合物包括至少三种树脂：无卤阻燃剂，甲基乙基酮（最终层形成之前），辛酸锰和偶联剂。该组合物不包括卤素或含氟聚合物作为其一部分。由组合物形成的介电层能够承受与无铅焊料应用相关的相对较高的温度。组合物可以包括或可以不包括作为其一部分的无机填料。

24. 发明授权

US07470990B2 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same 有权
标题翻译：具有减少的热膨胀的低吸湿电路化基板，制造方法，使用它的电组件以及利用它的信息处理系统
公开(公告)号：US07470990B2
公开(公告)日：2008-12-30
申请号：US11086323
申请日：2005-03-23
申请人： Robert M. Japp , Irving Memis , Kostas I. Papathomas
发明人： Robert M. Japp , Irving Memis , Kostas I. Papathomas
IPC分类号： H01L23/52
CPC分类号： H01L23/3735 , H01L23/145 , H01L23/3733 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2224/16225 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068
摘要： A circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof. An electrical assembly and a method of making the substrate are also provided, as is an information handling system (e.g., computer) incorporating the circuitized substrate of the invention as part thereof.
摘要翻译：一种电路化基板，包括复合层，所述复合层包括第一介电子层，所述第一介电子层包括具有低热膨胀系数的多个纤维和低吸湿性树脂的第二介电子层，所述第二介电子层不包括连续的或半连续纤维等作为其一部分。衬底还包括至少一个作为其一部分的导电层。还提供电气组件和制造基板的方法，如本发明的电路化基板作为其一部分的信息处理系统（例如，计算机）。

25. 发明授权

US06199751B1 Polymer with transient liquid phase bondable particles 失效
标题翻译：具有瞬态液相可粘结颗粒的聚合物
公开(公告)号：US06199751B1
公开(公告)日：2001-03-13
申请号：US09533196
申请日：2000-03-23
申请人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K2000
CPC分类号： H01L24/31 , B23K35/0244 , B23K35/26 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K3/321 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , H01L2924/00 , H01L2924/00014
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译：提供了在两个表面上的焊盘之间形成冶金结合的技术。放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。第一和第二种金属包括低熔点成分。两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。核心金属和涂覆金属一起包括低熔点成分。以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相材料和贱金属进入涂料。

26. 发明授权

US5656862A Solder interconnection structure 失效
标题翻译：焊接互连结构
公开(公告)号：US5656862A
公开(公告)日：1997-08-12
申请号：US59003
申请日：1993-05-06
申请人： Kostas I. Papathomas , David Wei Wang
发明人： Kostas I. Papathomas , David Wei Wang
IPC分类号： H01L21/56 , H01L21/60 , H01L23/29 , H05K3/28 , H05K3/34 , H01L23/48 , H01L29/40 , H01L39/02
CPC分类号： H01L24/81 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2224/81801 , H01L2224/83856 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K3/284 , H05K3/285 , H05K3/3431 , Y10T428/31504 , Y10T428/31547
摘要： Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
摘要翻译：焊接互连密封剂，封装结构及其制造和使用方法，由此通过固化含有脂环族聚环氧化物和/或可固化氰酸酯的制剂获得的组合物填充载体基底和半导体器件之间的焊料连接所产生的间隙，或其预聚物; 填料，例如氮化铝或氧化铝填料，其最大粒度为31微米。

27. 发明授权

US5089440A Solder interconnection structure and process for making 失效
标题翻译：焊接互连结构及制造工艺
公开(公告)号：US5089440A
公开(公告)日：1992-02-18
申请号：US624973
申请日：1990-12-10
申请人： Frederick R. Christie , Kostas I. Papathomas , David W. Wang
发明人： Frederick R. Christie , Kostas I. Papathomas , David W. Wang
IPC分类号： H01L21/56 , H01L21/60 , H01L23/29 , H05K3/28 , H05K3/34
CPC分类号： H01L24/81 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/284 , H05K3/285 , H05K3/3431 , Y10T29/49146
摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
摘要翻译：焊接互连，由此通过固化含有脂环族聚环氧化物和/或可固化的氰酸酯或其预聚物的制剂获得的组合物填充由载体基底和半导体器件之间的焊料连接所产生的间隙; 填料的最大粒度为31微米，至少基本上不含α粒子的排放。

28. 发明授权

US07541265B2 Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate 有权
标题翻译：用于电路化基板的电容器材料，利用其的电路化基板，制造所述电路化基板的方法和利用所述电路化基板的信息处理系统
公开(公告)号：US07541265B2
公开(公告)日：2009-06-02
申请号：US11031085
申请日：2005-01-10
申请人： Rabindra N. Das , John M. Lauffer , Kostas I. Papathomas , Mark D. Poliks
发明人： Rabindra N. Das , John M. Lauffer , Kostas I. Papathomas , Mark D. Poliks
IPC分类号： H01L21/425
CPC分类号： H05K1/162 , H01L23/49822 , H01L2224/16 , H01L2224/16235 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01087 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K3/0023 , H05K2201/0187 , H05K2201/0209 , H05K2201/0257 , H05K2201/09509 , H05K2201/09718 , H01L2224/0401
摘要： A material for use as part of an internal capacitor within a circuitized substrate includes a polymer (e.g., a cycloaliphatic epoxy or phenoxy based) resin and a quantity of nano-powders of ferroelectric ceramic material (e.g., barium titanate) having a particle size substantially in the range of from about 0.01 microns to about 0.90 microns and a surface area for selected ones of said particles within the range of from about 2.0 to about 20 square meters per gram. A circuitized substrate adapted for using such a material and capacitor therein and a method of making such a substrate are also provided. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) are also provided.
摘要翻译：用作电路化衬底内的内部电容器的一部分的材料包括聚合物（例如，脂环族环氧基或苯氧基）树脂和一定量的具有大体粒度的铁电陶瓷材料（例如钛酸钡）的纳米粉末在约0.01微米至约0.90微米的范围内，并且所述颗粒中所选颗粒的表面积在约2.0至约20平方米/克的范围内。还提供了适于在其中使用这种材料和电容器的电路化基板和制造这种基板的方法。还提供电气组件（基板和至少一个电气部件）和信息处理系统（例如，个人计算机）。

29. 发明授权

US6087021A Polymer with transient liquid phase bondable particles 失效
标题翻译：具有瞬态液相可粘结颗粒的聚合物
公开(公告)号：US6087021A
公开(公告)日：2000-07-11
申请号：US86399
申请日：1998-05-28
申请人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
发明人： Michael A. Gaynes , Kostas I. Papathomas , Giana M. Phelan , Charles G. Woychik
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L21/60 , H05K3/32 , B22F7/00
CPC分类号： H01L24/31 , B23K35/0244 , H01L24/29 , H01L24/83 , H05K3/321 , B23K35/26 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译：提供了在两个表面上的焊盘之间形成冶金结合的技术。放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。第一和第二种金属包括低熔点成分。两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。核心金属和涂覆金属一起包括低熔点成分。以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相材料和贱金属进入涂料。

30. 发明授权

US5637442A Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol 失效
标题翻译：用于处理含有抗蚀剂或焊接掩模和γ-丁内酯或苄醇的光刻显影剂和汽提废料流的方法
公开(公告)号：US5637442A
公开(公告)日：1997-06-10
申请号：US554639
申请日：1995-11-06
申请人： Anilkumar C. Bhatt , Gary S. Ksenak , Kostas I. Papathomas , James A. Shurtleff , Jerome J. Wagner
发明人： Anilkumar C. Bhatt , Gary S. Ksenak , Kostas I. Papathomas , James A. Shurtleff , Jerome J. Wagner
IPC分类号： G03F7/32 , G03F7/42 , B01D53/72 , B01D53/14 , G03F7/30
CPC分类号： G03F7/422 , G03F7/325 , G03F7/425 , Y10S210/908 , Y10S210/909
摘要： A method is disclosed for using the simple, environmentally friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.
摘要翻译：公开了一种使用简单的，环境友好的有机化合物γ-丁内酯和苄醇来开发和剥离自由基引发的可加成聚合抗蚀剂，阳离子固化的抗蚀剂和焊接掩模和Vacrel光致抗蚀剂的方法。在所有情况下，显影剂和脱模剂包括γ-丁内酯或苄醇。显影剂和脱模剂任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。在光刻图案的抗蚀剂或焊接掩模的显影期间，未聚合的区域溶解在所公开的显影剂中。在剥离抗蚀剂或焊接掩模期间，聚合区域从公开的剥离器中的电路板脱粘。在除去显影剂和剥离剂之后，从印刷电路封装中冲洗抗蚀剂或焊料掩模的任何残留单体或聚合物以及残留的显影溶液和剥离溶液。还公开了一种用于处理活性生物质中的组合的显影剂和汽提漂洗废液以减少显影剂/汽提器/抗蚀剂/阻燃剂/焊料掩模废物流的生物需氧量的方法。

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